公开(公告)号：US12196629B2

公开(公告)日：2025-01-14

申请号：US17586443

申请日：2022-01-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Tong Wu

IPC: G01L1/24 ,  G01K11/32 ,  H01J37/32 ,  H01L21/683

Abstract: A measuring device and an optical fiber strain measuring jig thereof appropriately measure an attraction force distribution on a wafer held by an electrostatic chuck. The measuring jig includes a substrate configured to be held by the electrostatic chuck; and an optical fiber including therein reflection elements capable of reflecting light having a wavelength corresponding to strain of the substrate due to stress, and fixed to one surface of the substrate in a state in which the reflection elements are disposed at plural positions, respectively, on the one surface of the substrate.

公开(公告)号：US20210102847A1

公开(公告)日：2021-04-08

申请号：US17063816

申请日：2020-10-06

Applicant: Tokyo Electron Limited

Inventor： Tong Wu ,  Kenji Nagai

IPC: G01K7/02 ,  G01N21/71

Abstract: A temperature measurement system configured to measure a temperature of a target object having a first main surface and a second main surface includes a light source unit configured to emit output light penetrating the target object and including a first wavelength range and a second wavelength range; a measurement unit configured to measure a spectrum of reflected light; an optical path length ratio calculator configured to calculate an optical path length ratio between the output light of the first wavelength range and the output light of the second wavelength range; and a temperature calculator configured to calculate the temperature of the target object based on the optical path length ratio and a previously investigated relationship between the temperature of the target object and a refractive index ratio between the output light of the first wavelength range and the output light of the second wavelength range.

公开(公告)号：US11668608B2

公开(公告)日：2023-06-06

申请号：US17063816

申请日：2020-10-06

Applicant: Tokyo Electron Limited

Inventor： Tong Wu ,  Kenji Nagai

IPC: G01J3/427 ,  G01K11/125 ,  G01N21/41 ,  G01K7/02 ,  G01N21/71

CPC classification number: G01K7/02 ,  G01J3/427 ,  G01K11/125 ,  G01N21/41 ,  G01N21/71 ,  G01N2201/1211

Abstract: A temperature measurement system configured to measure a temperature of a target object having a first main surface and a second main surface includes a light source unit configured to emit output light penetrating the target object and including a first wavelength range and a second wavelength range; a measurement unit configured to measure a spectrum of reflected light; an optical path length ratio calculator configured to calculate an optical path length ratio between the output light of the first wavelength range and the output light of the second wavelength range; and a temperature calculator configured to calculate the temperature of the target object based on the optical path length ratio and a previously investigated relationship between the temperature of the target object and a refractive index ratio between the output light of the first wavelength range and the output light of the second wavelength range.

公开(公告)号：US11460355B2

公开(公告)日：2022-10-04

申请号：US16903123

申请日：2020-06-16

Applicant: Tokyo Electron Limited

Inventor： Tong Wu ,  Tomohide Minami

IPC: H01Q1/38 ,  G01K11/26

Abstract: An antenna device according to an exemplary embodiment includes a first metal layer, a first dielectric layer, a second metal layer, and a second dielectric layer. The first dielectric layer has a thermal conductivity and heat resistance that are higher than those of an FR-4 resin. The antenna device includes a first metal terminal and a second metal terminal, and a thermosensor. A pair of an input terminal and an output terminal of the thermosensor are electrically connected to the first metal terminal and the second metal terminal, respectively, and the second metal layer includes a first segment and a second segment. The first metal terminal is disposed above the first segment, and the second metal terminal is disposed above the second segment.

公开(公告)号：US11646210B2

公开(公告)日：2023-05-09

申请号：US16429800

申请日：2019-06-03

Applicant: Tokyo Electron Limited

Inventor： Tong Wu

IPC: H01L21/67 ,  H01J37/32

CPC classification number: H01L21/67253 ,  H01J37/3211 ,  H01L21/67248 ,  H01J2237/332 ,  H01J2237/3341

Abstract: An apparatus and method for real-time sensing of properties in industrial manufacturing equipment are described. The sensing system includes first plural sensors mounted within a processing environment of a semiconductor device manufacturing system, wherein each sensor is assigned to a different region to monitor a physical or chemical property of the assigned region of the manufacturing system, and a reader system having componentry configured to simultaneously and wirelessly interrogate the plural sensors. The reader system uses a single high frequency interrogation sequence that includes (1) transmitting a first request pulse signal to the first plural sensors, the first request pulse signal being associated with a first frequency band, and (2) receiving uniquely identifiable response signals from the first plural sensors that provide real-time monitoring of variations in the physical or chemical property at each assigned region of the system.

公开(公告)号：US20190385875A1

公开(公告)日：2019-12-19

申请号：US16429800

申请日：2019-06-03

Applicant: Tokyo Electron Limited

Inventor： Tong Wu

IPC: H01L21/67 ,  H01J37/32

Abstract: An apparatus and method for real-time sensing of properties in industrial manufacturing equipment are described. The sensing system includes first plural sensors mounted within a processing environment of a semiconductor device manufacturing system, wherein each sensor is assigned to a different region to monitor a physical or chemical property of the assigned region of the manufacturing system, and a reader system having componentry configured to simultaneously and wirelessly interrogate the plural sensors. The reader system uses a single high frequency interrogation sequence that includes (1) transmitting a first request pulse signal to the first plural sensors, the first request pulse signal being associated with a first frequency band, and (2) receiving uniquely identifiable response signals from the first plural sensors that provide real-time monitoring of variations in the physical or chemical property at each assigned region of the system.

公开(公告)号：US11906466B2

公开(公告)日：2024-02-20

申请号：US17176426

申请日：2021-02-16

Applicant: Tokyo Electron Limited

Inventor： Takayuki Hatanaka ,  Tong Wu ,  Satoshi Nomura

IPC: G01K11/26 ,  H01L21/67 ,  G01K1/024 ,  G01K1/02 ,  G01N29/02 ,  G01N29/12 ,  G01N29/24 ,  G01B5/30 ,  H01J37/32

CPC classification number: G01N29/022 ,  G01B5/30 ,  G01K1/024 ,  G01K1/026 ,  G01K11/265 ,  G01N29/12 ,  G01N29/2462 ,  H01J37/32917 ,  H01L21/67069 ,  H01L21/67248 ,  G01N2291/2697 ,  H01J37/32091 ,  H01J37/32715 ,  H01J2237/2007 ,  H01J2237/24592 ,  H01J2237/334

Abstract: A measurement method performed by a semiconductor manufacturing apparatus including a chamber is provided. In the measurement method, first measurement data including a signal of a resonance frequency of the chamber is acquired as reference data, in response to transmitting an electrical signal into the chamber while a jig capable of performing wireless communication is not placed in the chamber. Subsequently, second measurement data including the signal of the resonance frequency of the chamber and including a signal of a resonance frequency of a sensor installed in the jig is acquired, in response to transmitting an electrical signal into the chamber while the jig is placed in the chamber. By subtracting the reference data from the second measurement data, third measurement data is calculated.

公开(公告)号：US11841278B2

公开(公告)日：2023-12-12

申请号：US16976732

申请日：2019-07-11

Applicant: Tokyo Electron Limited

Inventor： Tong Wu ,  Tomohide Minami ,  Masaaki Miyagawa

IPC: G01K11/32 ,  G01J5/0821 ,  G01K11/324

CPC classification number: G01K11/32 ,  G01J5/0821 ,  G01K11/324

Abstract: A temperature measurement sensor according to an exemplary embodiment includes a substrate and an optical fiber provided on an upper surface of the substrate and extending along the upper surface. The temperature measurement sensor further includes a light introduction path of a space that allows a space above the upper surface and a space below a lower surface of the substrate to communicate with each other and an optical coupling portion provided on the upper surface and disposed in the light introduction path. The optical coupling portion is optically connected to the end surface of the optical fiber. The optical fiber forms the first pattern shape and the second pattern shape. The first pattern shape includes the optical fiber more densely than the second pattern shape. Light incident on the optical coupling portion from a side of the lower surface through the light introduction path reaches the end surface through the optical coupling portion.