公开(公告)号：US12120822B2

公开(公告)日：2024-10-15

申请号：US17870555

申请日：2022-07-21

Applicant: MONOLITHIC POWER SYSTEMS, INC.

Inventor： Daocheng Huang ,  Xinmin Zhang ,  Yishi Su ,  Yingxin Zhou ,  Wenyang Huang

IPC: H05K1/18 ,  H02M3/158

CPC classification number: H05K1/185 ,  H05K1/181 ,  H02M3/158 ,  H05K2201/10053 ,  H05K2201/10378

Abstract: A power module has a printed circuit board (PCB) having an output inductor substrate layer and an output capacitor substrate layer. Power converters of the power module are implemented using monolithic integrated circuit (IC) switch blocks that are mounted on a surface of the power module. Output voltages of the power converters are provided at output voltage nodes. The power converters include output inductors that are embedded within the output inductor substrate layer and output capacitors that are embedded within the output capacitor substrate layer. Embedded output inductors and capacitors are connected to corresponding output voltage nodes.

公开(公告)号：US20250054684A1

公开(公告)日：2025-02-13

申请号：US18366564

申请日：2023-08-07

Applicant: Monolithic Power Systems, Inc.

Inventor： Daocheng Huang ,  Ting Ge ,  Yishi Su ,  Wenyang Huang ,  Yingxin Zhou

IPC: H01F27/28 ,  H01F27/245 ,  H02M5/12

Abstract: A power module, having: a transformer pack; a top substrate mounted on the transformer pack; and two power device chips mounted on the top substrate, wherein each one of the power device chips has at least one pin connected to the transformer pack via the top substrate; wherein the transformer pack has a magnetic core, a first primary winding and a second primary winding, a first secondary winding and a second secondary winding, a first magnetic core part and a second magnetic core part, and wherein each one of the primary windings passes through the magnetic core, the first secondary winding is close to the first primary winding with the first magnetic core part in between, and the second secondary winding is close to the second primary winding with the second magnetic core part in between.

公开(公告)号：US20220369464A1

公开(公告)日：2022-11-17

申请号：US17878356

申请日：2022-08-01

Applicant: Monolithic Power Systems, Inc.

Inventor： Daocheng Huang ,  Wenyang Huang ,  Yishi Su ,  Yingxin Zhou ,  Xinmin Zhang

IPC: H05K1/18 ,  H01L23/495 ,  H05K1/02 ,  H01L23/66 ,  H01L23/528 ,  H01L23/367

Abstract: A power supply module having at least one inductor modules, a top PCB mounted on top of the at least one inductor modules, and at least one pair of power device chips mounted on top of the top PCB, wherein power pins and signal pins for connecting the top PCB and a board that the at least one inductor modules are attached to, are implemented by metal layers wrapping each of the at least one inductor modules.

公开(公告)号：US20220295638A1

公开(公告)日：2022-09-15

申请号：US17588630

申请日：2022-01-31

Applicant: Monolithic Power Systems, Inc.

Inventor： Daocheng Huang ,  Zhao Yuan ,  Yishi Su ,  Wenyang Huang ,  Xintong Lyu

IPC: H05K1/18 ,  H01F27/24 ,  H01F27/28 ,  H05K1/14 ,  H05K1/11

Abstract: A sandwich structure power supply module, having: an inductor pack having a first inductor and a second inductor; a top PCB (Printed Circuit Board) on top of the inductor pack; and a first power device chip and a second power device chip on top of the top PCB, wherein the first power device chip has at least one pin electrically connected to the first inductor via the top PCB, and the second power device chip has at least one pin electrically connected to the second inductor via the top PCB; wherein each inductor comprises one winding having a first end and a second end, and wherein at least one of the first end and the second end of each winding is bent to and extended at a plane perpendicular to an axis along a length of the winding.

公开(公告)号：US20250096209A1

公开(公告)日：2025-03-20

申请号：US18469800

申请日：2023-09-19

Applicant: Monolithic Power Systems, Inc.

Inventor： Ting Ge ,  Yingjiang Pu ,  Hunt Hang Jiang ,  Daocheng Huang ,  Yuanfeng Zhou ,  Qian Li ,  Cong Deng ,  Zhe Yang ,  Wenyang Huang

IPC: H01L25/16 ,  H01F27/06 ,  H01F27/08 ,  H01F27/26 ,  H01F37/00 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498

Abstract: A power module, having a bottom substrate, a device substrate arranged on the bottom substrate and an inductor assembly arranged on the device substrate. The device substrate having a first power device chip and a second power device chip embedded within the device substrate. Each power device chip has a first surface and a second surface. The first surface of each power device chip is covered by a top heat layer, and the second surface of each power device chip has a plurality of pins or pads exposed on the second surface of the device substrate, and connected to the bottom substrate.

公开(公告)号：US20250095902A1

公开(公告)日：2025-03-20

申请号：US18469847

申请日：2023-09-19

Applicant: Monolithic Power Systems, Inc.

Inventor： Ting Ge ,  Daocheng Huang ,  Zhe Yang ,  Wenyang Huang

IPC: H01F27/26 ,  H01F27/30 ,  H02M3/00

Abstract: A power module having a bottom substrate, a device substrate arranged on the bottom substrate and an inductor assembly arranged on the device substrate. The inductor assembly has a first winding, a second winding, a first magnetic core part and a second magnetic core part. The first magnetic core part has a first portion disposed on a first horizontal level and a second portion disposed on a second horizontal level. The second magnetic core part has a first portion disposed on the second horizontal level and a second portion disposed on the first horizontal level. The first and second magnetic core parts are assembled to accommodate the first winding between the first portions of the first and second magnetic core part, and to accommodate the second winding between the second portions of the first and second magnetic core part.

公开(公告)号：US20220295639A1

公开(公告)日：2022-09-15

申请号：US17589277

申请日：2022-01-31

Applicant: Monolithic Power Systems, Inc.

Inventor： Daocheng Huang ,  Zhao Yuan ,  Yishi Su ,  Wenyang Huang ,  Xintong Lyu

IPC: H05K1/18 ,  H01F27/24 ,  H01F27/28 ,  H05K1/14 ,  H05K1/11

Abstract: A sandwich structure power supply module, having: an inductor pack having at least one inductor; a top PCB (Printed Circuit Board) on top of the inductor pack; and at least one power device chip on top of the top PCB, wherein each one of the power device chips has at least one pin connected to an associated inductor via the top PCB; wherein the inductor pack is wrapped with metal layers, wherein each two metal layers are lied against to a same surface of the inductor pack, with an isolation layer in between, and wherein the two metal layers are connected to different potentials.