公开(公告)号：US10784421B2

公开(公告)日：2020-09-22

申请号：US16326731

申请日：2017-08-23

Applicant: OSRAM OLED GmbH

Inventor： Markus Boss ,  Tobias Gebuhr

IPC: H01L33/56 ,  H01L21/56 ,  H01L33/54 ,  H01L25/075 ,  H01L33/00

Abstract: A method of producing an optoelectronic component includes providing a carrier having an upper side; providing a mat configured as a fiber-matrix semifinished product and having a through-opening; arranging an optoelectronic semiconductor chip over the upper side of the carrier; arranging the mat over the upper side of the carrier such that the optoelectronic semiconductor chip is arranged in the opening of the mat; and compacting the mat to form a composite body including the mat and the optoelectronic semiconductor chip.

公开(公告)号：US20210043615A1

公开(公告)日：2021-02-11

申请号：US16969153

申请日：2019-02-25

Applicant: OSRAM OLED GmbH

Inventor： Daniel Richter ,  Tobias Gebuhr ,  Michael Betz ,  Markus Boss

IPC: H01L25/16 ,  H01L33/58 ,  H01L33/48 ,  H01L33/62 ,  H01L33/54 ,  H01L33/00

Abstract: An optoelectronic component and a manufacturing method are disclosed. In an embodiment an optoelectronic component includes an optoelectronic semiconductor chip, a housing having a top side and two protrusions on the top side projecting beyond the top side and a transparent structure, wherein the optoelectronic semiconductor chip is arranged between the protrusions, and wherein the transparent structure is at least partially arranged on the top side of the housing between the protrusions and partially above the optoelectronic semiconductor chip.

公开(公告)号：US11728321B2

公开(公告)日：2023-08-15

申请号：US16969153

申请日：2019-02-25

Applicant: OSRAM OLED GmbH

Inventor： Daniel Richter ,  Tobias Gebuhr ,  Michael Betz ,  Markus Boss

IPC: H01L25/16 ,  H01L33/00 ,  H01L33/48 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L33/005 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2933/005

Abstract: An optoelectronic component and a manufacturing method are disclosed. In an embodiment an optoelectronic component includes an optoelectronic semiconductor chip, a housing having a top side and two protrusions on the top side projecting beyond the top side and a transparent structure, wherein the optoelectronic semiconductor chip is arranged between the protrusions, and wherein the transparent structure is at least partially arranged on the top side of the housing between the protrusions and partially above the optoelectronic semiconductor chip.