Abstract:
The present invention provides a liquid processing apparatus and a liquid chemical collecting method for preventing corrosion of a wiring provided on a substrate. The liquid processing apparatus according to an embodiment includes a processing unit, a collecting pipe, a supply pipe, and a gas supply unit. The processing unit performs liquid processing by supplying liquid chemical to the substrate. The collecting pipe collects the liquid chemical supplied to the processing unit. The supply pipe supplies the collected liquid chemical to the processing unit. The gas supply unit supplies inert gas to the inside of the collecting pipe.
Abstract:
PURPOSE: A liquid processing apparatus and a liquid processing method are provided to eliminate a first film and a second film from a substrate regardless of the dissolvability of the second film with respect to first liquid. CONSTITUTION: A first liquid supplying part(51) supplies first liquid to a substrate in order to dissolve a first film on a substrate. A second liquid supplying part supplies second liquid to the substrate in order to reduce the intensity of a second film on the substrate. An impact alleviating part applies impact to the second film on the substrate. A fluid supplying part(52) supplies fluid to the substrate in order to discharge the particles of the second film.
Abstract:
PURPOSE: An apparatus and a method for processing liquid are provided to prevent the contamination of a wafer by cleaning a drain cup with the cleaning liquid. CONSTITUTION: A substrate holding unit and a cup(42) are installed in a process chamber. The substrate holding unit holds the substrate. The cup is arranged around the substrate holding unit. A nozzle supplies processing liquid to the substrate held by the substrate holding unit. A cup cleaning unit(49,49a) cleans the cup by supplying cleaning liquid on the upper part of the cup.
Abstract:
A method is provided for reducing the amount of film fragments (66a) discharged into a processing liquid circulation system (73, 73') during removal of films (66) from wafers (W), thereby reducing the frequency of filter (80) cleaning or filter (80) replacement. The method includes exposing a wafer (W) containing a film (66) formed thereon in a process chamber (46) of a substrate processing system (1) to a processing liquid (64), where the wafer (W) is not rotated or is rotated at a first speed (608a, 908a, 1208a) and the processing liquid (64) is discharged from the process chamber (46) to a processing liquid circulation system (73). Subsequently, exposure of the wafer (W) to the processing liquid (64, 64a, 64b) is discontinued and the wafer (W) is rotated at a second speed (608b, 908b, 1208b) greater than the first speed (608a, 908a, 1208a) to centrifugally remove fragments (66a) of the film (66) from the wafer (W). Next, the wafer (W) is exposed to the same or a different processing liquid (64, 64a, 64b) and the processing liquid (64, 64a, 64b) is discharged from the process chamber (46) to a processing liquid drain (78).