公开(公告)号：US20230287213A1

公开(公告)日：2023-09-14

申请号：US18119063

申请日：2023-03-08

Applicant: RESONAC CORPORATION

Inventor： Hajime FUNAHASHI ,  Hikaru SATOH ,  Hajime YUKUTAKE ,  Ikue KOBAYASHI ,  Takeshi IEMURA

IPC: C08L75/04 ,  C08L33/08 ,  C08K3/22 ,  C08K3/28 ,  C08K9/06

CPC classification number: C08L75/04 ,  C08L33/08 ,  C08K3/22 ,  C08K3/28 ,  C08K9/06 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2201/014 ,  C08L2203/20 ,  C08K2201/003

Abstract: A thermally conductive composition containing a filler and a polymer component, wherein the filler includes a filler (A) surface-treated with a silylated castor oil derivative obtained by reacting isocyanate silane with a castor oil-based polyol.

公开(公告)号：US20240059901A1

公开(公告)日：2024-02-22

申请号：US18268002

申请日：2021-10-04

Applicant: RESONAC CORPORATION

Inventor： Naoki MINORIKAWA ,  Hikaru SATOH ,  Hajime FUNAHASHI ,  Ikue KOBAYASHI ,  Hajime YUKUTAKE ,  Takeshi IEMURA

IPC: C09C3/12 ,  C08K9/06

CPC classification number: C09C3/12 ,  C08K9/06 ,  C01P2004/61 ,  C01P2006/12 ,  C01P2004/62 ,  C01P2006/32

Abstract: Provided is a method for producing a surface-treated thermally conductive filler, the method including treating the surface of the thermally conductive filler with an alkoxysilane having a specific structure by the chemical vapor deposition method.

公开(公告)号：US20230399512A1

公开(公告)日：2023-12-14

申请号：US18127704

申请日：2023-03-29

Applicant: Resonac Corporation

Inventor： Hajime FUNAHASHI ,  Hikaru SATOH ,  Hajime YUKUTAKE ,  Ikue KOBAYASHI ,  Takeshi IEMURA

IPC: C08L83/04 ,  C08K3/28 ,  C08K5/14 ,  C08K9/06

CPC classification number: C08L83/04 ,  C08K3/28 ,  C08K5/14 ,  C08K2201/014 ,  C08K2003/282 ,  C08K2201/001 ,  C08K9/06

Abstract: A thermally conductive composition contains a resin composition and a thermally conductive filler, wherein the resin composition contains a vinyl group-containing silicone resin having a viscosity ranging from 40,000 mPa·s to 200,000,000 mPa·s at 25° C. and a polysiloxane compound having at least one hydroxy group at an end, having no vinyl group, and having a weight-average molecular weight (Mw) of 10,000 or more and 20,000 or less, the mass ratio of the vinyl group-containing silicone resin to the polysiloxane compound [the vinyl group-containing silicone resin/the polysiloxane compound] is 50/50 or more and less than 90/10, the content of the thermally conductive filler ranges from 300 parts by mass to 5,000 parts by mass with respect to 100 parts by mass of the resin composition, and a cured product of the thermally conductive composition has a thermal conductivity of 1.0 W/mk or more.