Patent search ap:("Samsung SDI Co. Page Ltd.") AND inv:"Kyungjae Shin"

1.

发明申请
CONNECTING STRUCTURE BETWEEN CIRCUIT BOARDS AND BATTERY PACK HAVING THE SAME 审中-公开
Title translation: 电路板与电池组之间的连接结构

公开(公告)号：US20140120401A1

公开(公告)日：2014-05-01

申请号：US13774768

申请日：2013-02-22

Applicant: SAMSUNG SDI CO., LTD.

Inventor： Kyungjae Shin , Kiwoong Kim

IPC: H01M10/42 , H01R43/02 , H05K1/11

CPC classification number: H01M10/425 , H01R43/0256 , H05K1/118 , H05K3/323 , H05K3/363 , H05K2201/09063 , Y10T29/49213

Abstract: A connecting structure between circuit boards and a battery pack having the same. A hot bar does not make a direct contact with a circuit pattern of a flexible printed circuit board while soldering the flexible printed circuit board to a rigid printed circuit board, thereby preventing the damage to the circuit pattern and preventing electric short between a plurality of the circuit patterns due to the solder. During a soldering process, a base insulating layer having glass transition temperature (Tg) higher than a reflow temperature of the solder is arranged between the circuit pattern and the hot bar, the base insulating layer being perforated by a plurality of apertures to allow heat from the hot bar to more efficiently reach the circuit pattern and the solder. In addition, the circuit pattern covers the apertures, so that solder is unable to reach the hot iron.

Abstract translation: 电路板与电池组之间的连接结构。在将柔性印刷电路板焊接到刚性印刷电路板上时，热条不会与柔性印刷电路板的电路图案直接接触，从而防止损坏电路图案并防止多个由于焊料引起的电路图案。在焊接过程中，在电路图案和热棒之间布置具有高于焊料的回流温度的玻璃化转变温度（Tg）的基底绝缘层，基底绝缘层被多个孔打孔，以允许来自热棒更有效地达到电路图案和焊料。此外，电路图案覆盖孔，使得焊料不能到达热铁。

2.

发明授权
Battery pack 有权
Title translation: 电池组

公开(公告)号：US09553342B2

公开(公告)日：2017-01-24

申请号：US14012980

申请日：2013-08-28

Applicant: Samsung SDI Co., Ltd.

Inventor： Kyungjae Shin , Kiwoong Kim

IPC: H01M10/48 , H01M10/42 , H02J7/00 , H02J7/04 , H05K1/02 , G06F1/26 , G06F1/16 , H05K1/14 , H05K1/18 , H01M2/10

CPC classification number: H01M10/4257 , G06F1/1635 , G06F1/26 , H01M2/1022 , H01M10/4207 , H01M10/48 , H01M10/486 , H01M2200/105 , H01M2200/106 , H01M2220/30 , H02J7/0091 , H02J7/047 , H05K1/0201 , H05K1/147 , H05K1/189 , H05K2201/10037 , H05K2201/10151

Abstract: A battery pack includes a plurality of battery cells; a case accommodating the battery cells; a protective circuit module comprising a circuit board adjacent to the battery cells; a temperature sensitive element on the protective circuit module; and a flexible printed circuit board comprising a conductive pattern layer, wherein the conductive pattern layer is thermally connected to the temperature sensitive element.

Abstract translation: 电池组包括多个电池单元; 容纳电池单元的壳体; 保护电路模块，包括与所述电池单元相邻的电路板; 保护电路模块上的温度敏感元件; 以及包括导电图案层的柔性印刷电路板，其中导电图案层热连接到温度敏感元件。

3.

发明申请
BATTERY PACK 有权
Title translation: 电池组

公开(公告)号：US20140342191A1

公开(公告)日：2014-11-20

申请号：US14012980

申请日：2013-08-28

Applicant: Samsung SDI Co., Ltd.

Inventor： Kyungjae Shin , Kiwoong Kim

IPC: H01M10/42 , H01M2/10

CPC classification number: H01M10/4257 , G06F1/1635 , G06F1/26 , H01M2/1022 , H01M10/4207 , H01M10/48 , H01M10/486 , H01M2200/105 , H01M2200/106 , H01M2220/30 , H02J7/0091 , H02J7/047 , H05K1/0201 , H05K1/147 , H05K1/189 , H05K2201/10037 , H05K2201/10151

Abstract: A battery pack includes a plurality of battery cells; a case accommodating the battery cells; a protective circuit module comprising a circuit board adjacent to the battery cells; a temperature sensitive element on the protective circuit module; and a flexible printed circuit board comprising a conductive pattern layer, wherein the conductive pattern layer is thermally connected to the temperature sensitive element.

Abstract translation: 电池组包括多个电池单元; 容纳电池单元的壳体; 保护电路模块，包括与所述电池单元相邻的电路板; 保护电路模块上的温度敏感元件; 以及包括导电图案层的柔性印刷电路板，其中导电图案层热连接到温度敏感元件。