公开(公告)号：US20240304596A1

公开(公告)日：2024-09-12

申请号：US18179072

申请日：2023-03-06

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Dukyong LEE ,  Hao YAN ,  Kun FENG

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L2224/27003 ,  H01L2224/2711 ,  H01L2224/2732 ,  H01L2224/27418 ,  H01L2224/27438 ,  H01L2224/277 ,  H01L2224/27848 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/83101 ,  H01L2224/83104 ,  H01L2224/83201 ,  H01L2224/8384

Abstract: Implementations of a sintering film frame may include a frame including an outer perimeter and an inner perimeter, the inner perimeter defining an opening through the frame; a position detection opening through the frame; at least two alignment holes through the frame; and a frame identifier on a side of the frame.

公开(公告)号：US20240234246A1

公开(公告)日：2024-07-11

申请号：US18616351

申请日：2024-03-26

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Seungwon IM ,  Oseob JEON ,  Byoungok LEE ,  Yoonsoo LEE ,  Joonseo SON ,  Dukyong LEE ,  Changyoung PARK

IPC: H01L23/433 ,  H01L23/13 ,  H01L23/24 ,  H01L23/473 ,  H01L23/495 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/433 ,  H01L23/13 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49568 ,  H01L23/49861 ,  H01L25/0657 ,  H01L23/24 ,  H01L2224/33

Abstract: Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.

公开(公告)号：US20220093487A1

公开(公告)日：2022-03-24

申请号：US17457100

申请日：2021-12-01

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Seungwon IM ,  Oseob JEON ,  Byoungok LEE ,  Yoonsoo LEE ,  Joonseo SON ,  Dukyong LEE ,  Changyoung PARK

IPC: H01L23/433 ,  H01L23/13 ,  H01L23/473 ,  H01L23/498 ,  H01L25/065 ,  H01L23/495

Abstract: Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.

公开(公告)号：US20200335414A1

公开(公告)日：2020-10-22

申请号：US15929662

申请日：2020-05-14

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jerome TEYSSEYRE ,  Roveendra PAUL ,  Dukyong LEE

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/40

Abstract: In one general aspect, an apparatus can include a module including a semiconductor die. The apparatus can include a heatsink coupled to the module and including a substrate, and a plurality of protrusions. The apparatus includes a cover defining a channel where the channel is outside of the module and the plurality of protrusions of the heatsink are disposed within the channel, and a sealing mechanism is disposed between the cover and the module is in contact with the module.

公开(公告)号：US20240088007A1

公开(公告)日：2024-03-14

申请号：US17931665

申请日：2022-09-13

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jonghwan BAEK ,  Jeonghyuk PARK ,  Seungwon IM ,  Keunhyuk LEE ,  Dukyong LEE

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L25/00 ,  H01L25/16

CPC classification number: H01L23/49833 ,  H01L21/4825 ,  H01L21/4839 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49844 ,  H01L23/49861 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/162 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/48139 ,  H01L2224/48145 ,  H01L2224/48175 ,  H01L2224/48225 ,  H01L2224/73265 ,  H01L2924/12036 ,  H01L2924/13055

Abstract: A package includes a first direct bonded metal (DBM) substrate, a first semiconductor die disposed on a top surface of the first DBM substrate, a second DBM substrate disposed at a height above the first DBM substrate, and a second semiconductor die disposed on a top surface of the second DBM substrate. A wire bond is made between the first semiconductor die disposed on the top surface of the first DBM substrate and the second semiconductor die disposed on the top surface of the second DBM substrate.

公开(公告)号：US20200185305A1

公开(公告)日：2020-06-11

申请号：US16790933

申请日：2020-02-14

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Seungwon IM ,  Oseob JEON ,  Byoungok LEE ,  Yoonsoo LEE ,  Joonseo SON ,  Dukyong LEE ,  Changyoung PARK

IPC: H01L23/433 ,  H01L25/065 ,  H01L23/498 ,  H01L23/13 ,  H01L23/495 ,  H01L23/473

Abstract: Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.

公开(公告)号：US20230230895A1

公开(公告)日：2023-07-20

申请号：US18186842

申请日：2023-03-20

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jerome TEYSSEYRE ,  Roveendra PAUL ,  Dukyong LEE

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/40

CPC classification number: H01L23/3675 ,  H01L23/3735 ,  H01L23/4006 ,  H01L2023/4087 ,  H01L2023/405 ,  H01L2023/4056 ,  H01L2023/4031

Abstract: In one general aspect, an apparatus can include a first module including a first semiconductor die, and a first heatsink coupled to the first module where the first heatsink includes a substrate and a first plurality of protrusions. The apparatus can also include a second module including a second semiconductor die, and a second heatsink coupled to the second module and including a second plurality of protrusions. The apparatus can also include a cover defining a channel where the first plurality of protrusions of the first heatsink and the second plurality of protrusions of the second heatsink are disposed within the channel.

公开(公告)号：US20190341327A1

公开(公告)日：2019-11-07

申请号：US15968353

申请日：2018-05-01

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Jerome TEYSSEYRE ,  Roveendra PAUL ,  Dukyong LEE

IPC: H01L23/367 ,  H01L23/373 ,  H01L23/40

Abstract: In one general aspect, an apparatus can include a module including a semiconductor die. The apparatus can include a heatsink coupled to the module and including a substrate, and a plurality of protrusions. The apparatus can include a cover including a channel where the plurality of protrusions of the heatsink are disposed within the channel, and can include a sealing mechanism disposed between the cover and the module.

公开(公告)号：US20180315681A1

公开(公告)日：2018-11-01

申请号：US15714539

申请日：2017-09-25

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Seungwon IM ,  Oseob JEON ,  Byoungok LEE ,  Yoonsoo LEE ,  Joonseo SON ,  Dukyong LEE ,  Changyoung PARK

IPC: H01L23/433 ,  H01L23/24 ,  H01L25/065 ,  H01L23/498 ,  H01L23/13

Abstract: Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.