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公开(公告)号：US20160044835A1
公开(公告)日：2016-02-11
申请号：US14813448
申请日：2015-07-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Yong Won LEE , Hyun-Tae JANG , Jung Je BANG
CPC classification number: H05K1/0216 , G06F1/18 , H05K1/181 , H05K9/0032 , H05K2201/09972 , H05K2201/10371
Abstract: A printed circuit board (PCB) assembly includes a PCB, electronic components mounted on the PCB, a shield can provided to block electromagnetic waves of the electronic components, and an insulating layer provided to prevent an electrical short between the electronic components and the shield can, and the insulating layer is sprayed and formed on the shield can. The insulating layer which is sprayed and formed on the shield can does not have an adhesive layer, and thus the thickness thereof can be remarkably reduced compared to insulating materials requiring an adhesive layer.
Abstract translation: 印刷电路板（PCB）组件包括PCB，安装在PCB上的电子部件，可以设置用于阻挡电子部件的电磁波的屏蔽罩，以及用于防止电子部件和屏蔽壳之间的电短路的绝缘层 并且绝缘层被喷涂并形成在屏蔽罐上。 在屏蔽罩上喷涂形成的绝缘层不具有粘合剂层，因此与需要粘合剂层的绝缘材料相比，其厚度可以显着降低。
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公开(公告)号：US20180270997A1
公开(公告)日：2018-09-20
申请号：US15919257
申请日：2018-03-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Chang Joon LEE , Yong Won LEE , Hyun Tae JANG
CPC classification number: H05K9/0024 , H05K1/0216 , H05K1/0243 , H05K1/111 , H05K1/181 , H05K9/0028 , H05K9/0033 , H05K2201/10159 , H05K2201/10371 , H05K2201/10545 , H05K2201/1056
Abstract: An electronic device includes a printed circuit board (PCB) including a first surface, a second surface facing a direction opposite the first surface, and a side surface surrounding a space between the first surface and the second surface, at least one component disposed on the first surface, a shield can surrounding the at least one component and a partial area of the PCB, and an adhesive that bonds the shield can and the first surface, and that bonds the shield can and the second surface, and at least a portion of the shield can does not bond with the side surface.
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