公开(公告)号：US20060001181A1

公开(公告)日：2006-01-05

申请号：US11223260

申请日：2005-09-12

Applicant: Seok Jun

Inventor： Seok Jun

IPC: H01L29/739

CPC classification number: H05K3/3442 ,  H01L23/13 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/48227 ,  H01L2924/09701 ,  H05K2201/09172 ,  H05K2201/10727 ,  Y02P70/613

Abstract: Disclosed is a terminal structure of a multi-layer substrate and a method for forming the same. In the terminal structure, a plurality of terminals are formed on at least two adjacent substrate layers, each of the terminals being spaced from adjacent ones to a predetermined interval. Openings are formed in at least one of the substrate layers. Each of the openings is formed between each adjacent ones of first terminals in the at least one substrate layer, and spaced from the each first terminals to a predetermined gap, and has a size same as that of the first terminals. The substrate layers are stacked one atop another and compressed together so that second terminals formed on at least one corresponding substrate layer are projected to a plane of an outermost substrate layer on which corresponding terminals are formed. The terminal structure and the method can secure a predetermined interval to a plurality of terminals in a package when the terminals are formed as well as simplify formation thereof.

Abstract translation: 公开了多层基板的端子结构及其形成方法。 在端子结构中，在至少两个相邻的基板层上形成多个端子，每个端子与相邻的基板间隔开至预定间隔。 开口形成在至少一个基板层中。 每个开口形成在至少一个基板层中的每个相邻的第一端子之间，并且与每个第一端子间隔开至预定的间隙，并且具有与第一端子的尺寸相同的尺寸。 将基板层叠在一起并压缩在一起，使形成在至少一个对应基板层上的第二端子突出到形成相应端子的最外层基板层的平面上。 当端子形成时，端子结构和方法可以确保封装中的多个端子的预定间隔，并且简化其形成。

公开(公告)号：US20050098874A1

公开(公告)日：2005-05-12

申请号：US10983240

申请日：2004-11-08

Applicant: Seok Jun ,  Young Lee ,  Ik Choi

Inventor： Seok Jun ,  Young Lee ,  Ik Choi

IPC: H01G4/12 ,  H01G4/252 ,  H01G4/30 ,  H01L23/498 ,  H05K1/03 ,  H05K1/14 ,  H05K3/00 ,  H05K3/24 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H01L23/12

CPC classification number: H05K3/403 ,  H01L23/49805 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/245 ,  H05K3/4061 ,  H05K3/429 ,  H05K3/4629 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09454 ,  H05K2203/1476 ,  H01L2924/00

Abstract: A ceramic multilayer substrate is formed by vertically stacking and firing a plurality of ceramic sheets, in which a connection bar is vertically formed between internal patterns and an external terminal of each ceramic sheet, preventing metallic conductive layers of the internal patterns from being deformed during processing the external terminal. The ceramic multilayer substrate has pattern layers formed on surfaces of at least some of the ceramic sheets. At least one through hole is formed on the edges of the stacked ceramic sheets so as to be opened to the outside. An external terminal is formed on an inner wall of the through hole connected with the pattern layers, and directly contacting the connection bar, whereby the connection bar supports the electrical connection between the external terminal and the pattern layers.

公开(公告)号：US20050168917A1

公开(公告)日：2005-08-04

申请号：US11095588

申请日：2005-04-01

Applicant: Seok Jun ,  Myoung Moon ,  Duk Lee

Inventor： Seok Jun ,  Myoung Moon ,  Duk Lee

IPC: H05K1/11 ,  H01L23/498 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46 ,  H01G4/06

CPC classification number: H05K3/403 ,  H01L23/49805 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/429 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09454 ,  H05K2203/1476 ,  H01L2924/00

Abstract: The A ceramic multilayer substrate includes a plurality of ceramic substrates being stacked vertically, each substrate having a designated thickness; pattern layers formed on surfaces of the ceramic substrates so as to form circuit elements; external terminals vertically formed on side surfaces of the stacked ceramic substrates; and internal connection parts, each of which is formed on a part of one of the pattern layers, is connected to one of the external terminal terminals so as to exchange signals with the outside, and be is broad enough to surround at least partially the connected external terminal.

Abstract translation: A陶瓷多层基板包括垂直堆叠的多个陶瓷基板，每个基板具有指定的厚度; 形成在陶瓷基板的表面上的图案层，以形成电路元件; 垂直形成在堆叠的陶瓷基板的侧表面上的外部端子; 并且每个形成在一个图案层的一部分上的内部连接部分连接到外部端子之一，以便与外部交换信号，并且足够宽以至少部分地包围连接的 外部终端。