公开(公告)号：US12152940B2

公开(公告)日：2024-11-26

申请号：US17784289

申请日：2020-12-21

Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

Inventor： Takahiro Wakabayashi ,  Kenichi Taguchi

IPC: G01J5/061 ,  G01J5/00

Abstract: A sensor device according to the present disclosure includes a Peltier element, a sensor element thermally connected to a cooling surface of the Peltier element, and a window member that faces a light receiving surface of the sensor element and is made of borosilicate glass.

公开(公告)号：US20240222544A1

公开(公告)日：2024-07-04

申请号：US18603519

申请日：2024-03-13

Applicant: Shimon Maimon

Inventor： Shimon Maimon

IPC: H01L31/18 ,  B82Y20/00 ,  G01J5/00 ,  G01J5/061 ,  G01J5/20 ,  H01L23/38 ,  H01L27/146 ,  H01L31/0296 ,  H01L31/0304 ,  H01L31/0352 ,  H01L31/101

CPC classification number: H01L31/1832 ,  B82Y20/00 ,  G01J5/061 ,  G01J5/20 ,  H01L27/14669 ,  H01L31/02966 ,  H01L31/03046 ,  H01L31/035236 ,  H01L31/101 ,  H01L31/1844 ,  G01J2005/0077 ,  H01L23/38 ,  H01L2924/0002 ,  Y02E10/544

Abstract: A camera having an integrated dewar cooler assembly (IDCA) with an optical window, and a reduced dark current photodetector disposed within the IDCA to receive light passing through the optical window. The photodetector comprising a semiconductor photo absorbing layer, a semiconductor barrier layer having a thickness and a first side adjacent a side of the photo absorbing layer, the barrier layer exhibiting a valence band energy level substantially equal to the valence band energy level of the photo absorbing layer and a conduction band energy level exhibiting an energy gap in relation to the conduction band of the photo absorbing layer, and a contact area comprising a doped semiconductor, the contact area is adjacent a second side of the barrier layer opposing the first side. The energy gap and/or the thickness of the of the barrier layer is sufficient to minimize charge carriers tunneling and thermalization.

公开(公告)号：US11852539B1

公开(公告)日：2023-12-26

申请号：US17812751

申请日：2022-07-15

Applicant: Raytheon Company

Inventor： Stephen Marinsek

IPC: G01J5/061 ,  G01J5/04 ,  F25D19/00 ,  G01J5/06

CPC classification number: G01J5/061 ,  F25D19/006 ,  G01J5/045 ,  G01J2005/065

Abstract: A camera assembly includes a housing inside of which components are maintained at a cryogenic temperature. The components maintained at cryogenic temperature include a detector that is mounted on an integrated circuit, which in turn is mounted on a platform, such as a ceramic platform, which includes electrical connections for the integrated circuit. The camera assembly also includes one or more subplatforms, maintained above the cryogenic temperature, such as ambient temperature, that receive electrical inputs from outside the housing, and make electrical connections to the platform. The connections may be made from the one or more subplatforms, through openings in the platform and/or outside one or more outer edges of the platform. The assembly may include covers of exposed parts of the one or more subplatforms, to facilitate thermal isolation between the interior of the assembly (at cryogenic temperature) and the one or more subplatforms (above cryogenic temperature).

公开(公告)号：US20230408341A1

公开(公告)日：2023-12-21

申请号：US18211261

申请日：2023-06-17

Applicant: Joseph D. LaVeigne ,  Gregory P. Matis ,  Albert Gibson ,  Nathan Radtke ,  Vincent Posner

Inventor： Joseph D. LaVeigne ,  Gregory P. Matis ,  Albert Gibson ,  Nathan Radtke ,  Vincent Posner

IPC: G01J5/53 ,  G01J5/061

CPC classification number: G01J5/53 ,  G01J5/061 ,  G01J2005/063 ,  G01J2005/062 ,  G01J5/80

Abstract: An extended area “cavity type” blackbody for use as a radiometric reference for imaging systems may have a well in the form of a cube having four sidewalls and a back wall, and open at the front. The temperature of the back wall may be controlled independently of the temperature(s) of the sidewalls. This system may produce infrared radiance closer to an ideal radiator than typical extended area sources. A “simple” blackbody is disclosed, having a source plate with a front emitting surface; a ledge element disposed in front of and below the source plate for heating air in front of the source plate; and (optionally) another ledge element disposed in front of and above the source plate for cooling air in front of the source plate. A housing may support the source plate and ledge element, and a vent may be provided in front of and above the source plate. A resistive heater may be associated with the ledge element; and (optionally) TECs may be associated with the other (cooling) ledge element. Angles of the ledges may be adjustable to optimize the best uniformity for a particular implementation. Temperature control of the ledges may be in unison with or independent from the source plate.

公开(公告)号：US20230040397A1

公开(公告)日：2023-02-09

申请号：US17880751

申请日：2022-08-04

Applicant: Drexel University

Inventor： Matthew McCarthy ,  Deborah Kapilow

IPC: G01J5/48 ,  G01J5/061 ,  G01J5/08 ,  G01J5/04

Abstract: A backside thermography technique was developed based on the temperature sensitivity of laser-induced fluorescence in flowing two-dye solutions. The approach utilizes visible light and optically transparent packaging materials to obtain spatially resolved transient thermal measurements. This technique is compatible with optically transparent water-cooled packaging, which will allow for the characterization of processes where heat is added as well as removed. A setup was designed, constructed, and used to study the performance of seven two-dye Rhodamine B (RhB)-Rhodamine 110 (Rh110) fluorescent solutions. The effect of dye concentration ratio on sensitivity, maximum frame rate, and excitation area was characterized. The system was used to demonstrate in-situ temperature measurements showing the importance of two-dye light compensation, as well as backside thermography using a simple droplet contact method to investigate temporal response. Droplet contact experiments were conducted on actively heated and cooled surfaces to study local temperature and heat flux behavior during phase change.

公开(公告)号：US20220201177A1

公开(公告)日：2022-06-23

申请号：US17654238

申请日：2022-03-09

Applicant: SZ DJI TECHNOLOGY CO., LTD.

Inventor： Junli LIU ,  Jun DU ,  Yucheng LIU ,  Yong LIU

IPC: H04N5/225 ,  H04N5/33 ,  G01J5/061 ,  B64C39/02

Abstract: An infrared imaging unit. The infrared imaging unit includes an infrared detector and a heat insulation assembly, the heat insulation assembly being disposed on one side of the infrared detector, the heat insulation assembly being used to isolate a heat transfer in the infrared imaging unit to the infrared detector.

公开(公告)号：US20240426666A1

公开(公告)日：2024-12-26

申请号：US18236324

申请日：2023-08-21

Applicant: Rayprus Technology (Foshan) Co., Ltd.

Inventor： SHU-YING CHEN ,  YE-QUANG CHEN

IPC: G01J5/061 ,  G01J5/10 ,  G01J5/48

Abstract: Disclosed in the present invention are a camera module and an electronic device. The camera module includes a housing, a temperature sensor, a temperature adjusting device, and an infrared detector, the temperature sensor is configured to sense a first temperature in the interior of the housing, the temperature adjusting device is configured to adjust the first temperature to a target temperature when the first temperature is not equal to the target temperature, the infrared detector is configured to detect infrared rays of an object when the first temperature reaches the target temperature.

公开(公告)号：US12025500B2

公开(公告)日：2024-07-02

申请号：US18157099

申请日：2023-01-20

Applicant: The Procter & Gamble Company

Inventor： Stephen Michael Varga ,  Steven Henry Mersch

IPC: G01J5/061 ,  G01J5/10 ,  G01J5/00

CPC classification number: G01J5/061 ,  G01J5/10 ,  G01J2005/0077 ,  G01J2005/106

Abstract: Systems and methods for thermal radiation detection utilizing a thermal radiation detection system are provided. The thermal radiation detection system includes one or more Indium Antimonide (InSb)-based photodiode infrared detectors and a temperature sensing circuit. The temperature sensing circuit is configured to generate signals correlated to the temperatures of one or more of the plurality of infrared sensor elements. The thermal radiation detection system also includes a signal processing circuit.

公开(公告)号：US20230314349A1

公开(公告)日：2023-10-05

申请号：US18017001

申请日：2021-06-11

Applicant: SHANGHAI JIAOTONG UNIVERSITY

Inventor： Jiao ZHANG ,  Yang TANG ,  Ya ZHANG ,  Yue WU ,  Hui XING ,  Baode SUN ,  Yanfeng HAN ,  Yongbing DAI ,  Chaopeng FU ,  Qing DONG

IPC: G01N23/207 ,  G01T1/20 ,  G01N23/20033 ,  G01N23/223 ,  G01J5/061

CPC classification number: G01N23/2076 ,  G01T1/20187 ,  G01N23/20033 ,  G01N23/223 ,  G01J5/061 ,  G01J2005/0077

Abstract: A multi-physical field measurement device for a metal solidification process and a housing and a measurement method thereof are provided. The device includes: a sealed housing provided with a light-through hole; a heater provided inside the housing and located behind the light-through hole along an X-ray; a diffraction detector used for receiving the X-ray which penetrates through a sample sheet and is scattered; a CMOS camera located behind the heater along the X-ray (11) and used for receiving a visible light signal which penetrates through the sample sheet; a silicon drift X-ray detector located at one side of the X-ray and used for receiving a fluorescent signal sent by interaction between the X-ray and the sample piece sheet; and an infrared thermal imager located at the other side of the X-ray and used for receiving an infrared signal sent by the sample sheet.

公开(公告)号：US11577208B2

公开(公告)日：2023-02-14

申请号：US16529074

申请日：2019-08-01

Applicant: MWT AG ,  Milestone S.r.l.

Inventor： Werner Lautenschläger ,  Jens Lautenschläger ,  Werner Scholze

IPC: B01J3/00 ,  G01N21/03 ,  G01J5/061 ,  G01J5/02 ,  B01J3/04 ,  B01F33/45

Abstract: The present invention relates to a pressure vessel (1) having a pressure vessel wall (1a) which completely surrounds a reaction chamber (2) as a pressure space for the initiation and/or promotion of chemical and/or physical pressure reactions of a sample (P) to be heated which is accommodated in the reaction chamber (2), wherein the pressure vessel wall (1a) has an infrared-permeable high-pressure window (30) which extends away outward in a direction from the reaction chamber (2) and which is supported in the pressure vessel wall (1a) with respect to a pressure in the reaction chamber (2), wherein the pressure vessel (1) furthermore has an infrared to temperature sensor (40) which is situated directly opposite the high-pressure window (30), in order to measure the temperature of a sample (P), accommodated in the reaction chamber (2), during a pressure reaction through the high-pressure window (30).