公开(公告)号：US20180035551A1

公开(公告)日：2018-02-01

申请号：US15428292

申请日：2017-02-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-hyun Woo

IPC: H05K5/00 ,  G11C5/04 ,  F16B43/00 ,  H05K1/11

CPC classification number: H05K5/006 ,  F16B5/065 ,  F16B43/004 ,  G11C5/04 ,  H05K1/117 ,  H05K5/0008 ,  H05K7/142 ,  H05K2201/09063 ,  H05K2201/10159 ,  H05K2201/10265 ,  H05K2201/10409

Abstract: A semiconductor memory device including a case including an upper case, a lower case, support structures extending from the lower case to the upper case, a printed circuit board (PCB) in the case and supported by the support structures, a leaf spring on a lower surface of the PCB, the leaf spring seated on support surfaces of the support structures, and a solder layer between the PCB and the leaf spring, the solder layer coupling the PCB with the leaf spring may be provided.