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    Dummy core plus plating resist restrict resin process and structure
    2.
    发明授权
    Dummy core plus plating resist restrict resin process and structure 有权

    公开(公告)号：US10321560B2

    公开(公告)日：2019-06-11

    申请号：US14995087

    申请日：2016-01-13

    Applicant: Multek Technologies Limited

    Inventor： Pui Yin Yu ,  Mark Zhang ,  Jiawen Chen

    IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/06 ,  H05K3/18 ,  H05K1/03

    Abstract: A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are exposed from the remaining layers. The PCB having an exposed inner core circuitry is formed using a dummy core plus plating resist process. The select inner core circuitry is part of an inner core. The inner core corresponding to the exposed inner core circuitry forms a semi-flexible PCB portion. The semi-flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the semi-flexible PCB portion and the remaining rigid PCB portion.

    Disconnect cavity by plating resist process and structure
    3.
    发明授权
    Disconnect cavity by plating resist process and structure 有权

    公开(公告)号：US10292279B2

    公开(公告)日：2019-05-14

    申请号：US15159665

    申请日：2016-05-19

    Applicant: Multek Technologies Limited

    Inventor： Jiawen Chen ,  Pui Yin Yu

    IPC: H05K3/42 ,  H05K3/10 ,  H05K1/11 ,  H05K3/46 ,  H05K1/02

    Abstract: A disconnect cavity is formed within a PCB, where the disconnect cavity is electrically disconnected from a PCB landing layer. The disconnect cavity is formed using a plating resist process which does not require low flow prepreg nor selective copper etching. Plating resist is printed on a core structure selectively positioned within a PCB stack-up. The volume occupied by the plating resist forms a subsequently formed disconnect cavity. After lamination of the PCB stack-up, depth control milling, drilling and electroless copper plating are performed, followed by a plating resist stripping process to substantially remove the plating resist and all electroless copper plated to the plating resist, thereby forming the disconnect cavity. In a subsequent copper plating process, without electric connectivity copper cannot be plated to the side walls and bottom surface of the disconnect cavity, resulting in the disconnect cavity wall being electrically disconnected from the PCB landing layer.

    DISCONNECT CAVITY BY PLATING RESIST PROCESS AND STRUCTURE
    4.
    发明申请
    DISCONNECT CAVITY BY PLATING RESIST PROCESS AND STRUCTURE 审中-公开

    公开(公告)号：US20170318685A1

    公开(公告)日：2017-11-02

    申请号：US15159665

    申请日：2016-05-19

    Applicant: Multek Technologies Limited

    Inventor： Jiawen Chen ,  Pui Yin Yu

    IPC: H05K3/42 ,  H05K3/10 ,  H05K1/11 ,  H05K3/46 ,  H05K1/02

    CPC classification number: H05K3/429 ,  H05K1/115 ,  H05K2203/0207 ,  H05K2203/308

    Abstract: A disconnect cavity is formed within a PCB, where the disconnect cavity is electrically disconnected from a PCB landing layer. The disconnect cavity is formed using a plating resist process which does not require low flow prepreg nor selective copper etching. Plating resist is printed on a core structure selectively positioned within a PCB stack-up. The volume occupied by the plating resist forms a subsequently formed disconnect cavity. After lamination of the PCB stack-up, depth control milling, drilling and electroless copper plating are performed, followed by a plating resist stripping process to substantially remove the plating resist and all electroless copper plated to the plating resist, thereby forming the disconnect cavity. In a subsequent copper plating process, without electric connectivity copper cannot be plated to the side walls and bottom surface of the disconnect cavity, resulting in the disconnect cavity wall being electrically disconnected from the PCB landing layer.

    Rigid-bend printed circuit board fabrication
    7.
    发明授权
    Rigid-bend printed circuit board fabrication 有权

    公开(公告)号：US09992880B2

    公开(公告)日：2018-06-05

    申请号：US14995139

    申请日：2016-01-13

    Applicant: Multek Technologies Limited

    Inventor： Pui Yin Yu ,  Mark Zhang ,  Jiawen Chen

    IPC: H05K3/36 ,  H05K3/46

    CPC classification number: H05K3/4691 ,  H05K2201/09127 ,  H05K2201/09781 ,  H05K2203/0228 ,  Y10T29/49126

    Abstract: A printed circuit board (PCB) has multiple layers, where select portions of one or more conductive layers, referred to as core circuitry, form a semi-flexible PCB portion that is protected by an exposed prepreg layer. The semi-flexible PCB portion having an exposed prepreg layer is formed using a dummy core process that leaves the exposed prepreg layer smooth and undamaged. The core circuitry is part of a core structure. The semi-flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The core structure is common to both the semi-flexible PCB portion and the remaining rigid PCB portion.

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