公开(公告)号：US20240043659A1

公开(公告)日：2024-02-08

申请号：US18354873

申请日：2023-07-19

Applicant: Resonac Corporation

Inventor： Hajime FUNAHASHI ,  Hikaru SATOH ,  Hajime YUKUTAKE ,  Ikue KOBAYASHI

IPC: C08K9/08 ,  C08K9/02

CPC classification number: C08K9/08 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/006 ,  C08K2201/005 ,  C08K2201/014

Abstract: A heat conducting composition including:



a polymer component (A);
a surface-treated filler (B) obtained by surface-treating a filler with α-butyl-ω-(2-trimethoxysilylethyl)polydimethylsiloxane having a weight average molecular weight of 500 to 5,000, with the α-butyl-ω-(2-trimethoxysilylethyl)polydimethylsiloxane having an adhesion percentage to the filler of from 20.0 to 50.0% by mass; and
a silicon-containing oxide-coated nitride (C) having a nitride and a silicon-containing oxide coating that coats the nitride.

公开(公告)号：US20240327646A1

公开(公告)日：2024-10-03

申请号：US18291038

申请日：2023-06-29

Applicant: Resonac Corporation

Inventor： Ikue KOBAYASHI ,  Naoki MINORIKAWA ,  Hiroki SUGIMOTO

IPC: C09C3/00 ,  C09C1/40 ,  C09C3/04 ,  C09C3/12

CPC classification number: C09C3/006 ,  C09C1/40 ,  C09C3/043 ,  C09C3/12

Abstract: A method for producing a silicon-containing oxide-coated aluminum nitride particle that maintains the high thermal conductivity of aluminum nitride particles, have excellent moisture resistance, and do not easily aggregate. A method for producing a silicon-containing oxide-coated aluminum nitride particle including an aluminum nitride particle and a silicon-containing oxide film that covers a surface of the aluminum nitride particle. The method includes a vapor-depositing an organic silicone compound including a specific structure on the surface of the aluminum nitride particle to obtain the aluminum nitride particle covered with the organic silicone compound under a nitrogen atmosphere, and a partial pressure of the organic silicone compound in the nitrogen atmosphere is 2.6×102 to 3.9×103 Pa, and heating the aluminum nitride particle covered with the organic silicone compound at a temperature of 300° C. or higher and lower than 1000° C.

公开(公告)号：US20240059901A1

公开(公告)日：2024-02-22

申请号：US18268002

申请日：2021-10-04

Applicant: RESONAC CORPORATION

Inventor： Naoki MINORIKAWA ,  Hikaru SATOH ,  Hajime FUNAHASHI ,  Ikue KOBAYASHI ,  Hajime YUKUTAKE ,  Takeshi IEMURA

IPC: C09C3/12 ,  C08K9/06

CPC classification number: C09C3/12 ,  C08K9/06 ,  C01P2004/61 ,  C01P2006/12 ,  C01P2004/62 ,  C01P2006/32

Abstract: Provided is a method for producing a surface-treated thermally conductive filler, the method including treating the surface of the thermally conductive filler with an alkoxysilane having a specific structure by the chemical vapor deposition method.

公开(公告)号：US20230399512A1

公开(公告)日：2023-12-14

申请号：US18127704

申请日：2023-03-29

Applicant: Resonac Corporation

Inventor： Hajime FUNAHASHI ,  Hikaru SATOH ,  Hajime YUKUTAKE ,  Ikue KOBAYASHI ,  Takeshi IEMURA

IPC: C08L83/04 ,  C08K3/28 ,  C08K5/14 ,  C08K9/06

CPC classification number: C08L83/04 ,  C08K3/28 ,  C08K5/14 ,  C08K2201/014 ,  C08K2003/282 ,  C08K2201/001 ,  C08K9/06

Abstract: A thermally conductive composition contains a resin composition and a thermally conductive filler, wherein the resin composition contains a vinyl group-containing silicone resin having a viscosity ranging from 40,000 mPa·s to 200,000,000 mPa·s at 25° C. and a polysiloxane compound having at least one hydroxy group at an end, having no vinyl group, and having a weight-average molecular weight (Mw) of 10,000 or more and 20,000 or less, the mass ratio of the vinyl group-containing silicone resin to the polysiloxane compound [the vinyl group-containing silicone resin/the polysiloxane compound] is 50/50 or more and less than 90/10, the content of the thermally conductive filler ranges from 300 parts by mass to 5,000 parts by mass with respect to 100 parts by mass of the resin composition, and a cured product of the thermally conductive composition has a thermal conductivity of 1.0 W/mk or more.

公开(公告)号：US20230287213A1

公开(公告)日：2023-09-14

申请号：US18119063

申请日：2023-03-08

Applicant: RESONAC CORPORATION

Inventor： Hajime FUNAHASHI ,  Hikaru SATOH ,  Hajime YUKUTAKE ,  Ikue KOBAYASHI ,  Takeshi IEMURA

IPC: C08L75/04 ,  C08L33/08 ,  C08K3/22 ,  C08K3/28 ,  C08K9/06

CPC classification number: C08L75/04 ,  C08L33/08 ,  C08K3/22 ,  C08K3/28 ,  C08K9/06 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2201/014 ,  C08L2203/20 ,  C08K2201/003

Abstract: A thermally conductive composition containing a filler and a polymer component, wherein the filler includes a filler (A) surface-treated with a silylated castor oil derivative obtained by reacting isocyanate silane with a castor oil-based polyol.