公开(公告)号：US20180270997A1

公开(公告)日：2018-09-20

申请号：US15919257

申请日：2018-03-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chang Joon LEE ,  Yong Won LEE ,  Hyun Tae JANG

IPC: H05K9/00 ,  H05K1/18

CPC classification number: H05K9/0024 ,  H05K1/0216 ,  H05K1/0243 ,  H05K1/111 ,  H05K1/181 ,  H05K9/0028 ,  H05K9/0033 ,  H05K2201/10159 ,  H05K2201/10371 ,  H05K2201/10545 ,  H05K2201/1056

Abstract: An electronic device includes a printed circuit board (PCB) including a first surface, a second surface facing a direction opposite the first surface, and a side surface surrounding a space between the first surface and the second surface, at least one component disposed on the first surface, a shield can surrounding the at least one component and a partial area of the PCB, and an adhesive that bonds the shield can and the first surface, and that bonds the shield can and the second surface, and at least a portion of the shield can does not bond with the side surface.