公开(公告)号：US20230229133A1

公开(公告)日：2023-07-20

申请号：US18146505

申请日：2022-12-27

Applicant: TENGXI TECHNOLOGY CO. LTD.

Inventor： WEI-HAN LO ,  TIEN-HSIANG HO

IPC: G05B19/18 ,  H01L21/67 ,  H01J37/32 ,  G03F7/42

CPC classification number: G05B19/188 ,  H01L21/67225 ,  H01J37/32899 ,  H01J37/32082 ,  H01J37/32449 ,  G03F7/427 ,  H01J2237/20278 ,  H01J37/32816 ,  H01J2237/20214 ,  H01J2237/20235 ,  H01J2237/186 ,  H01J2237/002 ,  H01J37/32733 ,  G05B2219/45031

Abstract: A semiconductor machine system comprises a plurality of working chambers, wherein the working chambers process materials separately; a control host coupled to the plurality of working chambers, comprising: a main control module coupled to the plurality of working chambers; an analog control module coupled to the plurality of working chambers, and the analog control module is detachably coupled to one or more external devices by serial interface coupling; a digital control module coupled to the plurality of working chambers, and the main control module, the analog control module and the digital control module are coupled to each other; and a plurality of operating units coupled to at least one of the main control module, the analog control module and the digital control module, respectively, to control the plurality of working chambers for processing the materials by the main control module, the analog control module and the digital control module.