公开(公告)号：US08951825B1

公开(公告)日：2015-02-10

申请号：US14023423

申请日：2013-09-10

Applicant: Palo Alto Research Center Incorporated

Inventor： Scott J. H. Limb ,  Dirk DeBruyker ,  Sean Garner

IPC: H01L21/00 ,  H01L31/18 ,  H01L21/308

CPC classification number: H01L31/18 ,  H01L21/308 ,  H01L31/02363 ,  H01L31/1804 ,  Y02E10/52 ,  Y02E10/547 ,  Y02P70/521

Abstract: Multicrystalline silicon (mc-Si) solar cells having patterned light trapping structures (e.g., pyramid or trough features) are generated by printing a liquid mask material from an array of closely-spaced parallel elongated conduits such that portions of the mc-Si wafer are exposed through openings defined between the printed mask features. Closely spaced mask pattern features are achieved using an array of conduits (e.g., micro-springs or straight polyimide cantilevers), where each conduit includes a slit-type, tube-type or ridge/valley-type liquid guiding channel that extends between a fixed base end and a tip end of the conduit such that mask material supplied from a reservoir is precisely ejected from the tip onto the mc-Si wafer. The exposed planar surface portions are then etched to form the desired patterned light trapping structures (e.g., trough structures).

Abstract translation: 通过从紧密间隔开的平行细长导管的阵列印刷液体掩模材料来产生具有图案化的光捕获结构（例如，金字塔或槽特征）的多晶硅（mc-Si）太阳能电池，使得mc-Si晶片的部分 通过印刷的掩模特征之间限定的开口露出。 使用导管阵列（例如微弹簧或直接聚酰亚胺悬臂）实现紧密间隔的掩模图案特征，其中每个导管包括狭缝型，管型或脊/谷型液体引导通道，其在固定 基端和管道的末端，使得从储存器供应的掩模材料从尖端精确地喷射到mc-Si晶片上。 然后对暴露的平面表面部分进行蚀刻以形成所需的图案化光捕获结构（例如槽结构）。

公开(公告)号：US09109818B2

公开(公告)日：2015-08-18

申请号：US14033240

申请日：2013-09-20

Applicant: Palo Alto Research Center Incorporated

Inventor： David E. Schwartz ,  Dirk DeBruyker

IPC: F25B21/00

CPC classification number: F25B21/00 ,  F25B2321/001 ,  Y02B30/66

Abstract: System and methods are disclosed for controlled thermal energy transfer. The system includes a thermal energy source, a thermal energy sink, spaced apart from the thermal energy source, an electrocaloric structure carried by a suspension and configured for alternating physical movement between thermal communication with the thermal energy source and thermal communication with the thermal energy sink, and a control signal source simultaneously providing both a temperature control signal for controlling the temperature of the electrocaloric structure and a movement control signal for controlling the alternating physical movement of the electrocaloric structure between thermal communication with the thermal energy source and thermal communication with the heat sink. Heating or cooling of a desired element may be provided. Movement control may be electrostatic, magnetic, mechanical, etc., and is self-synchronizing with the field employed for temperature control in the electrocaloric structure.

Abstract translation: 公开了用于受控热能传递的系统和方法。 该系统包括热能源，与热能源间隔开的热能汇聚物，由悬浮物携带并被配置用于在与热能源的热连通之间交替物理运动并与热能汇的热连通的电热结构 以及控制信号源，同时提供用于控制电热结构的温度的温度控制信号和用于控制电热结构在与热能源的热连通之间的交替物理运动和与热能的热连通的运动控制信号 水槽。 可以提供所需元件的加热或冷却。 运动控制可以是静电，磁性，机械等，并且与用于电热结构中的温度控制的领域自同步。

公开(公告)号：US20140268596A1

公开(公告)日：2014-09-18

申请号：US13802701

申请日：2013-03-13

Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

Inventor： Eugene M. Chow ,  Dirk DeBruyker

IPC: H05K1/02

CPC classification number: H01L23/5387 ,  H01L23/49811 ,  H01L23/5385 ,  H01L2924/0002 ,  H05K1/0283 ,  H05K1/113 ,  H05K1/189 ,  H05K3/365 ,  H05K3/368 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0397 ,  H01L2924/00

Abstract: A flexible metal interconnect structure for transmitting signals between IC devices in flexible electronic devices is formed between two compliant flexible material layers that are laminated together form a multi-layer flexible substrate. The interconnect structure is formed by two rows of spaced-apart conductive pads (metal islands) attached to the inside (facing) surfaces of the flexible material layers. Compliant micro-contact elements such as micro-springs provide sliding metal pressure contacts that maintain electrical connections between the islands during stretching of the composite sheet. Specifically, at least two micro-contact elements are attached to each metal island in one of the rows, with one element in sliding pressure contact with an associated first metal island in the opposing row and the second element in sliding pressure contact with an associated second metal island. The islands and sliding contacts can be patterned into high density traces that accommodate large strains.

Abstract translation: 用于在柔性电子器件中的IC器件之间传输信号的柔性金属互连结构形成在层叠在一起形成多层柔性衬底的两个柔性柔性材料层之间。 互连结构由连接到柔性材料层的内侧（面向）表面的两排间隔开的导电焊盘（金属岛）形成。 合适的微接触元件例如微弹簧提供滑动金属压力接触件，其在拉伸复合片材期间保持岛之间的电连接。 具体地，至少两个微接触元件附接到行中的一个中的每个金属岛，其中一个元件与相对行中的相关联的第一金属岛滑动压力接触，并且第二元件与相关联的第二元件滑动压力接触 金属岛。 岛和滑动触点可以被图案化成适应大应变的高密度迹线。

公开(公告)号：US20140265848A1

公开(公告)日：2014-09-18

申请号：US13802569

申请日：2013-03-13

Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

Inventor： Bowen Cheng ,  Dirk DeBruyker ,  Eugene M. Chow

IPC: H05H1/24 ,  H01T23/00

CPC classification number: H05H1/24 ,  H01T23/00 ,  H05H2001/481

Abstract: An ionic wind engine unit for cooling semiconductor circuit assemblies includes a curved micro-spring and an associated electrode that are maintained apart at an appropriate gap distance such that, when subjected to a sufficiently high voltage potential (i.e., as determined by Peek's Law), current crowding at the spring's tip portion creates an electrical field that sufficiently ionizes neutral molecules in a portion of the air-filled region surrounding the tip portion to generate a micro-plasma event. In one engine type the electrode is a metal pad, and in a second engine type the electrode is a second micro-spring. Ionic wind cooling is generated, for example, between an IC die and a base substrate in a flip-chip arrangement, by controlling multiple engines disposed on the facing surfaces to produce an air current in the air gap region separating the IC device and base substrate.

Abstract translation: 用于冷却半导体电路组件的离子风力发动机单元包括弯曲的微型弹簧和相关联的电极，其被保持在适当的间隙距离处，使得当经受足够高的电压电位（即，由佩克定律确定）时， 在弹簧的尖端部分处的电流拥挤产生电场，该电场使围绕尖端部分的空气填充区域的一部分中的中性分子充分电离以产生微等离子体事件。 在一种发动机类型中，电极是金属焊盘，在第二发动机类型中，电极是第二微型弹簧。 通过控制设置在相对表面上的多个发动机在分离IC器件和基底基板的气隙区域中产生气流而产生例如以倒装芯片布置在IC芯片和基底基板之间的离子风冷却 。

公开(公告)号：US20150102852A1

公开(公告)日：2015-04-16

申请号：US14052348

申请日：2013-10-11

Applicant: Palo Alto Research Center Incorporated

Inventor： Scott J. H. Limb ,  Gregory L. Whiting ,  Sean R. Garner ,  JengPing Lu ,  Dirk DeBruyker

IPC: H03K19/177

CPC classification number: H03K19/17768 ,  H01L21/64 ,  H01L21/71 ,  H01L23/14 ,  H01L23/57 ,  H01L27/00 ,  H01L27/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A stressed substrate for transient electronic systems (i.e., electronic systems that visually disappear when triggered to do so) that includes one or more stress-engineered layers that store potential energy in the form of a significant internal stress. An associated trigger mechanism is also provided that, when triggered, causes an initial fracture in the stressed substrate, whereby the fracture energy nearly instantaneously travels throughout the stressed substrate, causing the stressed substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. The internal stress is incorporated into the stressed substrate through strategies similar to glass tempering (for example through heat or chemical treatment), or by depositing thin-film layers with large amounts of stress. Patterned fracture features are optionally provided to control the final fractured particle size. Electronic systems built on the substrate are entirely destroyed and dispersed during the transience event.

Abstract translation: 用于瞬态电子系统的应力衬底（即，当触发时视觉消失的电子系统）包括一个或多个以显着的内部应力的形式存储势能的应力设计层。 还提供了一种相关联的触发机构，其在被触发时引起应力基底中的初始断裂，由此断裂能几乎瞬时地穿过受压基底，导致受应力的基底碎裂成多个小（例如，微米级） 这很难发现。 通过与玻璃回火（例如通过热或化学处理）相似的策略，或者通过沉积具有大量应力的薄膜层，将内部应力结合到受压基板中。 可选地提供图案化的断裂特征以控制最终的断裂的粒度。 在基板上构建的电子系统在瞬态事件期间被完全破坏和分散。

公开(公告)号：US08736049B1

公开(公告)日：2014-05-27

申请号：US13802633

申请日：2013-03-13

Applicant: Palo Alto Research Center Incorporated

Inventor： Bowen Cheng ,  Dirk DeBruyker ,  Eugene M. Chow

IPC: H01L23/34 ,  F03H1/00

CPC classification number: H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Micro-plasma is generated at the tip of a micro-spring by applying a positive voltage to the spring's anchor portion and a negative voltage to an electrode maintained a fixed gap distance from the spring's tip portion. By generating a sufficiently large voltage potential (i.e., as determined by Peek's Law), current crowding at the tip portion of the micro-spring creates an electrical field that sufficiently ionizes neutral molecules in a portion of the air-filled region surrounding the tip portion to generate a micro-plasma event. Ionic wind air currents are generated by producing multiple micro-plasma events using micro-springs disposed in a pattern to produce a pressure differential that causes air movement over the micro-springs. Ionic wind cooling is produced by generating such ionic wind air currents, for example, in the gap region between an IC die and a base substrate disposed in a flip-chip arrangement.

Abstract translation: 通过向弹簧的锚固部施加正电压，向电极施加的负电压保持与弹簧顶部的固定的间隙距离，在微弹簧的尖端产生微等离子体。 通过产生足够大的电压电势（即，如通过佩克定律所确定的），在微弹簧尖端部分的电流拥挤产生电场，该电场在围绕尖端部分的充气区域的一部分中充分电离中性分子 以产生微等离子体事件。 通过使用以图案布置的微型弹簧产生多个微等离子体事件来产生离子风气流，以产生使空气在微弹簧上移动的压力差。 通过产生这样的离子风气流，例如在IC芯片和以倒装芯片布置的基板之间的间隙区域中产生离子风冷却。

公开(公告)号：US09154138B2

公开(公告)日：2015-10-06

申请号：US14052348

申请日：2013-10-11

Applicant: Palo Alto Research Center Incorporated

Inventor： Scott J. H. Limb ,  Gregory L. Whiting ,  Sean R. Garner ,  JengPing Lu ,  Dirk DeBruyker

IPC: H01L21/64 ,  H01L21/71 ,  H01L23/14 ,  H01L27/00 ,  H03K19/177

CPC classification number: H03K19/17768 ,  H01L21/64 ,  H01L21/71 ,  H01L23/14 ,  H01L23/57 ,  H01L27/00 ,  H01L27/12 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A stressed substrate for transient electronic systems (i.e., electronic systems that visually disappear when triggered to do so) that includes one or more stress-engineered layers that store potential energy in the form of a significant internal stress. An associated trigger mechanism is also provided that, when triggered, causes an initial fracture in the stressed substrate, whereby the fracture energy nearly instantaneously travels throughout the stressed substrate, causing the stressed substrate to shatter into multiple small (e.g., micron-sized) pieces that are difficult to detect. The internal stress is incorporated into the stressed substrate through strategies similar to glass tempering (for example through heat or chemical treatment), or by depositing thin-film layers with large amounts of stress. Patterned fracture features are optionally provided to control the final fractured particle size. Electronic systems built on the substrate are entirely destroyed and dispersed during the transience event.

Abstract translation: 用于瞬态电子系统的应力衬底（即，当触发时视觉消失的电子系统）包括一个或多个以显着的内部应力的形式存储势能的应力设计层。 还提供了一种相关联的触发机构，其在被触发时引起应力基底中的初始断裂，由此断裂能几乎瞬时地穿过受压基底，导致受应力的基底碎裂成多个小（例如，微米级） 这很难发现。 通过与玻璃回火（例如通过热或化学处理）相似的策略，或者通过沉积具有大量应力的薄膜层，将内部应力结合到受压基板中。 可选地提供图案化的断裂特征以控制最终的断裂的粒度。 在基板上构建的电子系统在瞬态事件期间被完全破坏和分散。

公开(公告)号：US20150082809A1

公开(公告)日：2015-03-26

申请号：US14033240

申请日：2013-09-20

Applicant: PALO ALTO RESEARCH CENTER INCORPORATED

Inventor： David E. Schwartz ,  Dirk DeBruyker

IPC: F25B21/00

CPC classification number: F25B21/00 ,  F25B2321/001 ,  Y02B30/66

Abstract: System and methods are disclosed for controlled thermal energy transfer. The system includes a thermal energy source, a thermal energy sink, spaced apart from the thermal energy source, an electrocaloric structure carried by a suspension and configured for alternating physical movement between thermal communication with the thermal energy source and thermal communication with the thermal energy sink, and a control signal source simultaneously providing both a temperature control signal for controlling the temperature of the electrocaloric structure and a movement control signal for controlling the alternating physical movement of the electrocaloric structure between thermal communication with the thermal energy source and thermal communication with the heat sink. Heating or cooling of a desired element may be provided. Movement control may be electrostatic, magnetic, mechanical, etc., and is self-synchronizing with the field employed for temperature control in the electrocaloric structure.

Abstract translation: 公开了用于受控热能传递的系统和方法。 该系统包括热能源，与热能源间隔开的热能汇聚物，由悬浮物携带并被配置用于在与热能源的热连通之间交替物理运动并与热能汇的热连通的电热结构 以及控制信号源，同时提供用于控制电热结构的温度的温度控制信号和用于控制电热结构在与热能源的热连通之间的交替物理运动和与热能的热连通的运动控制信号 水槽。 可以提供所需元件的加热或冷却。 运动控制可以是静电，磁性，机械等，并且与用于电热结构中的温度控制的领域自同步。

公开(公告)号：US08686552B1

公开(公告)日：2014-04-01

申请号：US13802724

申请日：2013-03-14

Applicant: Palo Alto Research Center Incorporated

Inventor： Eugene M. Chow ,  Dirk DeBruyker

IPC: H01L23/10

CPC classification number: H01L25/0652 ,  H01L23/49811 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/06155 ,  H01L2224/10165 ,  H01L2224/131 ,  H01L2224/16057 ,  H01L2224/16105 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/8114 ,  H01L2224/81193 ,  H01L2224/83191 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01L2225/06568 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A stacked-die electronic package assembly includes IC chips connected to a base substrate in a flip-chip, offset (e.g., pyramid-type) stacked arrangement by way of single-curved interconnect springs. Each interconnect spring is patterned from a spring metal film that bends to form a cantilevered structure having an anchor portion secured to the base substrate, a body portion that curves upward from the base substrate, and a tip disposed at the free end of the body portion. The IC chips are mounted onto interconnect springs such that contact pads on the chips contact the spring tips, causing the springs to slightly compress. Optional solder is utilized to secure the connection of the spring tips to the contact pads. Optional spacers and adhesive are utilized to maintain proper spacing between the IC chips and the base substrate. The springs are formed with different tip heights to facilitate connection to the stacked IC chips.

Abstract translation: 堆叠式电子封装组件包括以倒装芯片连接到基底衬底的IC芯片，通过单曲线互连弹簧的偏移（例如金字塔型）堆叠布置。 每个互连弹簧由弹簧金属膜图案化，弹簧金属膜弯曲以形成悬臂结构，其具有固定到基底基板的锚定部分，从基底基板向上弯曲的主体部分和设置在主体部分的自由端的尖端 。 IC芯片安装在互连弹簧上，使得芯片上的接触垫接触弹簧尖端，导致弹簧稍微压缩。 使用可选的焊料来固定弹簧顶端与接触垫的连接。 使用可选的间隔物和粘合剂来保持IC芯片和基底之间的适当间隔。 弹簧形成有不同的尖端高度以便于连接到堆叠的IC芯片。

公开(公告)号：US09210785B2

公开(公告)日：2015-12-08

申请号：US13802569

申请日：2013-03-13

Applicant: Palo Alto Research Center Incorporated

Inventor： Bowen Cheng ,  Dirk DeBruyker ,  Eugene M. Chow

IPC: F21V7/00 ,  H05H1/24 ,  H01T23/00 ,  H05H1/48

CPC classification number: H05H1/24 ,  H01T23/00 ,  H05H2001/481

Abstract: An ionic wind engine unit for cooling semiconductor circuit assemblies includes a curved micro-spring and an associated electrode that are maintained apart at an appropriate gap distance such that, when subjected to a sufficiently high voltage potential (i.e., as determined by Peek's Law), current crowding at the spring's tip portion creates an electrical field that sufficiently ionizes neutral molecules in a portion of the air-filled region surrounding the tip portion to generate a micro-plasma event. In one engine type the electrode is a metal pad, and in a second engine type the electrode is a second micro-spring. Ionic wind cooling is generated, for example, between an IC die and a base substrate in a flip-chip arrangement, by controlling multiple engines disposed on the facing surfaces to produce an air current in the air gap region separating the IC device and base substrate.

Abstract translation: 用于冷却半导体电路组件的离子风力发动机单元包括弯曲的微型弹簧和相关联的电极，其被保持在适当的间隙距离处，使得当经受足够高的电压电位（即，由佩克定律确定）时， 在弹簧的尖端部分处的电流拥挤产生电场，该电场使围绕尖端部分的空气填充区域的一部分中的中性分子充分电离以产生微等离子体事件。 在一种发动机类型中，电极是金属焊盘，在第二发动机类型中，电极是第二微型弹簧。 通过控制设置在相对表面上的多个发动机在分离IC器件和基底基板的气隙区域中产生气流而产生例如以倒装芯片布置在IC芯片和基底基板之间的离子风冷却 。