公开(公告)号：US20170080513A1

公开(公告)日：2017-03-23

申请号：US15126642

申请日：2015-04-15

Applicant: NSK LTD.

Inventor： Takashi SUNAGA ,  Noboru KANEKO ,  Osamu MIYOSHI ,  Ryoichi SUZUKI

IPC: B23K11/14 ,  B62D5/04 ,  B23K11/25

CPC classification number: B23K11/14 ,  B23K11/00 ,  B23K11/24 ,  B23K11/25 ,  B23K2101/006 ,  B62D5/0403

Abstract: A resistance welding device is provided with a moving distance measuring section for measuring distances between conductors to be joined before and after joining and evaluating joining quality based on the distances, and a projection including a base and a projecting surface is provided to the conductor to be connected in order to easily secure a distance between the conductors after the joining.

公开(公告)号：US20160181221A1

公开(公告)日：2016-06-23

申请号：US14910355

申请日：2014-10-06

Applicant: NSK LTD.

Inventor： Takashi SUNAGA ,  Noboru KANEKO ,  Osamu MIYOSHI ,  Ryoichi SUZUKI

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/492 ,  H01L29/78 ,  H01L29/739

CPC classification number: H01L24/41 ,  H01L23/3735 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L29/7393 ,  H01L29/78 ,  H01L2224/05553 ,  H01L2224/0603 ,  H01L2224/2732 ,  H01L2224/29101 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/37611 ,  H01L2224/4001 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4099 ,  H01L2224/4112 ,  H01L2224/73263 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84138 ,  H01L2224/8421 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/9221 ,  H01L2924/00015 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/19105 ,  H01L2924/35121 ,  H01L2924/365 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/291 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/01047 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/48 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2924/01029 ,  H01L2924/013 ,  H01L2924/00013

Abstract: To provide a semiconductor module that has high reliability of electric connection by a solder and is inexpensive. A joint surface of an electrode jointing portion that is opposed to a surface to be jointed of a gate electrode of a bare-chip FET and a joint surface of a substrate jointing portion that is opposed to a surface to be jointed of another wiring pattern include an outgas releasing mechanism that makes outgas generated from a molten solder during solder jointing of a metal plate connector be released from solders interposed between the joint surfaces and the surfaces to be jointed.

Abstract translation: 提供通过焊料具有高可靠性的电连接并且便宜的半导体模块。 电极接合部的与裸芯片FET的栅电极接合的面相对的基板接合部的接合面与与其他布线图案的被接合面相对的基板接合部的接合面包含 在金属板连接器的焊接期间使从熔融焊料产生的废气从放置在接合面和待接合面之间的焊料脱离的脱气释放机构。

公开(公告)号：US20170208687A1

公开(公告)日：2017-07-20

申请号：US15321253

申请日：2015-09-10

Applicant: NSK Ltd.

Inventor： Masakazu MORIMOTO ,  Noboru KANEKO ,  Tadayoshi OSAKABE

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H01R12/52 ,  H01R12/57 ,  H01R12/58 ,  H01R12/707 ,  H01R13/405 ,  H01R43/24 ,  H01R2201/26 ,  H05K1/144 ,  H05K3/3426 ,  H05K7/1432 ,  H05K2201/042 ,  H05K2201/10318

Abstract: Multipolar lead parts having plural leads and a retaining member, wherein the retaining member includes a cylindrical portion so as to cover peripheries of the leads, the cylindrical portion facing in a board direction; wherein the leads each include an upper-side board coupling portion and a lower-side board coupling portion; wherein the lower-side board coupling portion comprises a forward protruding portion that the other end side of each of the leads is bent in a direction orthogonal to an arrangement face of the leads, a vertical portion extending downward from a front end, a solder coupling portion extending backward from a lower end, and a rising portion extending upward from the solder coupling portion; and wherein a bending angle of the rising portion with respect to the solder coupling portion is formed so as to be substantially identical to a bending angle of the vertical portion with respect to the solder coupling portion.

公开(公告)号：US20190276072A1

公开(公告)日：2019-09-12

申请号：US16349079

申请日：2017-10-19

Applicant: NSK LTD.

Inventor： Masakazu MORIMOTO ,  Noboru KANEKO

IPC: B62D5/04 ,  H02K11/33 ,  H05K7/20 ,  H01G9/022

Abstract: An electronic control device includes: a circuit board including a substrate and an electrolytic capacitor connected to the substrate; a heat sink including a recess that houses the electrolytic capacitor; and heat dissipation material provided in the recess. The electrolytic capacitor has an end surface facing a bottom surface of the recess, and the heat dissipation material is in contact with the end surface and the bottom surface.

公开(公告)号：US20190248406A1

公开(公告)日：2019-08-15

申请号：US16342402

申请日：2017-10-19

Applicant: NSK LTD.

Inventor： Noboru KANEKO ,  Masakazu MORIMOTO ,  Makoto HAGIWARA ,  Ryoichi SUZUKI

IPC: B62D5/04 ,  H02K11/33 ,  H02K11/215 ,  G01B7/30

CPC classification number: B62D5/0406 ,  B62D5/0481 ,  G01B7/30 ,  H02K5/10 ,  H02K5/15 ,  H02K5/1732 ,  H02K5/225 ,  H02K11/215 ,  H02K11/33 ,  H02K29/08 ,  H02K29/14 ,  H02K2213/03

Abstract: An assembly structure of a sensor includes: a shaft; a housing including: a first cylindrical part; and a first annular plate that is an annular plate, an outer periphery of which is connected to an end of the first cylindrical part, and that is orthogonal to a rotation axis of the shaft; a magnet accommodated inside the first cylindrical part in a radial direction and fixed to an end of the shaft; a sensor configured to detect rotation of the magnet; and a holder that is fixed to the first annular plate and that holds the sensor such that the sensor is disposed at a predetermined position with respect to the magnet.

公开(公告)号：US20180343737A1

公开(公告)日：2018-11-29

申请号：US15774815

申请日：2016-11-25

Applicant: NSK LTD.

Inventor： Masakazu MORIMOTO ,  Noboru KANEKO ,  Shin KUMAGAI

IPC: H05K1/02 ,  H05K5/00 ,  H05K7/14 ,  B60R16/023

CPC classification number: H05K1/0271 ,  B60R16/02 ,  B60R16/0231 ,  B62D5/04 ,  H01L25/07 ,  H01L25/18 ,  H05K1/0203 ,  H05K5/0017 ,  H05K7/14 ,  H05K7/1427 ,  H05K7/20 ,  H05K2201/068

Abstract: A substrate provided in proximity to a case for improving heat radiation, and maintaining electrical insulation between the substrate and the case even when the substrate is warped, in the substrate having electronic parts mounted thereon and a case for housing the substrate. A case body of the case has a substrate placement surface for placing the substrate, the substrate placement surface is provided with a protruding portion protruding therefrom, and the substrate is fixed on the substrate placement surface, via a thermal interface material disposed on the substrate placement surface from a periphery of the protruding portion.

公开(公告)号：US20150342074A1

公开(公告)日：2015-11-26

申请号：US14435682

申请日：2013-10-25

Applicant: NSK LTD.

Inventor： Takashi SUNAGA ,  Noboru KANEKO ,  Osamu MIYOSHI

IPC: H05K7/02

CPC classification number: H05K7/02 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/73 ,  H01L24/83 ,  H01L24/84 ,  H01L24/92 ,  H01L25/07 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/291 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/32227 ,  H01L2224/32238 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/352 ,  H01L2224/35847 ,  H01L2224/3701 ,  H01L2224/37013 ,  H01L2224/37124 ,  H01L2224/37139 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40227 ,  H01L2224/40475 ,  H01L2224/40499 ,  H01L2224/4103 ,  H01L2224/4112 ,  H01L2224/48 ,  H01L2224/73263 ,  H01L2224/77272 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8321 ,  H01L2224/83424 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/84424 ,  H01L2224/84447 ,  H01L2224/84801 ,  H01L2224/84815 ,  H01L2224/85 ,  H01L2224/9221 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/1031 ,  H05K2201/10409 ,  Y02P70/611 ,  H01L2924/00015 ,  H01L2924/00014 ,  H01L2224/83 ,  H01L2224/84 ,  H01L2224/33 ,  H01L2924/00012 ,  H01L2924/00

Abstract: To provide a semiconductor module capable of shortening of the manufacturing tact time, reducing the manufacturing costs, and improving assembility. A semiconductor module (30) includes substrate (31) made of metal, an insulating layer (32) formed on the substrate (31), a plurality of wiring patterns (33a to 33d) formed on the insulating layer (32), a bare-chip transistor (35) mounted on a wiring pattern (33a) via a solder (34a); and a metal plate connector (36a, 36b) jointing an electrode (S, G) of the bare-chip transistor (35) and a wiring pattern (33b, 33c) via a solder (34b, 34c). The metal plate connector (36a, 36b) has a bridge shape, and has a flat surface and a center of gravity at a middle portion of the component.

Abstract translation: 提供能够缩短制造节拍时间，降低制造成本，提高组装性的半导体模块。 半导体模块（30）包括由金属制成的基板（31），形成在基板（31）上的绝缘层（32），形成在绝缘层（32）上的多个布线图案（33a〜33d） 通过焊料（34a）安装在布线图案（33a）上的芯片晶体管（35）; 以及通过焊料（34b，34c）将裸芯片晶体管（35）的电极（S，G）和布线图案（33b，33c）接合的金属板连接器（36a，36b）。 金属板连接器（36a，36b）具有桥接形状，并且在部件的中间部分具有平坦表面和重心。