公开(公告)号：US20150348766A1

公开(公告)日：2015-12-03

申请号：US14443913

申请日：2013-11-19

Applicant: PARTICLE PHYSICS INSIDE PRODUCTS B.V.

Inventor： Dirk-Jan SPAANDERDAM ,  Helga Julia JUNGMANN ,  Ronald Martinus Alexander HEEREN

IPC: H01J49/00 ,  H01J49/24 ,  H01J49/02 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01J49/0004 ,  H01J49/022 ,  H01J49/025 ,  H01J49/24 ,  H05K1/02 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/11 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/09154 ,  H05K2201/09781 ,  H05K2203/1147

Abstract: An ultra-high vacuum (UHV) compatible feedthrough structure and a detector assembly using such feedthrough structure, the feedthrough structure comprising a printed circuit board (PCB) for carrying one or more detectors, wherein said PCB comprises a top surface covered with a first UHV sealing layer and one or more first electrical electrodes and at least a first thermally conductive layer extending at least partly over said top surface; and, a back surface comprising one or more second electrodes and at least a second thermally conductive layer extending at least partly over said back surface, wherein one or more conductive wires are embedded in said PCB for electrically connecting said one or more first electrodes with said one or more second electrodes respectively; and, wherein one or more thermally conductive vias are embedded in said PCB for thermally connecting said at least first thermally conductive layer with said second thermally conductive layer.

Abstract translation: 一种超高真空（UHV）兼容馈通结构和使用这种馈通结构的检测器组件，所述馈通结构包括用于承载一个或多个检测器的印刷电路板（PCB），其中所述PCB包括覆盖有第一特高压 密封层和一个或多个第一电极和至少部分地在所述顶表面上延伸的至少第一导热层; 以及包括一个或多个第二电极和至少部分地在所述背表面上延伸的至少第二导热层的后表面，其中一个或多个导电线嵌入所述PCB中以将所述一个或多个第一电极与所述 一个或多个第二电极; 并且其中一个或多个导热通孔嵌入所述PCB中，用于将所述至少第一导热层与所述第二导热层热连接。