SOLID-STATE IMAGE SENSING DEVICE AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    SOLID-STATE IMAGE SENSING DEVICE AND METHOD OF MANUFACTURING THE SAME 有权
    固态图像感测装置及其制造方法

    公开(公告)号:US20130248686A1

    公开(公告)日:2013-09-26

    申请号:US13793607

    申请日:2013-03-11

    Inventor: Shigeru TOHYAMA

    Abstract: A solid-state image sensing device has a plurality of detection units periodically arranged as a two-dimensional array on a substrate. Each of the detection units includes a visible light detector and an infrared light detector arranged on the same optical axis in a vertical direction so that the visible light detector and the infrared light detector overlap with each other. Each of the detection units also includes a signal readout circuit provided in the substrate so as to output signals of the visible light detector and the infrared light detector as time-series signals.

    Abstract translation: 固体摄像装置具有在基板上作为二维阵列周期性排列的多个检测单元。 每个检测单元包括可见光检测器和布置在垂直方向的相同光轴上的红外光检测器,使得可见光检测器和红外光检测器彼此重叠。 每个检测单元还包括设置在基板中的信号读出电路,以便输出可见光检测器和红外光检测器的信号作为时间序列信号。

    THERMAL-TYPE INFRARED SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD OF THE SAME
    2.
    发明申请
    THERMAL-TYPE INFRARED SOLID-STATE IMAGING DEVICE AND MANUFACTURING METHOD OF THE SAME 有权
    热型红外固态成像装置及其制造方法

    公开(公告)号:US20090242768A1

    公开(公告)日:2009-10-01

    申请号:US12412708

    申请日:2009-03-27

    Inventor: Shigeru TOHYAMA

    Abstract: The thermal-type infrared solid-state imaging device comprises a infrared detector having at least a substrate provided with an integrated circuit for reading out a signal, a diaphragm for detecting a temperature change by absorbing infrared rays, and a support section for supporting the diaphragm above a surface of one side of the substrate with space in between, and includes an eaves section connected to a connection area provided in the vicinity of outer circumference of the diaphragm and covering at least components other than the diaphragm across a space and transmitting the heat generated by absorbing incident infrared rays to the diaphragm, wherein the eaves section has the thickness of a first region covering the components other than the diaphragm across a space thicker than the thicknesses of a second region contacting the connection area of the diaphragm and a third region rising upward in mid air from the diaphragm.

    Abstract translation: 热型红外固体摄像装置包括红外线检测器,至少具有设置有用于读出信号的集成电路的基板,用于通过吸收红外线检测温度变化的光阑以及用于支撑隔膜的支撑部 在其间具有空间的基板的一侧的表面之上,并且包括连接到设置在隔膜的外周附近的连接区域的檐部,并且至少覆盖横跨空间的隔膜以外的部件,并传递热量 通过将入射的红外线吸收到所述隔膜而产生,其中所述檐部具有覆盖除了所述隔膜以外的部件的第一区域的厚度,所述第一区域的厚度超过与所述隔膜的连接区域接触的第二区域的厚度, 在空气中从隔膜上升。

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