公开(公告)号：US3628095A

公开(公告)日：1971-12-14

申请号：US3628095D

申请日：1970-12-02

Applicant: SPERRY RAND CORP

Inventor： SCHWARTZ LEON ,  SIMON WILLIAM F

IPC: H05K1/02 ,  H05K3/34 ,  H05K1/04

CPC classification number: H05K1/0263 ,  H05K3/3447 ,  H05K2201/10272 ,  H05K2201/10689

Abstract: There is disclosed herein an arrangement for connecting and holding a power distribution bus to a printed circuit board. The bus incorporates flat pads which extend from and are coplanar with it. An oversized hole in each respective pad is provided so that the respective bus may be oriented over an existing plated through hole in the printed circuit board. The leads of an integrated circuit package required to be connected to the voltage or ground potential elements of the power distribution bus are positioned both through the oversized hole of the pad and the plated through hole of the printed circuit board. The connection is made permanent by soldering.

公开(公告)号：US3509268A

公开(公告)日：1970-04-28

申请号：US3509268D

申请日：1967-04-10

Applicant: SPERRY RAND CORP

Inventor： SCHWARTZ LEON ,  FRADETTE REAL J

IPC: H01R12/51 ,  H05K3/30 ,  H05K3/40 ,  H05K3/46 ,  H05K3/36 ,  H05K1/14

CPC classification number: H01R12/523 ,  H05K3/308 ,  H05K3/4046 ,  H05K3/4623 ,  H05K2201/044 ,  H05K2201/096 ,  H05K2201/10303 ,  H05K2201/1081 ,  H05K2201/10878