公开(公告)号：US11728321B2

公开(公告)日：2023-08-15

申请号：US16969153

申请日：2019-02-25

Applicant: OSRAM OLED GmbH

Inventor： Daniel Richter ,  Tobias Gebuhr ,  Michael Betz ,  Markus Boss

IPC: H01L25/16 ,  H01L33/00 ,  H01L33/48 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62

CPC classification number: H01L25/167 ,  H01L33/005 ,  H01L33/486 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2933/005

Abstract: An optoelectronic component and a manufacturing method are disclosed. In an embodiment an optoelectronic component includes an optoelectronic semiconductor chip, a housing having a top side and two protrusions on the top side projecting beyond the top side and a transparent structure, wherein the optoelectronic semiconductor chip is arranged between the protrusions, and wherein the transparent structure is at least partially arranged on the top side of the housing between the protrusions and partially above the optoelectronic semiconductor chip.

公开(公告)号：US20210043615A1

公开(公告)日：2021-02-11

申请号：US16969153

申请日：2019-02-25

Applicant: OSRAM OLED GmbH

Inventor： Daniel Richter ,  Tobias Gebuhr ,  Michael Betz ,  Markus Boss

IPC: H01L25/16 ,  H01L33/58 ,  H01L33/48 ,  H01L33/62 ,  H01L33/54 ,  H01L33/00

Abstract: An optoelectronic component and a manufacturing method are disclosed. In an embodiment an optoelectronic component includes an optoelectronic semiconductor chip, a housing having a top side and two protrusions on the top side projecting beyond the top side and a transparent structure, wherein the optoelectronic semiconductor chip is arranged between the protrusions, and wherein the transparent structure is at least partially arranged on the top side of the housing between the protrusions and partially above the optoelectronic semiconductor chip.