Coupling device for a stent support fixture
    1.
    发明申请
    Coupling device for a stent support fixture 失效
    用于支架支架的耦合装置

    公开(公告)号:US20040187775A1

    公开(公告)日:2004-09-30

    申请号:US10817642

    申请日:2004-04-02

    Inventor: Cameron Kerrigan

    CPC classification number: B05C13/025 A61F2/82

    Abstract: A coupling device to connect a stent support fixture to a processing apparatus is provided.

    Abstract translation: 提供了一种用于将支架支架夹持器连接到处理装置的连接装置。

    Spraying apparatus
    2.
    发明申请
    Spraying apparatus 审中-公开
    喷涂设备

    公开(公告)号:US20030196594A1

    公开(公告)日:2003-10-23

    申请号:US10123477

    申请日:2002-04-17

    Inventor: Charles R. Reed

    CPC classification number: B05B13/0228 B05B13/0235

    Abstract: Apparatus for spraying paint on a can or can top includes a carrier for the article, the carrier being formed of with a pedestal, a shaft extending upwardly from the pedestal, and an adapter mounted on the shaft. The adapter engages the article and causes it spin as the carrier spins at the spray painting station. Further, a bottom plate of the apparatus is formed with a slot through which the carrier shaft extends, thereby shielding lower portions of the apparatus from inadvertent spraying. Additionally, the apparatus positions individual carriers at the spraying station by means of a rotatable disc in which a slot that extends from the periphery toward the center of the disc engages the shaft of a carrier and, as the disc rotates, moves the shaft and the can it carries to the desired

    Abstract translation: 用于在罐或罐顶上喷涂涂料的装置包括用于制品的载体,载体由基座形成,从基座向上延伸的轴以及安装在轴上的适配器。 适配器接合物品并使其随着载体在喷漆站处旋转而旋转。 此外,该装置的底板形成有一个狭槽,托架轴通过该槽延伸,从而屏蔽设备的下部,从而无意中喷洒。 另外,该装置通过可旋转盘将喷射站处的各个载体定位在其中,从圆周向圆盘的中心延伸的槽与托架的轴接合,并且当盘旋转时,使轴和 它可以携带到所需的

    Device for producing a coating rod for use in the paper industry
    3.
    发明申请
    Device for producing a coating rod for use in the paper industry 失效
    用于制造用于造纸工业的涂布杆的装置

    公开(公告)号:US20030084841A1

    公开(公告)日:2003-05-08

    申请号:US10011460

    申请日:2001-11-05

    CPC classification number: B05B13/0442 B05B7/226 B05B12/36 C23C4/12 C23C4/14

    Abstract: The invention concerns a method which consists in maintaining the two ends (2, 4) of the bar (1) on the end supports (3, 5) of a frame (10), one of the ends (2) being maintained fixed, and in driving the bar in rotation. The invention is characterised in that it consists further in drawing the bar (1) while spraying a coat on the bar, the drawing of the bar corresponding to an elongation of about 0.2 to 0.001%.

    Abstract translation: 本发明涉及一种方法,其包括将杆(1)的两端(2,4)保持在框架(10)的端部支撑件(3,5)上,其中一个端部(2)保持固定, 并在旋转中驱动杆。 本发明的特征在于,它进一步在拉伸棒材(1)的同时在棒材上喷涂涂层,拉伸棒材对应于约0.2至0.001%的伸长率。

    Disk carrier with spindle
    4.
    发明申请
    Disk carrier with spindle 失效
    带主轴的磁盘托架

    公开(公告)号:US20030029771A1

    公开(公告)日:2003-02-13

    申请号:US10208652

    申请日:2002-07-30

    Applicant: Entegris, Inc.

    CPC classification number: G11B5/102

    Abstract: The disk carrier with spindle comprises an outer shell including an upper portion and a lower portion that connect together to form a chamber to enclose disks and constrain a spindle in place in the chamber. The spindle further comprises elongated portions or partial cylinder sections joined by a hinge so that the spindle can be moved into a contracted position to freely pass through a central aperture of a disk or into an expanded position to contact the inner perimeter of the disk and secure the disk.

    Abstract translation: 具有主轴的盘载体包括外壳,其包括连接在一起的上部和下部,以形成容纳圆盘的腔室并将心轴限制在腔室中的适当位置。 主轴还包括由铰链连接的细长部分或部分圆柱形部分,使得主轴可以移动到收缩位置以自由地穿过盘的中心孔或扩展位置以接触盘的内周边并且固定 磁盘。

    Substrate supporting table,method for producing same, and processing system
    5.
    发明申请
    Substrate supporting table,method for producing same, and processing system 审中-公开
    基板支撑台,生产方法及加工系统

    公开(公告)号:US20020134511A1

    公开(公告)日:2002-09-26

    申请号:US10067506

    申请日:2002-02-07

    CPC classification number: H01J37/32082 C23C16/4581 H01J2237/022 Y10T279/23

    Abstract: A plasma processing system has a susceptor, provided in a processing vessel, for supporting thereon a substrate. A process gas is supplied into the processing vessel to produce the plasma of the process gas. The susceptor has a dielectric film formed on a base, and a plurality of protrusions formed on the film. The protrusions of the susceptor are formed by thermal-spraying a ceramic onto the dielectric film via an aperture plate having a plurality of circular apertures.

    Abstract translation: 等离子体处理系统具有设置在处理容器中的基座,用于在其上支撑基板。 将处理气体供应到处理容器中以产生处理气体的等离子体。 感受体具有形成在基底上的电介质膜和形成在膜上的多个突起。 通过经由具有多个圆形孔的孔板将陶瓷热喷涂到电介质膜上而形成基座的突出部。

    System and method for metalization of deep vias
    6.
    发明申请
    System and method for metalization of deep vias 审中-公开
    深孔金属化的系统和方法

    公开(公告)号:US20020066179A1

    公开(公告)日:2002-06-06

    申请号:US09727650

    申请日:2000-12-01

    Abstract: In a method of injecting an electrically conductive epoxy into blind vias during drilling or shortly thereafter in order to avoid oxidation of the copper or other metal of the imbedded layer, a machine tool is provided with at least one controllable spindle and at least one injection device. Alternatively, two machine tools, one with at least one controllable spindle and one with at least one injection device, may be provided. A printed circuit board mounted on the machine tool table for drilling is registered in the usual way for the particular machine tool. The machine tool part program then drills a particular pattern for the circuit board for mounting of circuit board components. All of the blind vias as well as through hole vias are drilled at one time by the machine tool by the tools mounted in the spindle or by laser drilling systems, but may also be drilled and filled in any sequence. The drilling operation is followed by the epoxy injecting operation in which a controlled operating device, comprising a reservoir, a pumping mechanism, a hollow needle through which the conductive epoxy flows to the bottom of the hole, a control mechanism, and sensors detect various mechanism operations and when hole fill is completed.

    Abstract translation: 在钻孔期间或之后不久将导电环氧树脂注入盲孔的方法中,为了避免铜或嵌入层的其它金属的氧化,机床上设置有至少一个可控心轴和至少一个注射装置 。 或者,可以提供两个机床,一个具有至少一个可控心轴,一个具有至少一个注射装置。 以特定机床的通常方式登记安装在机床台上用于钻孔的印刷电路板。 然后,机床零件程序为用于安装电路板部件的电路板钻出特定图案。 所有的盲孔和通孔通过机床一次通过安装在主轴上的工具或激光钻孔系统一次钻孔,但也可以以任何顺序钻孔和填充。 钻孔操作之后是环氧注射操作,其中包括储存器,泵送机构,导电环氧树脂流过孔的底部的空心针,控制机构和传感器的受控操作装置检测各种机构 操作和填充孔时。

    Method of staining semiconductor wafer samples with a semiconductor treatment chemical
    8.
    发明申请
    Method of staining semiconductor wafer samples with a semiconductor treatment chemical 失效
    用半导体处理化学品染色半导体晶片样品的方法

    公开(公告)号:US20010003012A1

    公开(公告)日:2001-06-07

    申请号:US09747481

    申请日:2000-12-22

    Inventor: Frank E. Martini

    Abstract: A method for staining a plurality of semiconductor wafers and wafer samples with a chemical. The method includes gripping first and second semiconductor wafers and orienting the second semiconductor wafer such that it is substantially coplanar with the first semiconductor wafer and suspending the first and second semiconductor wafers such that at least portions thereof extend into the chemical. The method may also include gripping a first semiconductor wafer and a second semiconductor wafer that has a different size from the first and suspending first and second semiconductor wafers such that at least portions thereof extend into the chemical.

    Abstract translation: 一种用化学品染色多个半导体晶片和晶片样品的方法。 该方法包括夹持第一和第二半导体晶片并使第二半导体晶片取向,使得其与第一半导体晶片基本共面并且悬挂第一和第二半导体晶片,使得其至少部分延伸到化学品中。 该方法还可以包括夹持具有与第一和悬挂的第一和第二半导体晶片不同的尺寸的第一半导体晶片和第二半导体晶片,使得其至少部分延伸到化学品中。

    HOOP SUPPORT FOR SEMICONDUCTOR WAFER
    9.
    发明申请
    HOOP SUPPORT FOR SEMICONDUCTOR WAFER 失效
    用于SEMICONDUCTOR WAFER的HOOP支持

    公开(公告)号:US20030230237A1

    公开(公告)日:2003-12-18

    申请号:US10170957

    申请日:2002-06-13

    CPC classification number: H01L21/68735 H01L21/6875 Y10S269/903

    Abstract: An improved hoop support for semiconductor wafers reduces contamination of the wafer during edge beveling operations through the use of support pins that make only line contact with the wafer. The support pins are spaced around the periphery of the hoop and possess a triangular cross section. Two intersecting sides of the pins form an edge that defines the line contact with the wafer. These intersecting sides are preferably inclined relative to the wafer at an angle of between 60 and 80 degrees.

    Abstract translation: 用于半导体晶片的改进的环形支撑通过使用仅与晶片线接触的支撑销来减少边缘斜切操作期间晶片的污染。 支撑销围绕环的周边间隔开并且具有三角形横截面。 销的两个相交的侧面形成限定与晶片的线接触的边缘。 这些相交侧优选以60度和80度之间的角度相对于晶片倾斜。

    Joined ceramic article, substrate holding structure and apparatus for treating substrate
    10.
    发明申请
    Joined ceramic article, substrate holding structure and apparatus for treating substrate 失效
    接合陶瓷制品,基板保持结构和用于处理基板的装置

    公开(公告)号:US20030150563A1

    公开(公告)日:2003-08-14

    申请号:US10276394

    申请日:2002-11-14

    Abstract: A substrate holding structure having excellent corrosion resistance and airtightness, having excellent dimensional accuracy and having sufficient durability when mechanical or thermal stress is applied thereto is obtained. A holder (1) serving as the substrate holding structure according to the present invention comprises a ceramic base (2) for holding a substrate, a protective cylinder (7) joined to the ceramic base (2) and a joining layer (8) positioned between the ceramic base (2) and the protective cylinder (7) for joining the ceramic base (2) and the protective cylinder (7) to each other. The joining layer (8) contains at least 2 mass % and not more than 70 mass % of a rare earth oxide, at least 10 mass % and not more than 78 mass % of aluminum oxide, and at least 2 mass % and not more than 50 mass % of aluminum nitride. The rare earth oxide or the aluminum oxide has the largest ratio among the aforementioned three types of components in the joining layer (8).

    Abstract translation: 获得具有优异的耐腐蚀性和气密性的基板保持结构,具有优异的尺寸精度并且在施加机械或热应力时具有足够的耐久性。 根据本发明的用作基板保持结构的保持器(1)包括用于保持基板的陶瓷基座(2),接合到陶瓷基座(2)的保护筒(7)和位于 在陶瓷基座(2)和用于将陶瓷基座(2)和保护筒(7)彼此接合的保护筒(7)之间。 接合层(8)含有2质量%以上且70质量%以下的稀土类氧化物,至少10质量%以上且78质量%以下的氧化铝,至少2质量%以上 超过50质量%的氮化铝。 在接合层(8)中,上述三种成分中的稀土类氧化物或氧化铝的比例最大。

Patent Agency Ranking