OPERATING METHOD FOR INSPECTING EQUIPMENT
    1.
    发明申请
    OPERATING METHOD FOR INSPECTING EQUIPMENT 审中-公开
    检查设备的操作方法

    公开(公告)号:US20160210028A1

    公开(公告)日:2016-07-21

    申请号:US14996282

    申请日:2016-01-15

    Abstract: The instant disclosure provides an operating method of inspecting equipment, with the method applicable to semiconductor inspecting equipment having a movable element. The method includes: displaying a wafer graphic by a touch display; detecting a touch signal generated by the touch display; detecting the magnification of the wafer graphic when the touch signal is generated; and determining the moving speed of the movable element based on the magnification of the wafer graphic when the touch signal is generated. In addition, the moving direction of the movable element can be determined according to the touch signal. Through the instant disclosure, the operator can more intuitively operate each movable element of semiconductor inspecting equipment.

    Abstract translation: 本公开提供了一种可用于具有可移动元件的半导体检查设备的方法来检查设备的操作方法。 该方法包括:通过触摸显示器显示晶片图形; 检测由所述触摸显示器产生的触摸信号; 当生成触摸信号时检测晶片图形的放大率; 以及当产生所述触摸信号时,基于所述晶片图形的放大率来确定所述可移动元件的移动速度。 此外,可以根据触摸信号来确定可移动元件的移动方向。 通过本公开,操作者可以更直观地操作半导体检查设备的每个可移动元件。

    TEST SYSTEM AND METHOD FOR DATA VERIFICATION FOR THE SAME

    公开(公告)号:US20240402238A1

    公开(公告)日:2024-12-05

    申请号:US18327021

    申请日:2023-05-31

    Abstract: A test system and a method for data verification for the same are provided. The test system includes a main control unit having a control host and an analyzer, and a probe assembly that includes at least one probe-head with probe tips and a cable linked to the analyzer. The probe assembly is configured to contact one of testing circuits of a calibration standard assembly via the probe tips for performing a calibration process. In the method, incident data is inputted to the calibration standard assembly for generating measured uncorrected data, and afterwards the measured uncorrected data can be verified by performing relative comparison on any two sets of the measured uncorrected data.

    Operating method for inspecting equipment

    公开(公告)号:US10048844B2

    公开(公告)日:2018-08-14

    申请号:US14996282

    申请日:2016-01-15

    Abstract: The instant disclosure provides an operating method of inspecting equipment, with the method applicable to semiconductor inspecting equipment having a movable element. The method includes: displaying a wafer graphic by a touch display; detecting a touch signal generated by the touch display; detecting the magnification of the wafer graphic when the touch signal is generated; and determining the moving speed of the movable element based on the magnification of the wafer graphic when the touch signal is generated. In addition, the moving direction of the movable element can be determined according to the touch signal. Through the instant disclosure, the operator can more intuitively operate each movable element of semiconductor inspecting equipment.

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