公开(公告)号：US09137897B2

公开(公告)日：2015-09-15

申请号：US14086465

申请日：2013-11-21

Applicant: Seiko Instruments Inc.

Inventor： Atsushi Kozuki

IPC: H01L41/00 ,  H05K1/18 ,  H05K1/03 ,  H03H9/10 ,  H05K3/40 ,  H01L41/29 ,  H05K3/24 ,  H01L23/15 ,  H01L23/498

CPC classification number: H05K1/0306 ,  H01L23/15 ,  H01L23/49827 ,  H01L41/29 ,  H01L2924/0002 ,  H03H9/1014 ,  H03H9/1021 ,  H03H9/1057 ,  H05K3/243 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/10083 ,  H05K2203/072 ,  H05K2203/1147 ,  Y10T29/4913 ,  H01L2924/00

Abstract: An electronic device includes a glass substrate, an electronic element mounted on one surface of the glass substrate, a cover body covering the electronic element and bonded to the glass substrate and a through electrode penetrating from one surface to the other surface of the glass substrate. The through electrode is composed of an iron-nickel based alloy and; and a nickel film is formed on an end face of the through electrode exposing on the other surface of the glass substrate and on the other surface of the glass substrate located in the vicinity of the end face.

Abstract translation: 电子设备包括玻璃基板，安装在玻璃基板的一个表面上的电子元件，覆盖电子元件并结合到玻璃基板的盖体和从玻璃基板的一个表面延伸到另一个表面的通孔。 贯通电极由铁 - 镍基合金构成， 并且在所述透光电极的端面上形成镍膜，所述端面在所述玻璃基板的另一面上露出，并位于位于所述端面附近的所述玻璃基板的另一面上。

公开(公告)号：US09711707B2

公开(公告)日：2017-07-18

申请号：US14161167

申请日：2014-01-22

Applicant: Seiko Instruments Inc.

Inventor： Atsushi Kozuki

IPC: H01L41/053 ,  H03H9/10 ,  H03H3/007 ,  H01L41/23 ,  H01L41/293 ,  H01L41/29 ,  H01L41/047 ,  H01L41/297 ,  H03H3/02 ,  H01L23/48 ,  H01L21/768

CPC classification number: H01L41/0533 ,  H01L21/76898 ,  H01L23/481 ,  H01L41/0477 ,  H01L41/053 ,  H01L41/23 ,  H01L41/29 ,  H01L41/293 ,  H01L41/297 ,  H01L2924/00 ,  H01L2924/0002 ,  H03H3/007 ,  H03H9/10 ,  H03H9/1014 ,  H03H9/1021 ,  H03H9/105 ,  H03H9/1057 ,  H03H9/1071 ,  H03H9/1092 ,  H03H2003/022 ,  Y10T29/42 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A method for manufacturing an electronic device includes a through electrode forming step of forming a through electrode on an insulating base substrate; an electronic element mounting step of mounting an electronic element on one surface of the base substrate; a cover body placing step of bonding a cover body accommodating the electronic element; a conductive film forming step of forming a conductive film on the other surface of the base substrate and on an end face of the through electrode exposing on the other surface; an electrode pattern forming step of forming an electrode pattern on the end face of the through electrode and on the surface of the periphery of the end face while leaving the conductive film; and an external electrode forming step of forming an external electrode by accumulating an electroless plated film on the surface of the electrode pattern by an electroless plating method.

公开(公告)号：US10076031B2

公开(公告)日：2018-09-11

申请号：US14519331

申请日：2014-10-21

Applicant: SEIKO INSTRUMENTS INC.

Inventor： Atsushi Kozuki ,  Hideshi Hamada ,  Yoshifumi Yoshida

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/00 ,  H05K1/18 ,  H05K1/09 ,  H05K3/40 ,  B81B7/00 ,  H05K1/03 ,  H05K3/10 ,  H01L23/055

CPC classification number: H05K1/09 ,  B81B7/007 ,  H01L23/055 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2924/00014 ,  H01L2924/16152 ,  H05K1/0306 ,  H05K1/181 ,  H05K3/108 ,  H05K3/4007 ,  H05K3/4046 ,  H05K2201/0338 ,  H05K2201/0347 ,  H05K2201/10287 ,  H01L2224/0401

Abstract: An electronic device includes an insulating base substrate having a through electrode, an electronic element provided on one surface of the insulating base substrate and connected to the through electrode, a lid provided on the one surface of the insulating base substrate, and an external electrode covering an end face of the through electrode that is exposed on another surface of the insulating base substrate different from the one surface thereof. The external electrode has a conductive film, a first electrolytic plating film provided on the conductive film, and a second electrolytic plating film provided on the first electrolytic plating film. The conductive film is provided on the exposed end face of the through electrode and on portions of the another surface of the insulating base substrate in the vicinity of the exposed end face of the through electrode.

公开(公告)号：US09526181B2

公开(公告)日：2016-12-20

申请号：US14519327

申请日：2014-10-21

Applicant: SEIKO INSTRUMENTS INC.

Inventor： Atsushi Kozuki ,  Hideshi Hamada ,  Yoshifumi Yoshida

IPC: H01R9/00 ,  H05K3/24 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K3/247 ,  H01L2224/16225 ,  H01L2924/16152 ,  H05K1/092 ,  H05K1/113 ,  H05K2201/035

Abstract: An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed, an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate, a lid which accommodates the electronic element and is bonded to the one surface of the base substrate, and an external electrode which covers a region from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in the vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, and a paste film which covers a surface of the conductive film and is formed of a conductive paste. The paste film is formed by a printing method and is formed of tin or a tin alloy.

Abstract translation: 本发明的电子设备包括：绝缘基底，其中形成有多个通孔，电连接到贯通电极并安装在基底基片的一个表面上的电子元件，容纳电子元件的盖子 并且结合到基底基板的一个表面，并且外部电极覆盖由基底基板的另一个表面暴露的通孔的端面的区域附近的另一个表面 端面。 外部电极包括覆盖从端面附近的端面到另一表面的区域的导电膜，以及覆盖导电膜的表面并由导电膏形成的糊状膜。 糊状膜通过印刷法形成，并由锡或锡合金形成。