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公开(公告)号：US20210066775A1
公开(公告)日：2021-03-04
申请号：US17096091
申请日：2020-11-12
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Chu XU
Abstract: A multilayer board includes a layered body including insulating base material layers that are laminated, and first and second signal lines, a first ground conductor including a first opening, a second ground conductor, a third ground conductor, and an interlayer connecting conductor. The first signal line overlaps the first opening when seen in a layering direction. The second signal line is provided on a layer different from a layer including the first signal line and includes a portion extending side by side with the first signal line when seen in the Z-axis direction. The first, second, and third ground conductors are connected by the interlayer connecting conductor. The third ground conductor is disposed on a layer including the first signal line or a layer positioned between the first signal line and the second signal line.
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公开(公告)号：US20210249157A1
公开(公告)日：2021-08-12
申请号：US17245093
申请日：2021-04-30
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takahiro BABA , Lijun ZHAO , Chu XU , Hiromasa KOYAMA , Satoshi MATSUURA
Abstract: A transmission line substrate includes a stacked body that includes insulating base materials, first and second signal lines, and first and second ground conductors. The second signal line is provided on a layer different from the layer of the first signal line and extends in parallel with the first signal line. The first ground conductor is provided on the same layer as the layer of the second signal line and overlapped with the first signal line when viewed in the Z-axis direction. The second ground conductor is provided on the same layer as the layer of the first signal line and overlapped with the second signal line when viewed in the Z-axis direction. A first transmission line includes the first signal line, the first ground conductor, and an insulating base material, and a second transmission line includes the second signal line, the second ground conductor, and the insulating base material.
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公开(公告)号：US20210204403A1
公开(公告)日：2021-07-01
申请号：US17198461
申请日：2021-03-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Chu XU , Takahiro BABA
Abstract: A multilayer board includes a laminated insulating body, signal conductors inside the laminated insulating body and extending in a transmission direction, and ground conductors sandwiching each of the signal conductors in a lamination direction via the insulating base material layers. The multilayer board includes a parallel extending portion in which the signal conductors extend parallel and that includes signal conductors arranged separately from each other in a direction orthogonal to the transmission direction in a planar view in the lamination direction, and a signal conductor overlapping with the signal conductor in a planar view in the lamination direction and arranged separately from the signal conductor in the lamination direction. The parallel extending portion includes first and second regions arranged separately in a direction orthogonal to the transmission direction in a planar view in the lamination direction.
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Patent Agency Ranking
公开(公告)号：US20190296414A1
公开(公告)日：2019-09-26
申请号：US16439733
申请日：2019-06-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Chu XU
Abstract: A multilayer board includes a layered body including insulating base material layers that are laminated, and first and second signal lines, a first ground conductor including a first opening, a second ground conductor, a third ground conductor, and an interlayer connecting conductor. The first signal line overlaps the first opening when seen in a layering direction. The second signal line is provided on a layer different from a layer including the first signal line and includes a portion extending side by side with the first signal line when seen in the Z-axis direction. The first, second, and third ground conductors are connected by the interlayer connecting conductor. The third ground conductor is disposed on a layer including the first signal line or a layer positioned between the first signal line and the second signal line.
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公开(公告)号：US20190088388A1
公开(公告)日：2019-03-21
申请号：US16181717
申请日：2018-11-06
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takahiro BABA , Lijun ZHAO , Chu XU , Hiromasa KOYAMA , Satoshi MATSUURA
Abstract: A transmission line substrate includes a stacked body that includes insulating base materials, first and second signal lines, and first and second ground conductors. The second signal line is provided on a layer different from the layer of the first signal line and extends in parallel with the first signal line. The first ground conductor is provided on the same layer as the layer of the second signal line and overlapped with the first signal line when viewed in the Z-axis direction. The second ground conductor is provided on the same layer as the layer of the first signal line and overlapped with the second signal line when viewed in the Z-axis direction. A first transmission line includes the first signal line, the first ground conductor, and an insulating base material, and a second transmission line includes the second signal line, the second ground conductor, and the insulating base material.
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公开(公告)号：US20180287275A1
公开(公告)日：2018-10-04
申请号：US16002004
申请日：2018-06-07
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Chu XU , Takahiro BABA
CPC classification number: H01R12/52 , H01R12/62 , H05K1/0271 , H05K1/0298 , H05K1/0313 , H05K1/113 , H05K1/144 , H05K3/363 , H05K3/368 , H05K2201/0129 , H05K2201/041 , H05K2201/052 , H05K2201/056 , H05K2201/09027 , H05K2201/09045 , H05K2201/09263 , H05K2201/09945 , H05K2201/10189 , H05K2201/1031 , H05K2201/10522
Abstract: A resin multilayer substrate includes a substrate main body including first, second, and third wiring portions connected to one another by a connecting portion. First, second and third external connection terminals are respectively included in the first, second and third wiring portions. The first external connection terminal includes a conductor exposed at a surface of the substrate main body. The second and third external connection terminals include connectors mounted on conductors on the surface of the substrate main body. An auxiliary mounting conductor is disposed between the first external connection terminal and the second and third external connection terminals on the surface of the substrate main body.
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7.发明申请公开(公告)号：US20200076097A1
公开(公告)日：2020-03-05
申请号：US16677713
申请日：2019-11-08
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Chu XU , Takahiro BABA
IPC: H01R12/52 , H05K3/36 , H05K1/03 , H05K1/02 , H01R12/62 , H05K1/11 , H05K3/46 , H05K1/18 , H05K1/14
Abstract: A resin multilayer substrate includes a substrate main body including first, second, and third wiring portions connected to one another by a connecting portion. First, second and third external connection terminals are respectively included in the first, second and third wiring portions. The first external connection terminal includes a conductor exposed at a surface of the substrate main body. The second and third external connection terminals include connectors mounted on conductors on the surface of the substrate main body. An auxiliary mounting conductor is disposed between the first external connection terminal and the second and third external connection terminals on the surface of the substrate main body.
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公开(公告)号：US20190334262A1
公开(公告)日：2019-10-31
申请号：US16504370
申请日：2019-07-08
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Chu XU , Takahiro BABA
Abstract: A resin multilayer substrate includes a substrate main body including first, second, and third wiring portions connected to one another by a connecting portion. First, second and third external connection terminals are respectively included in the first, second and third wiring portions. The first external connection terminal includes a conductor exposed at a surface of the substrate main body. The second and third external connection terminals include connectors mounted on conductors on the surface of the substrate main body. An auxiliary mounting conductor is disposed between the first external connection terminal and the second and third external connection terminals on the surface of the substrate main body.
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