公开(公告)号：US20150062854A1

公开(公告)日：2015-03-05

申请号：US14273432

申请日：2014-05-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Yong CHOI ,  II Hyeong LEE ,  Jae Cheon DOH

IPC: H05K1/14 ,  H05K3/30 ,  H05K1/18

CPC classification number: H05K1/144 ,  H01L21/561 ,  H01L23/3128 ,  H01L23/50 ,  H01L23/5383 ,  H01L23/5385 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19106 ,  H05K3/28 ,  H05K3/288 ,  H05K2201/041 ,  H05K2201/10303 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/2018 ,  H05K2203/025 ,  H05K2203/1327 ,  Y10T29/4913 ,  H01L2224/81 ,  H01L2924/00

Abstract: There are provided an electronic component module in which electronic components are mounted on both surfaces of a substrate to increase integration density, and a method of manufacturing the same, the electronic component module including a first substrate; a plurality of electronic components mounted on both surfaces of the first substrate; a second substrate bonded to a lower surface of the first substrate; and a molded part formed on the lower surface of the first substrate and having the second substrate embedded therein.

Abstract translation: 提供一种电子部件模块，其中电子部件安装在基板的两个表面上以提高集成密度，以及其制造方法，所述电子部件模块包括第一基板; 安装在所述第一基板的两个表面上的多个电子部件; 第二基板，其结合到所述第一基板的下表面; 以及形成在第一基板的下表面上并且嵌入其中的第二基板的模制部件。