公开(公告)号：US20250044346A1

公开(公告)日：2025-02-06

申请号：US18762988

申请日：2024-07-03

Applicant: MPI CORPORATION

Inventor： ANDREJ RUMIANTSEV ,  Ching-Ling PAI ,  LIN-LIN CHIH

IPC: G01R31/28 ,  G01R35/00

Abstract: To determine whether the current temperature of a probe assembly is stable for the calibration at the auxiliary site, a wafer probe station verifies a measured air standard dataset with a predetermined signal range or verifying an estimated measurement time range with a predetermined time window. To determine whether adjusting the current temperature of a probe assembly at the wafer site is necessary, a wafer probe station verifies a measured air standard dataset with a predetermined signal range or verifying an estimated measurement time range with a predetermined time window. To determine whether the current temperature of a probe assembly is ready for testing a semiconductor device, a wafer probe station verifies a measured air standard dataset with a predetermined signal range.

公开(公告)号：US20250044349A1

公开(公告)日：2025-02-06

申请号：US18762919

申请日：2024-07-03

Applicant: MPI CORPORATION

Inventor： ANDREJ RUMIANTSEV ,  Ching-Ling PAI ,  LIN-LIN CHIH

IPC: G01R31/28 ,  G01R1/073 ,  G01R35/00

Abstract: To determine whether the current temperature of a probe assembly is stable for the calibration at the auxiliary site, a wafer probe station verifies a measured air standard dataset with a predetermined signal range or verifying an estimated measurement time range with a predetermined time window. To determine whether adjusting the current temperature of a probe assembly at the wafer site is necessary, a wafer probe station verifies a measured air standard dataset with a predetermined signal range or verifying an estimated measurement time range with a predetermined time window. To determine whether the current temperature of a probe assembly is ready for testing a semiconductor device, a wafer probe station verifies a measured air standard dataset with a predetermined signal range.

公开(公告)号：US20170221733A1

公开(公告)日：2017-08-03

申请号：US15414873

申请日：2017-01-25

Applicant: MPI Corporation

Inventor： LIN-LIN CHIH ,  Chien-Hung Chen ,  Cheng-Rong Yang ,  Stojan Kanev

IPC: H01L21/677 ,  A47B88/457 ,  A47B88/497

CPC classification number: H01L21/6773 ,  A47B88/457 ,  A47B88/497 ,  A47B88/988 ,  G01K13/00 ,  G01R31/2891 ,  G01R31/44 ,  H01L21/67346 ,  H01L21/67386

Abstract: A wafer cassette includes a case, a plurality of wafer trays, and a plurality of transmission mechanisms. The wafer trays are disposed in the case. Each of the wafer trays includes a central opening, a first groove, and a second groove. The diameter of the second groove is greater than that of the first groove. A bottom surface of the second groove is higher than that of the first groove. The first and second grooves surround the central opening. Each of the transmission mechanisms is connected to the corresponding wafer tray to move the wafer tray between a pick-up position and a received position. Since the wafer tray has grooves with different diameters, the wafer tray is capable of receiving wafers with different sizes.

公开(公告)号：US20240402238A1

公开(公告)日：2024-12-05

申请号：US18327021

申请日：2023-05-31

Applicant: MPI CORPORATION

Inventor： Andrej Rumiantsev ,  LIN-LIN CHIH ,  CHING-LING PAI

IPC: G01R31/265 ,  G01R35/00

Abstract: A test system and a method for data verification for the same are provided. The test system includes a main control unit having a control host and an analyzer, and a probe assembly that includes at least one probe-head with probe tips and a cable linked to the analyzer. The probe assembly is configured to contact one of testing circuits of a calibration standard assembly via the probe tips for performing a calibration process. In the method, incident data is inputted to the calibration standard assembly for generating measured uncorrected data, and afterwards the measured uncorrected data can be verified by performing relative comparison on any two sets of the measured uncorrected data.