公开(公告)号：US20240052225A1

公开(公告)日：2024-02-15

申请号：US18266973

申请日：2022-04-28

Applicant: Resonac Corporation

Inventor： Hajime YUKUTAKE ,  Hajime FUNAHASHI ,  Hikaru SATOH

IPC: C09K5/14 ,  C08G59/32 ,  C08G59/24 ,  C08G59/38 ,  C08G59/62 ,  C08G59/68 ,  C08K9/02 ,  C08K3/22 ,  H05K7/20

CPC classification number: C09K5/14 ,  C08G59/3218 ,  C08G59/245 ,  C08G59/38 ,  C08G59/621 ,  C08G59/688 ,  C08K9/02 ,  C08K3/22 ,  H05K7/209 ,  C08K2003/2227 ,  C08K2201/001

Abstract: A thermally conductive resin composition includes an epoxy resin and a thermally conductive powder. The thermally conductive powder includes aluminum nitride having a silicon-containing oxide coating on a surface thereof and another thermally conductive powder. The content of the epoxy resin is 1% by mass or more and 20% by mass or less based on the total amount of the thermally conductive resin composition. The content of the thermally conductive powder is 80% by mass or more and 99% by mass or less based on the total amount of the thermally conductive resin composition. The content of the aluminum nitride having a silicon-containing oxide coating on a surface thereof is 10% by mass or more and 70% by mass or less based on the total amount of the thermally conductive resin composition. The content of the other thermally conductive powder is 10% by mass or more and 89% by mass or less based on the total amount of the thermally conductive resin composition.

公开(公告)号：US20240043659A1

公开(公告)日：2024-02-08

申请号：US18354873

申请日：2023-07-19

Applicant: Resonac Corporation

Inventor： Hajime FUNAHASHI ,  Hikaru SATOH ,  Hajime YUKUTAKE ,  Ikue KOBAYASHI

IPC: C08K9/08 ,  C08K9/02

CPC classification number: C08K9/08 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/006 ,  C08K2201/005 ,  C08K2201/014

Abstract: A heat conducting composition including:



a polymer component (A);
a surface-treated filler (B) obtained by surface-treating a filler with α-butyl-ω-(2-trimethoxysilylethyl)polydimethylsiloxane having a weight average molecular weight of 500 to 5,000, with the α-butyl-ω-(2-trimethoxysilylethyl)polydimethylsiloxane having an adhesion percentage to the filler of from 20.0 to 50.0% by mass; and
a silicon-containing oxide-coated nitride (C) having a nitride and a silicon-containing oxide coating that coats the nitride.

公开(公告)号：US20240052224A1

公开(公告)日：2024-02-15

申请号：US18257056

申请日：2022-05-24

Applicant: Resonac Corporation

Inventor： Naoki MINORIKAWA ,  Hajime FUNAHASHI ,  Hikaru SATOH ,  Hajime YUKUTAKE

IPC: C09K5/14 ,  C09C3/00 ,  C09C3/12 ,  C09C3/08 ,  C09C1/40 ,  C08K9/06

CPC classification number: C09K5/14 ,  C09C3/006 ,  C09C3/12 ,  C09C3/08 ,  C09C1/407 ,  C08K9/06 ,  C08K2201/001

Abstract: A thermally conductive composition comprising: a filler; and a polymer component, wherein the filler comprises at least one surface-treated filler selected from the group consisting of the following filler (A) and filler (B):



Filler (A): A filler surface-treated by a chemical vapor deposition method using a siloxane having one SiH group
Filler (B): A filler surface-treated by a chemical vapor deposition method using a siloxane having two or more SiH groups, wherein at least one group selected from the group consisting of an unsubstituted alkyl group having 6 to 20 carbon atoms, an alkyl group having 2 to 20 carbon atoms having a substituent, and a group having a specific structure is further bonded to a silicon atom on a surface of the filler and introduced.

公开(公告)号：US20230287213A1

公开(公告)日：2023-09-14

申请号：US18119063

申请日：2023-03-08

Applicant: RESONAC CORPORATION

Inventor： Hajime FUNAHASHI ,  Hikaru SATOH ,  Hajime YUKUTAKE ,  Ikue KOBAYASHI ,  Takeshi IEMURA

IPC: C08L75/04 ,  C08L33/08 ,  C08K3/22 ,  C08K3/28 ,  C08K9/06

CPC classification number: C08L75/04 ,  C08L33/08 ,  C08K3/22 ,  C08K3/28 ,  C08K9/06 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2201/014 ,  C08L2203/20 ,  C08K2201/003

Abstract: A thermally conductive composition containing a filler and a polymer component, wherein the filler includes a filler (A) surface-treated with a silylated castor oil derivative obtained by reacting isocyanate silane with a castor oil-based polyol.

公开(公告)号：US20240101885A1

公开(公告)日：2024-03-28

申请号：US18272669

申请日：2022-11-02

Applicant: Resonac Corporation

Inventor： Hikaru SATOH ,  Hajime FUNAHASHI ,  Hajime YUKUTAKE

IPC: C09K5/14 ,  C08K13/06 ,  C08L83/04

CPC classification number: C09K5/14 ,  C08K13/06 ,  C08L83/04 ,  C08K2003/282 ,  C08K2201/001 ,  C08K2201/005 ,  C08K2201/006 ,  C08K2201/014

Abstract: A heat conducting composition containing a curable silicone resin (A) and 70 to 98% of a thermally conductive powder (B) containing 30 to 75% of aluminum nitride particles (B-1) having a 50% particle size of 50 to 150 μm, 10 to 30% by mass of aluminum nitride particles (B-2) having a 50% particle size of 15 to less than 50 μm, 5 to 15% of a metal oxide (B-3) other than zinc oxide having a 50% particle size of 1 to less than 20 μm, and 10 to 40% of zinc oxide (B-4) having a 50% particle size of 0.1 to less than 1 μm and a BET specific surface area of less than 9.0 m2/g. The metal oxide (B-3) and the zinc oxide (B-4) are both surface treated with a surface treatment agent selected from a silane coupling agent having an C10-C22 alkyl group and α-butyl-ω-(2-trimethoxysilylethyl)polydimethylsiloxane.

公开(公告)号：US20240026055A1

公开(公告)日：2024-01-25

申请号：US18224159

申请日：2023-07-20

Applicant: Resonac Corporation

Inventor： Hajime FUNAHASHI ,  Hikaru Satoh ,  Hajime Yukutake ,  Ikue Kobayashi

IPC: C08F292/00 ,  C08L83/04

CPC classification number: C08F292/00 ,  C08L83/04 ,  C08L2205/025 ,  C08L2205/03

Abstract: A surface-treated filler obtained by surface-treating a surface of a filler with α-butyl-ω-(2-trimethoxysilylethyl)polydimethylsiloxane having a weight average molecular weight of 500 to 5,000, wherein an adhesion percentage of the α-butyl-ω-(2-trimethoxysilylethyl)polydimethylsiloxane to the filler is from 20.0 to 50.0% by mass.

公开(公告)号：US20240059901A1

公开(公告)日：2024-02-22

申请号：US18268002

申请日：2021-10-04

Applicant: RESONAC CORPORATION

Inventor： Naoki MINORIKAWA ,  Hikaru SATOH ,  Hajime FUNAHASHI ,  Ikue KOBAYASHI ,  Hajime YUKUTAKE ,  Takeshi IEMURA

IPC: C09C3/12 ,  C08K9/06

CPC classification number: C09C3/12 ,  C08K9/06 ,  C01P2004/61 ,  C01P2006/12 ,  C01P2004/62 ,  C01P2006/32

Abstract: Provided is a method for producing a surface-treated thermally conductive filler, the method including treating the surface of the thermally conductive filler with an alkoxysilane having a specific structure by the chemical vapor deposition method.

公开(公告)号：US20230399512A1

公开(公告)日：2023-12-14

申请号：US18127704

申请日：2023-03-29

Applicant: Resonac Corporation

Inventor： Hajime FUNAHASHI ,  Hikaru SATOH ,  Hajime YUKUTAKE ,  Ikue KOBAYASHI ,  Takeshi IEMURA

IPC: C08L83/04 ,  C08K3/28 ,  C08K5/14 ,  C08K9/06

CPC classification number: C08L83/04 ,  C08K3/28 ,  C08K5/14 ,  C08K2201/014 ,  C08K2003/282 ,  C08K2201/001 ,  C08K9/06

Abstract: A thermally conductive composition contains a resin composition and a thermally conductive filler, wherein the resin composition contains a vinyl group-containing silicone resin having a viscosity ranging from 40,000 mPa·s to 200,000,000 mPa·s at 25° C. and a polysiloxane compound having at least one hydroxy group at an end, having no vinyl group, and having a weight-average molecular weight (Mw) of 10,000 or more and 20,000 or less, the mass ratio of the vinyl group-containing silicone resin to the polysiloxane compound [the vinyl group-containing silicone resin/the polysiloxane compound] is 50/50 or more and less than 90/10, the content of the thermally conductive filler ranges from 300 parts by mass to 5,000 parts by mass with respect to 100 parts by mass of the resin composition, and a cured product of the thermally conductive composition has a thermal conductivity of 1.0 W/mk or more.

公开(公告)号：US20230313017A1

公开(公告)日：2023-10-05

申请号：US18127720

申请日：2023-03-29

Applicant: Resonac Corporation

Inventor： Hajime FUNAHASHI ,  Hikaru Satoh ,  Hajime Yukutake ,  Ikue Kobayashi ,  Takeshi Iemura

IPC: C09K5/14 ,  C08L83/04

CPC classification number: C09K5/14 ,  C08L83/04 ,  C08L2205/025 ,  C08L2203/20 ,  C08L2201/08

Abstract: A thermally conductive composition contains a resin composition and a thermally conductive filler, wherein the resin composition contains a liquid silicone resin having a viscosity ranging from 20 mPa·s to 200,000,000 mPa·s at 25° C. as measured according to JIS Z8803:2011 and a polysiloxane compound having at least one hydroxy group not directly bound to a silicon atom at an end, and having no vinyl group; the mass ratio of the liquid silicone resin to the polysiloxane compound [the liquid silicone resin/the polysiloxane compound] is 50/50 or more and less than 90/10, the content of the thermally conductive filler ranges from 300 parts by mass to 5,000 parts by mass with respect to 100 parts by mass of the resin composition, and a cured product of the thermally conductive composition has a thermal conductivity of 1.0 W/mk or more as measured according to ISO22007-2.