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公开(公告)号：US10784421B2
公开(公告)日：2020-09-22
申请号：US16326731
申请日：2017-08-23
Applicant: OSRAM OLED GmbH
Inventor： Markus Boss , Tobias Gebuhr
IPC: H01L33/56 , H01L21/56 , H01L33/54 , H01L25/075 , H01L33/00
Abstract: A method of producing an optoelectronic component includes providing a carrier having an upper side; providing a mat configured as a fiber-matrix semifinished product and having a through-opening; arranging an optoelectronic semiconductor chip over the upper side of the carrier; arranging the mat over the upper side of the carrier such that the optoelectronic semiconductor chip is arranged in the opening of the mat; and compacting the mat to form a composite body including the mat and the optoelectronic semiconductor chip.
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公开(公告)号：US11670745B2
公开(公告)日：2023-06-06
申请号：US16634585
申请日：2018-07-18
Applicant: Osram OLED GmbH
Inventor： Klaus Reingruber , Andreas Reith , Tobias Gebuhr
CPC classification number: H01L33/54 , H01L33/507 , H01L2933/005 , H01L2933/0041
Abstract: A method for producing optoelectronic semiconductor components may include applying optoelectronic semiconductor chips for generating radiation to a carrier, producing a potting around the semiconductor chips with a potting top side facing away from the carrier such that the semiconductor chips remain free of a reflective potting material. The potting has trenches between the semiconductor chips, and the trenches are arranged at a distance from the semiconductor chips; the trenches do not touch the semiconductor chips. The method may further include filling the trenches with a supporting material to form at least one supporting body and leaving the potting alongside the trenches free of the supporting material.
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Patent Agency Ranking
公开(公告)号：US20210043615A1
公开(公告)日：2021-02-11
申请号：US16969153
申请日：2019-02-25
Applicant: OSRAM OLED GmbH
Inventor： Daniel Richter , Tobias Gebuhr , Michael Betz , Markus Boss
Abstract: An optoelectronic component and a manufacturing method are disclosed. In an embodiment an optoelectronic component includes an optoelectronic semiconductor chip, a housing having a top side and two protrusions on the top side projecting beyond the top side and a transparent structure, wherein the optoelectronic semiconductor chip is arranged between the protrusions, and wherein the transparent structure is at least partially arranged on the top side of the housing between the protrusions and partially above the optoelectronic semiconductor chip.
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公开(公告)号：US11728321B2
公开(公告)日：2023-08-15
申请号：US16969153
申请日：2019-02-25
Applicant: OSRAM OLED GmbH
Inventor： Daniel Richter , Tobias Gebuhr , Michael Betz , Markus Boss
CPC classification number: H01L25/167 , H01L33/005 , H01L33/486 , H01L33/54 , H01L33/58 , H01L33/62 , H01L2933/005
Abstract: An optoelectronic component and a manufacturing method are disclosed. In an embodiment an optoelectronic component includes an optoelectronic semiconductor chip, a housing having a top side and two protrusions on the top side projecting beyond the top side and a transparent structure, wherein the optoelectronic semiconductor chip is arranged between the protrusions, and wherein the transparent structure is at least partially arranged on the top side of the housing between the protrusions and partially above the optoelectronic semiconductor chip.
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公开(公告)号：US20210280749A1
公开(公告)日：2021-09-09
申请号：US17266061
申请日：2019-08-07
Applicant: OSRAM OLED GmbH
Inventor： Kathy Schmidtke , Tobias Gebuhr
Abstract: A method for producing conversion elements, a conversion element, a method for producing a light-emitting semiconductor device, and a light-emitting semiconductor device are disclosed. In an embodiment a method for producing conversion elements includes providing a sapphire substrate, forming a conversion layer on a first main surface of the sapphire substrate, and separating the sapphire substrate and the conversion layer into a plurality of conversion elements.
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公开(公告)号：US10931081B2
公开(公告)日：2021-02-23
申请号：US16074925
申请日：2017-02-03
Applicant: OSRAM OLED GmbH
Inventor： Andreas Wojcik , Tobias Gebuhr , Markus Pindl
Abstract: A method of producing an optoelectronic lighting device includes providing a laser chip carrier on which two edge emitting laser chips, arranging a carrier including two optical elements onto the laser chip carrier, forming a respective optical connection by an optical material between a respective laser facet and a respective optical element, singulating the two laser chips by dividing the laser chip carrier between the two laser chips to form two mutually divided laser chip carrier parts, wherein the dividing includes dividing the carrier between the two optical elements to form two mutually divided carrier parts each including one of the two optical elements, such that two singulated laser chips arranged on the respective divided laser chip carrier part are formed, the respective laser facets of which are optically connected to the respective optical element of the respective carrier part by the optical material.
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7.发明申请公开(公告)号：US20200212271A1
公开(公告)日：2020-07-02
申请号：US16634585
申请日：2018-07-18
Applicant: Osram OLED GmbH
Inventor： Klaus Reingruber , Andreas Reith , Tobias Gebuhr
Abstract: A method for producing optoelectronic semiconductor components may include applying optoelectronic semiconductor chips for generating radiation to a carrier, producing a potting around the semiconductor chips with a potting top side facing away from the carrier such that the semiconductor chips remain free of a reflective potting material. The potting has trenches between the semiconductor chips, and the trenches are arranged at a distance from the semiconductor chips; the trenches do not touch the semiconductor chips. The method may further include filling the trenches with a supporting material to form at least one supporting body and leaving the potting alongside the trenches free of the supporting material.
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