公开(公告)号：US10830972B2

公开(公告)日：2020-11-10

申请号：US16072229

申请日：2016-12-20

Applicant: SONY CORPORATION

Inventor： Eiji Otani ,  Shuichi Oka ,  Hiizu Ootorii

IPC: G02B6/42 ,  H01L31/02 ,  G02B6/43

Abstract: An optical connector includes a core block, a flexible wiring board, an optical device array, a drive circuit, and a housing. The core block has a plurality of faces. The flexible wiring board has an external connection terminal, a first area arranged on a first face of the core block, and a second area arranged on a second face of the core block. The optical device array is mounted on the first area of the flexible wiring board and includes at least one group of a plurality of optical devices for transmission and a plurality of optical devices for reception arranged. The drive circuit is mounted on the second area of the flexible wiring board and drives the optical device array. The housing stores the core block, the optical device array, and the drive circuit such that the external connection terminal of the flexible wiring board is arranged outside the housing.

公开(公告)号：US10168498B2

公开(公告)日：2019-01-01

申请号：US15477527

申请日：2017-04-03

Applicant: Sony Corporation

Inventor： Shinji Rokuhara ,  Shusaku Yanagawa ,  Eiji Otani ,  Shuichi Oka ,  Kazunao Oniki ,  Hiizu Ootorii

IPC: H01L31/0232 ,  G02B6/42 ,  H01S5/00 ,  G02B6/43 ,  H01L31/0203 ,  H04Q11/00

Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.

公开(公告)号：US09614347B2

公开(公告)日：2017-04-04

申请号：US14539260

申请日：2014-11-12

Applicant: Sony Corporation

Inventor： Shinji Rokuhara ,  Shusaku Yanagawa ,  Eiji Otani ,  Shuichi Oka ,  Kazunao Oniki ,  Hiizu Ootorii

IPC: H01L31/0232 ,  H01S5/00 ,  G02B6/42 ,  H01L31/0203

CPC classification number: G02B6/4257 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/428 ,  G02B6/43 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2224/05599 ,  H01L2924/00014 ,  H01S5/005 ,  H04Q2011/0041

Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.

公开(公告)号：US20150145086A1

公开(公告)日：2015-05-28

申请号：US14539260

申请日：2014-11-12

Applicant: Sony Corporation

Inventor： Shinji Rokuhara ,  Shusaku Yanagawa ,  Eiji Otani ,  Shuichi Oka ,  Kazunao Oniki ,  Hiizu Ootorii

IPC: H01L31/16 ,  H01S5/00 ,  H01L31/02 ,  H01L31/0232

CPC classification number: G02B6/4257 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/428 ,  G02B6/43 ,  H01L31/0203 ,  H01L31/0232 ,  H01L2224/05599 ,  H01L2924/00014 ,  H01S5/005 ,  H04Q2011/0041

Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.

Abstract translation: 公开了一种光通信装置，接收装置，发送装置和发送和接收系统。 光通信装置包括驱动电路基板。 第一通孔延伸穿过驱动电路基板，并且被配置为将设置在驱动电路基板的第一表面侧的光学元件电连接到设置在驱动电路基板的第二表面侧上的驱动电路。 定位元件附接到插入器基板，并且被配置为使安装到透镜基板的第一透镜的光轴对准并且面对设置在驱动电路基板的第一表面侧上的第二透镜。 第二通孔延伸穿过插入器基板，并将驱动电路电连接到设置在位于插入器基板上方的信号处理基板上的信号处理电路。

公开(公告)号：US10410884B2

公开(公告)日：2019-09-10

申请号：US15634976

申请日：2017-06-27

Applicant: Sony Corporation

Inventor： Shun Mitarai ,  Shusaku Yanagawa ,  Shinji Rokuhara ,  Shuichi Oka

IPC: H01L21/48 ,  H05K1/11 ,  H05K1/18 ,  H05K3/10 ,  H05K3/30 ,  H05K3/46 ,  H01L27/12 ,  H01L23/15 ,  H01L23/538 ,  H01L23/373 ,  H01L23/498 ,  H05K3/42 ,  H01L27/32 ,  G02F1/1362

Abstract: A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrate and is patterned, forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed, and filling an electrode material in a hole formed by removing the alteration layer, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and the wiring on a back surface side thereof.

公开(公告)号：US20190094477A1

公开(公告)日：2019-03-28

申请号：US16199908

申请日：2018-11-26

Applicant: Sony Corporation

Inventor： Shinji Rokuhara ,  Shusaku Yanagawa ,  Eiji Otani ,  Shuichi Oka ,  Kazunao Oniki ,  Hiizu Ootorii

IPC: G02B6/42 ,  H01L31/0232 ,  H01S5/00 ,  G02B6/43 ,  H04Q11/00 ,  H01L31/0203

Abstract: An optical communication device, reception apparatus, transmission apparatus and transmission and reception system are disclosed. The optical communication device includes a drive circuit substrate. A first through via extends through the drive circuit substrate and is configured to electrically connect an optical element disposed on a first surface side of the drive circuit substrate to a drive circuit disposed on a second surface side of the drive circuit substrate. A positioning element is attached to an interposer substrate and is configured to align optical axes of a first lens that is attached to a lens substrate and that faces a second lens that is disposed on the first surface side of the drive circuit substrate. A second through via extends through the interposer substrate and electrically connects the drive circuit to a signal processing circuit disposed on a signal processing substrate positioned above the interposer substrate.

公开(公告)号：US20170103944A1

公开(公告)日：2017-04-13

申请号：US15278798

申请日：2016-09-28

Applicant: FUJITSU LIMITED ,  SONY CORPORATION

Inventor： Kei FUKUI ,  Kazuya Arai ,  Koji Komemura ,  Kazuhiko Iijima ,  Kenichiro Abe ,  Shinji Rokuhara ,  Shuichi Oka

IPC: H01L23/498 ,  H05K1/11 ,  H05K1/09 ,  H01L21/683 ,  H05K3/46 ,  H05K3/40 ,  H05K3/00 ,  H01L21/48 ,  H05K1/02 ,  H05K3/02

CPC classification number: H01L23/49838 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68386 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K1/144 ,  H05K1/162 ,  H05K3/002 ,  H05K3/0026 ,  H05K3/02 ,  H05K3/4038 ,  H05K3/429 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/041 ,  H05K2201/096 ,  H05K2201/10371 ,  H05K2203/0156

Abstract: A wiring substrate includes a laminated sheet including a first conductor pattern, an inorganic dielectric layer, and a second conductor pattern. The first conductor pattern, the inorganic dielectric layer, and the second conductor pattern are laminated in this order. Also, the first conductor pattern is divided into a plurality of regions.

公开(公告)号：US09257395B2

公开(公告)日：2016-02-09

申请号：US14306432

申请日：2014-06-17

Applicant: Sony Corporation

Inventor： Izuho Hatada ,  Hiizu Ootorii ,  Shuichi Oka ,  Shusaku Yanagawa

IPC: H01L23/52 ,  H01L23/48 ,  H01L23/552

CPC classification number: H01L23/552 ,  H01L23/13 ,  H01L23/3157 ,  H01L23/49838 ,  H01L24/05 ,  H01L24/13 ,  H01L24/799 ,  H01L24/98 ,  H01L29/0657 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05111 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05184 ,  H01L2224/05548 ,  H01L2224/05552 ,  H01L2224/05568 ,  H01L2224/05583 ,  H01L2224/05611 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05669 ,  H01L2224/05684 ,  H01L2224/0603 ,  H01L2224/0612 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/17106 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014

Abstract: A semiconductor device includes a base substrate on which a substrate electrode is arranged, and a semiconductor element which includes a chip electrode electrically connected via solder to the substrate electrode and in which a light absorbing layer is formed on a lower surface side.

Abstract translation: 半导体器件包括其上布置有衬底电极的基底衬底，以及包括通过焊料与衬底电极电连接并且在下表面侧形成有光吸收层的芯片电极的半导体元件。

公开(公告)号：US20170287823A1

公开(公告)日：2017-10-05

申请号：US15510430

申请日：2015-09-08

Applicant: Sony Corporation

Inventor： Kiwamu Adachi ,  Katsuji Matsumoto ,  Takeshi Kodama ,  Shuichi Oka ,  Hiizu Ootorii ,  Kazunari Saitou ,  Kei Satou

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L23/12

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L23/12 ,  H01L24/11 ,  H01L24/17 ,  H01L2224/11825 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2224/92244

Abstract: A method of manufacturing a mounting substrate according to an embodiment of the present technology includes the following three steps:(1) a step of forming a plurality of electrodes on a semiconductor layer, and thereafter forming one of solder bumps at a position facing each of the electrodes;(2) a step of covering the solder bumps with a coating layer, and thereafter selectively etching the semiconductor layer with use of the coating layer as a mask to separate the semiconductor layer into a plurality of elements; and(3) a step of removing the coating layer, and thereafter mounting the elements on a wiring substrate to direct the solder bumps toward the wiring substrate, thereby forming the mounting substrate.

公开(公告)号：US09723724B2

公开(公告)日：2017-08-01

申请号：US14327389

申请日：2014-07-09

Applicant: Sony Corporation

Inventor： Shun Mitarai ,  Shusaku Yanagawa ,  Shinji Rokuhara ,  Shuichi Oka

IPC: H05K1/16 ,  H05K3/10 ,  H05K1/11 ,  H05K1/18 ,  H05K3/30 ,  H01L27/12 ,  H01L23/15 ,  H01L21/48 ,  H01L23/538 ,  H05K3/42 ,  H05K3/46 ,  H01L27/32

CPC classification number: H01L21/486 ,  G02F1/136286 ,  H01L23/15 ,  H01L23/373 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/5389 ,  H01L27/1218 ,  H01L27/124 ,  H01L27/3276 ,  H01L2224/16225 ,  H01L2224/73253 ,  H05K1/115 ,  H05K1/185 ,  H05K1/186 ,  H05K3/10 ,  H05K3/30 ,  H05K3/42 ,  H05K3/4605 ,  H05K3/4697 ,  Y10T29/4913 ,  Y10T29/49155

Abstract: A method of manufacturing a wiring substrate that has a wiring including a through glass via and is formed of a glass substrate includes forming an alteration layer that penetrates the wiring substrate and is patterned, forming the wiring on a front surface of the wiring substrate in which the alteration layer has been formed, and filling an electrode material in a hole formed by removing the alteration layer, thereby forming the through glass via that connects the wiring on the front surface of the wiring substrate and the wiring on a back surface side thereof.