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Patent Agency Ranking1.发明公开기판 처리 방법, 이 기판 처리 방법을 실행하기 위한 컴퓨터 프로그램이 기록된 기록 매체 및 기판 처리 장치 审中-实审基板处理方法，用于实施基板处理方法和基板处理装置的存储式存储计算机程序
公开(公告)号：KR1020130061099A
公开(公告)日：2013-06-10
申请号：KR1020120137045
申请日：2012-11-29
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/302
CPC classification number: B08B3/04 , H01L21/67034
Abstract: PURPOSE: A substrate processing method, a storage medium storing a computer program for implementing the substrate processing method and a substrate processing apparatus are provided to improve a processing speed by supplying a chemical solution to a wafer. CONSTITUTION: A chemical solution is supplied to a substrate. A rinsing solution is supplied to the substrate. The substrate is dried. The substrate is rotated with a first rotation number in a first drying process. The substrate is rotated with a second rotation number in a second drying process. The first rotation number is larger than the second rotation number. [Reference numerals] (AA) Revolution number(rpm); (BB) Rinse process; (CC) First drying process(surface substitution); (DD) Third drying process(overall substitution); (EE) Fourth drying process(IPA scattering); (FF) Second drying process(agitation); (GG) Time(sec)
Abstract translation: 目的：提供基板处理方法，存储用于实现基板处理方法的计算机程序的存储介质和基板处理装置，以通过向晶片提供化学溶液来提高处理速度。 构成：将化学溶液提供给基材。 向基板供给冲洗溶液。 将基材干燥。 在第一干燥过程中，基板以第一转数旋转。 在第二干燥过程中，基板以第二转数旋转。 第一转数大于第二转数。 （标号）（AA）转数（rpm）; （BB）冲洗过程; （CC）第一次干燥过程（表面取代）; （DD）第三次干燥过程（整体替代）; （EE）第四次干燥过程（IPA散射）; （FF）第二次干燥过程（搅拌）; （GG）时间（秒）
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公开(公告)号：KR101831789B1
公开(公告)日：2018-02-23
申请号：KR1020130160092
申请日：2013-12-20
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/302
CPC classification number: B01D19/0005 , H01L21/67023
Abstract: 기판상에형성된배선의부식을방지할수 있는액 처리장치및 약액회수방법을제공하는것이다. 실시예에따른액 처리장치는, 처리부와회수관과공급관과가스공급부를구비한다. 처리부는기판으로약액을공급하여액 처리를행한다. 회수관은처리부로공급된약액을회수한다. 공급관은회수된약액을처리부로공급한다. 가스공급부는회수관의내부를향해불활성가스를공급한다.
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公开(公告)号：KR1020140086850A
公开(公告)日：2014-07-08
申请号：KR1020130160092
申请日：2013-12-20
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/302
CPC classification number: B01D19/0005 , H01L21/67023
Abstract: The present invention provides a liquid processing apparatus and a liquid chemical collecting method for preventing corrosion of a wiring provided on a substrate. The liquid processing apparatus according to an embodiment includes a processing unit, a collecting pipe, a supply pipe, and a gas supply unit. The processing unit performs liquid processing by supplying liquid chemical to the substrate. The collecting pipe collects the liquid chemical supplied to the processing unit. The supply pipe supplies the collected liquid chemical to the processing unit. The gas supply unit supplies inert gas to the inside of the collecting pipe.
Abstract translation: 本发明提供一种用于防止设置在基板上的布线的腐蚀的液体处理装置和液体化学品收集方法。 根据实施例的液体处理装置包括处理单元，收集管，供应管和气体供应单元。 处理单元通过向基板供给液体化学品来执行液体处理。 收集管收集供给处理单元的液体化学品。 供应管将收集的液体化学品供应到处理单元。 气体供给单元向收集管的内部供给惰性气体。
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公开(公告)号：KR101942447B1
公开(公告)日：2019-01-25
申请号：KR1020120137045
申请日：2012-11-29
Applicant: 도쿄엘렉트론가부시키가이샤
IPC: H01L21/302
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