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公开(公告)号:US20160210028A1
公开(公告)日:2016-07-21
申请号:US14996282
申请日:2016-01-15
Applicant: MPI Corporation
Inventor: Stojan Kanev , Yung-Chin Liu , Andrej Rumiantsev , YAO-CHUAN CHIANG
IPC: G06F3/0484 , G06F3/0488 , G06F3/041
CPC classification number: G06F3/04845 , G01N21/9501 , G01R31/2808 , G03F7/7065 , G03F7/708 , G06F3/0412 , G06F3/04847 , G06F3/04883 , G06F2203/04806
Abstract: The instant disclosure provides an operating method of inspecting equipment, with the method applicable to semiconductor inspecting equipment having a movable element. The method includes: displaying a wafer graphic by a touch display; detecting a touch signal generated by the touch display; detecting the magnification of the wafer graphic when the touch signal is generated; and determining the moving speed of the movable element based on the magnification of the wafer graphic when the touch signal is generated. In addition, the moving direction of the movable element can be determined according to the touch signal. Through the instant disclosure, the operator can more intuitively operate each movable element of semiconductor inspecting equipment.
Abstract translation: 本公开提供了一种可用于具有可移动元件的半导体检查设备的方法来检查设备的操作方法。 该方法包括:通过触摸显示器显示晶片图形; 检测由所述触摸显示器产生的触摸信号; 当生成触摸信号时检测晶片图形的放大率; 以及当产生所述触摸信号时,基于所述晶片图形的放大率来确定所述可移动元件的移动速度。 此外,可以根据触摸信号来确定可移动元件的移动方向。 通过本公开,操作者可以更直观地操作半导体检查设备的每个可移动元件。
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公开(公告)号:US20240402238A1
公开(公告)日:2024-12-05
申请号:US18327021
申请日:2023-05-31
Applicant: MPI CORPORATION
Inventor: Andrej Rumiantsev , LIN-LIN CHIH , CHING-LING PAI
IPC: G01R31/265 , G01R35/00
Abstract: A test system and a method for data verification for the same are provided. The test system includes a main control unit having a control host and an analyzer, and a probe assembly that includes at least one probe-head with probe tips and a cable linked to the analyzer. The probe assembly is configured to contact one of testing circuits of a calibration standard assembly via the probe tips for performing a calibration process. In the method, incident data is inputted to the calibration standard assembly for generating measured uncorrected data, and afterwards the measured uncorrected data can be verified by performing relative comparison on any two sets of the measured uncorrected data.
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公开(公告)号:US10048844B2
公开(公告)日:2018-08-14
申请号:US14996282
申请日:2016-01-15
Applicant: MPI Corporation
Inventor: Stojan Kanev , Yung-Chin Liu , Andrej Rumiantsev , Yao-Chuan Chiang
IPC: G06F3/0484 , G06F3/041 , G06F3/0488 , G01R31/28 , G03F7/20 , G01N21/95
Abstract: The instant disclosure provides an operating method of inspecting equipment, with the method applicable to semiconductor inspecting equipment having a movable element. The method includes: displaying a wafer graphic by a touch display; detecting a touch signal generated by the touch display; detecting the magnification of the wafer graphic when the touch signal is generated; and determining the moving speed of the movable element based on the magnification of the wafer graphic when the touch signal is generated. In addition, the moving direction of the movable element can be determined according to the touch signal. Through the instant disclosure, the operator can more intuitively operate each movable element of semiconductor inspecting equipment.
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公开(公告)号:US20250044350A1
公开(公告)日:2025-02-06
申请号:US18781351
申请日:2024-07-23
Applicant: MPI CORPORATION
Inventor: Andrej Rumiantsev , Lin-Lin CHIH , Ching-Ling PAI
IPC: G01R31/28 , G01R1/067 , H01L23/544
Abstract: A method of determining probing parameters for a probe system to test a DUT includes defining a SD-OD relation dataset according to the probe type of the probing assembly of the probe system and the contact pad type of the DUT, and providing the controller a skate distance value, for which the probe tip is set to skate after contacting the contact pad, or an overdrive value, for which the probing assembly and the DUT are set to be relatively moved after the probe tip contacts the contact pad, and a probe target position or a present probe position, to obtain both the skate distance value and the overdrive value and a position for positioning the probing assembly and the DUT to each other, thereby conveniently and quickly obtaining the required probing parameters for operating the probe system to test the DUT for great and consistent testing performance.
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