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1.发明授权公开(公告)号：US09888569B2
公开(公告)日：2018-02-06
申请号：US14432278
申请日：2013-10-04
Applicant: LG INNOTEK CO., LTD.
Inventor： Sang Myung Lee , Byeong Ho Kim , Jae Seok Park , Yeong Uk Seo , Hyun Seok Seo , Chang Woo Yoo , Kyu Won Lee
CPC classification number: H05K1/0346 , H05K1/0298 , H05K1/0366 , H05K1/0373 , H05K1/115 , H05K1/119 , H05K3/0032 , H05K3/107 , H05K3/4007 , H05K3/465 , H05K2201/0367 , H05K2201/096 , H05K2203/041
Abstract: A printed circuit board includes a core insulating layer including an isotropic resin, a first circuit pattern filled in a circuit pattern groove at an upper portion or a lower portion of the core insulating layer, a first insulating layer provided in a top surface thereof with a circuit pattern groove and covering the first circuit pattern, and a second circuit pattern to fill the circuit pattern groove of the first insulating layer. A material, such as polyimide, having an isotropic structure is employed for the core insulating layer, thereby preventing the substrate from being bent without glass fiber. Since the glass fiber is not included, the buried pattern is formed at the upper portion or the lower portion of the core insulating layer, so that the thin substrate is fabricated.
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公开(公告)号：US09433107B2
公开(公告)日：2016-08-30
申请号：US14365920
申请日：2012-12-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Hyun Seok Seo , Ki Do Chun , Sang Myung Lee , Yeong Uk Seo , Chang Woo Yoo , Byeong Ho Kim
CPC classification number: H05K3/4644 , H05K1/0298 , H05K1/09 , H05K1/115 , H05K3/06 , H05K3/465 , H05K2201/0376 , H05K2201/09781 , H05K2201/10204 , H05K2203/0353
Abstract: Provided is a printed circuit board, including a plurality of buried circuit patterns which are formed in an active area; and a plurality of buried dummy patterns which are uniformly formed in a dummy area except the active area. Thus, since when the circuit patterns are formed, the dummy patterns are also uniformly formed, a difference in plating can be reduced. Also, since the dummy patterns are uniformly formed in the dummy area, a difference in grinding between the dummy area and the active area can be reduced, thereby enabling the circuit patterns to be formed in the active area without the occurrence of over-grinding.
Abstract translation: 提供一种印刷电路板，包括形成在有源区域中的多个掩埋电路图案; 以及均匀地形成在除了有效区域之外的虚拟区域中的多个埋置的虚设图案。 因此，由于当形成电路图案时，也可以均匀地形成虚设图案，可以减少电镀差异。 此外，由于虚拟图案均匀地形成在虚拟区域中，所以可以减少虚设区域和有效区域之间的磨削差异，从而能够在有源区域中形成电路图案而不会发生过磨削。
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公开(公告)号：US09642246B2
公开(公告)日：2017-05-02
申请号：US14385156
申请日：2013-03-14
Applicant: LG INNOTEK CO., LTD.
Inventor： Myoung Hwa Nam , Byeong Ho Kim , Yeong Uk Seo , Hyun Seok Seo , Chang Woo Yoo , Sang Myung Lee
CPC classification number: H05K1/0306 , H05K1/0296 , H05K1/0366 , H05K1/0373 , H05K1/115 , H05K3/4602 , H05K3/465 , H05K2201/09563 , H05K2201/096 , H05K2201/09854
Abstract: A printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a second circuit pattern groove at a top surface thereof; and a second circuit pattern filling the second circuit pattern groove of the second insulating layer, wherein the first insulating layer includes a resin material and a filler distributed in the resin material. Accordingly, a total thickness of the PCB can be thinly formed while maintaining the stiffness by separately forming a thin insulating layer without a glass fiber for the buried pattern on the core insulating layer.
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公开(公告)号：US20150041184A1
公开(公告)日：2015-02-12
申请号：US14385156
申请日：2013-03-14
Applicant: LG INNOTEK CO., LTD.
Inventor： Myoung Hwa Nam , Byeong Ho Kim , Yeong Uk Seo , Hyun Seok Seo , Chang Woo Yoo , Sang Myung Lee
CPC classification number: H05K1/0306 , H05K1/0296 , H05K1/0366 , H05K1/0373 , H05K1/115 , H05K3/4602 , H05K3/465 , H05K2201/09563 , H05K2201/096 , H05K2201/09854
Abstract: A printed circuit board includes: a core insulating layer including a glass fiber; a first insulating layer on an upper portion or a lower portion of the core insulating layer, the first insulating layer including a first circuit pattern groove; a first circuit pattern filling the first circuit pattern groove of the first insulating layer; a second insulating layer covering the first circuit pattern and including a second circuit pattern groove at a top surface thereof; and a second circuit pattern filling the second circuit pattern groove of the second insulating layer, wherein the first insulating layer includes a resin material and a filler distributed in the resin material. Accordingly, a total thickness of the PCB can be thinly formed while maintaining the stiffness by separately forming a thin insulating layer without a glass fiber for the buried pattern on the core insulating layer.
Abstract translation: 印刷电路板包括：包含玻璃纤维的芯绝缘层; 在所述芯绝缘层的上部或下部的第一绝缘层，所述第一绝缘层包括第一电路图案槽; 填充所述第一绝缘层的所述第一电路图案槽的第一电路图案; 覆盖所述第一电路图案的第二绝缘层，并且在其顶表面包括第二电路图案槽; 以及填充所述第二绝缘层的所述第二电路图案槽的第二电路图案，其中所述第一绝缘层包括树脂材料和分布在所述树脂材料中的填料。 因此，通过在芯绝缘层上分别形成用于掩埋图案的玻璃纤维的薄绝缘层，可以在保持刚度的同时，轻薄地形成PCB的总厚度。
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Patent Agency Ranking
公开(公告)号：US09549465B2
公开(公告)日：2017-01-17
申请号：US14365897
申请日：2012-12-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Woo Yoo , Yeong Uk Seo , Byeong Ho Kim , Hyun Seok Seo , Sang Myung Lee , Ki Do Chun
CPC classification number: H05K1/0298 , H05K3/06 , H05K3/465 , H05K2201/0376 , H05K2203/0353
Abstract: Provided are a printed circuit board and a method of manufacturing the same, the printed circuit board according to the present invention, the printed circuit board, including: an insulating substrate having a plurality of circuit pattern grooves formed on a surface thereof; and a plurality of circuit patterns formed by burying the circuit pattern grooves, wherein the circuit patterns protrude as much as a predetermined thickness from an upper surface of the insulating substrate.
Abstract translation: 提供一种印刷电路板及其制造方法，根据本发明的印刷电路板，印刷电路板包括：绝缘基板，其表面上形成有多个电路图案槽; 以及通过掩埋电路图案凹槽形成的多个电路图案，其中电路图案从绝缘基板的上表面突出多达预定厚度。
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公开(公告)号：US20150257262A1
公开(公告)日：2015-09-10
申请号：US14432278
申请日：2013-10-04
Applicant: LG INNOTEK CO., LTD.
Inventor： Sang Myung Lee , Byeong Ho Kim , Jae Seok Park , Yeong Uk Seo , Hyun Seok Seo , Chang Woo Yoo , Kyu Won Lee
CPC classification number: H05K1/0346 , H05K1/0298 , H05K1/0366 , H05K1/0373 , H05K1/115 , H05K1/119 , H05K3/0032 , H05K3/107 , H05K3/4007 , H05K3/465 , H05K2201/0367 , H05K2201/096 , H05K2203/041
Abstract: A printed circuit board includes a core insulating layer including an isotropic resin, a first circuit pattern filled in a circuit pattern groove at an upper portion or a lower portion of the core insulating layer, a first insulating layer provided in a top surface thereof with a circuit pattern groove and covering the first circuit pattern, and a second circuit pattern to fill the circuit pattern groove of the first insulating layer. A material, such as polyimide, having an isotropic structure is employed for the core insulating layer, thereby preventing the substrate from being bent without glass fiber. Since the glass fiber is not included, the buried pattern is formed at the upper portion or the lower portion of the core insulating layer, so that the thin substrate is fabricated.
Abstract translation: 一种印刷电路板包括：包含各向同性树脂的芯绝缘层，填充在芯绝缘层的上部或下部的电路图形槽中的第一电路图案，在其顶表面上设置有第一绝缘层， 电路图案槽并覆盖第一电路图案，以及第二电路图案，以填充第一绝缘层的电路图案槽。 对于芯绝缘层使用具有各向同性结构的材料，例如聚酰亚胺，从而防止基板在没有玻璃纤维的情况下弯曲。 由于不包括玻璃纤维，因此在芯绝缘层的上部或下部形成掩埋图案，从而制造薄基板。
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7.发明授权Method and device of manufacturing printed circuit board having a solid component 有权制造具有固体成分的印刷电路板的方法和装置公开(公告)号：US09585258B2
公开(公告)日：2017-02-28
申请号：US14365540
申请日：2012-12-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Yeong Uk Seo , Ki Do Chun , Chang Woo Yoo , Hyun Seok Seo , Byeong Ho Kim , Sang Myung Lee
CPC classification number: H05K3/067 , H05K1/0298 , H05K1/03 , H05K1/0366 , H05K1/0373 , H05K3/0026 , H05K3/06 , H05K3/465 , H05K2201/0376 , H05K2201/09036 , H05K2203/0353 , Y10T29/49156
Abstract: Provided is a method of manufacturing a printed circuit board, the method including: preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer in which the circuit pattern groove is buried; and forming a buried circuit pattern by removing the plated layer until the insulating layer is exposed, wherein the solid component has a diameter of less than 5% to a width of the buried circuit pattern. Thus, as a filler of a predetermined size or less is applied into the insulating layer for forming the circuit pattern, the occurrence of a void due to separation of the filler from a boundary part with the circuit pattern can be reduced, and reliability can be also secured.
Abstract translation: 提供一种制造印刷电路板的方法，所述方法包括：制备包括其中浸渍有固体组分的树脂材料的绝缘基材; 通过蚀刻绝缘基板的上表面在树脂材料上形成电路图案槽; 形成电路图形凹槽埋入的镀层; 以及通过去除所述镀层直到所述绝缘层露出来形成掩埋电路图案，其中所述固体组分的直径小于所述掩埋电路图案的宽度的5％。 因此，作为形成电路图案的绝缘层中施加预定尺寸以下的填料，可以减少由于填充物与电路图案的边界部分分离导致的空隙的发生，可靠性可以 也保证。
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公开(公告)号：US20140345913A1
公开(公告)日：2014-11-27
申请号：US14365540
申请日：2012-12-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Yeong Uk Seo , Ki Do Chun , Chang Woo Yoo , Hyun Seok Seo , Byeong Ho Kim , Sang Myung Lee
CPC classification number: H05K3/067 , H05K1/0298 , H05K1/03 , H05K1/0366 , H05K1/0373 , H05K3/0026 , H05K3/06 , H05K3/465 , H05K2201/0376 , H05K2201/09036 , H05K2203/0353 , Y10T29/49156
Abstract: Provided is a method of manufacturing a printed circuit board, the method including: preparing an insulating substrate including a resin material in which a solid component is impregnated; forming a circuit pattern groove on the resin material by etching an upper surface of the insulating substrate; forming a plated layer in which the circuit pattern groove is buried; and forming a buried circuit pattern by removing the plated layer until the insulating layer is exposed, wherein the solid component has a diameter of less than 5% to a width of the buried circuit pattern. Thus, as a filler of a predetermined size or less is applied into the insulating layer for forming the circuit pattern, the occurrence of a void due to separation of the filler from a boundary part with the circuit pattern can be reduced, and reliability can be also secured.
Abstract translation: 提供一种制造印刷电路板的方法，所述方法包括：制备包括其中浸渍有固体组分的树脂材料的绝缘基材; 通过蚀刻绝缘基板的上表面在树脂材料上形成电路图案槽; 形成电路图形凹槽埋入的镀层; 以及通过去除所述镀层直到所述绝缘层露出来形成掩埋电路图案，其中所述固体组分的直径小于所述掩埋电路图案的宽度的5％。 因此，作为形成电路图案的绝缘层中施加预定尺寸以下的填料，可以减少由于填充物与电路图案的边界部分分离导致的空隙的发生，可靠性可以 也保证。
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公开(公告)号：US20140332255A1
公开(公告)日：2014-11-13
申请号：US14365897
申请日：2012-12-12
Applicant: LG INNOTEK CO., LTD.
Inventor： Chang Woo Yoo , Yeong Uk Seo , Byeong Ho Kim , Hyun Seok Seo , Sang Myung Lee , Ki Do Chun
IPC: H05K1/02
CPC classification number: H05K1/0298 , H05K3/06 , H05K3/465 , H05K2201/0376 , H05K2203/0353
Abstract: Provided are a printed circuit board and a method of manufacturing the same, the printed circuit board according to the present invention, the printed circuit board, including: an insulating substrate having a plurality of circuit pattern grooves formed on a surface thereof; and a plurality of circuit patterns formed by burying the circuit pattern grooves, wherein the circuit patterns protrude as much as a predetermined thickness from an upper surface of the insulating substrate.
Abstract translation: 提供一种印刷电路板及其制造方法，根据本发明的印刷电路板，印刷电路板包括：绝缘基板，其表面上形成有多个电路图案槽; 以及通过掩埋电路图案凹槽形成的多个电路图案，其中电路图案从绝缘基板的上表面突出多达预定厚度。
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