公开(公告)号：US20240234246A1

公开(公告)日：2024-07-11

申请号：US18616351

申请日：2024-03-26

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Seungwon IM ,  Oseob JEON ,  Byoungok LEE ,  Yoonsoo LEE ,  Joonseo SON ,  Dukyong LEE ,  Changyoung PARK

IPC: H01L23/433 ,  H01L23/13 ,  H01L23/24 ,  H01L23/473 ,  H01L23/495 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/433 ,  H01L23/13 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49568 ,  H01L23/49861 ,  H01L25/0657 ,  H01L23/24 ,  H01L2224/33

Abstract: Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.

公开(公告)号：US20220093487A1

公开(公告)日：2022-03-24

申请号：US17457100

申请日：2021-12-01

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Seungwon IM ,  Oseob JEON ,  Byoungok LEE ,  Yoonsoo LEE ,  Joonseo SON ,  Dukyong LEE ,  Changyoung PARK

IPC: H01L23/433 ,  H01L23/13 ,  H01L23/473 ,  H01L23/498 ,  H01L25/065 ,  H01L23/495

Abstract: Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.

公开(公告)号：US20200185305A1

公开(公告)日：2020-06-11

申请号：US16790933

申请日：2020-02-14

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Seungwon IM ,  Oseob JEON ,  Byoungok LEE ,  Yoonsoo LEE ,  Joonseo SON ,  Dukyong LEE ,  Changyoung PARK

IPC: H01L23/433 ,  H01L25/065 ,  H01L23/498 ,  H01L23/13 ,  H01L23/495 ,  H01L23/473

Abstract: Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.

公开(公告)号：US20180315681A1

公开(公告)日：2018-11-01

申请号：US15714539

申请日：2017-09-25

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Seungwon IM ,  Oseob JEON ,  Byoungok LEE ,  Yoonsoo LEE ,  Joonseo SON ,  Dukyong LEE ,  Changyoung PARK

IPC: H01L23/433 ,  H01L23/24 ,  H01L25/065 ,  H01L23/498 ,  H01L23/13

Abstract: Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.

公开(公告)号：US20240266252A1

公开(公告)日：2024-08-08

申请号：US18165504

申请日：2023-02-07

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Oseob JEON ,  Yoonsoo LEE ,  Bosung WON ,  Youngsun KO

IPC: H01L23/473 ,  H01L23/367 ,  H01L23/49 ,  H05K7/20

CPC classification number: H01L23/473 ,  H01L23/3672 ,  H01L23/49 ,  H05K7/20509

Abstract: Implementations of a dual sided cooling module may include a high side module coupled over a low side module through a coupling heat sink at a first largest planar surface of the high side module and at a first largest planar surface of the low side module; a high side heat sink coupled at a second largest planar surface of the high side module; and a low side heat sink coupled at a second largest planar surface of the low side module. A single cooling fluid may contact the coupling heat sink, the high side heat sink, and the low side heat sink.

公开(公告)号：US20240162117A1

公开(公告)日：2024-05-16

申请号：US18055123

申请日：2022-11-14

Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

Inventor： Yoonsoo LEE ,  Seungwon IM ,  Oseob JEON

IPC: H01L23/473 ,  H01L25/00 ,  H01L25/07 ,  H01L25/18

CPC classification number: H01L23/473 ,  H01L25/071 ,  H01L25/18 ,  H01L25/50

Abstract: A package includes a frame having a cooling fluid channel therethrough. The frame has at least one opening in a first sidewall alongside the cooling fluid channel and at least one opening in a second sidewall alongside the cooling fluid channel. A first power electronics module covers the at least one opening in the first sidewall with a surface of a substrate in the first power electronics module being exposed to the cooling fluid channel in the frame through the at least one opening in the first sidewall, and a second power electronics module covers the at least one opening in the second sidewall with a surface of a substrate in the second electronics module being exposed to the cooling fluid channel in the frame through the at least one opening in the second sidewall.