公开(公告)号：SG11201502567TA

公开(公告)日：2015-05-28

申请号：SG11201502567T

申请日：2013-10-29

Applicant: ALPHA METALS

Inventor： GHOSAL SHAMIK ,  PANDHER RANJIT ,  KHASELEV OSCAR ,  BHATKAL RAVI ,  RAUT RAHUL ,  SINGH BAWA ,  RIBAS MORGANA ,  SARKAR SIULI ,  MUKHERJEE SUTAPA ,  KUMAR SATHISH ,  CHANDRAN REMYA ,  VISHWANATH PAVAN ,  PACHAMUTHU ASHOK ,  BOUREGHDA MONNIR ,  DESAI NITIN ,  LIFTON ANNA ,  CHAKI NIRMALYA KUMAR

IPC: C01G5/00 ,  B22F1/00 ,  B22F7/08 ,  B22F9/24 ,  C09C1/62 ,  C09C3/08 ,  C21C1/04

Abstract: A sintering powder comprising:a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent.

公开(公告)号：EP3154729A4

公开(公告)日：2018-02-28

申请号：EP15806611

申请日：2015-06-12

Applicant: ALPHA METALS

Inventor： GHOSHAL SHAMIK ,  KUMAR V SATHISH ,  VISHWANATH PAVAN ,  PANDHER RANJIT S ,  CHANDRAN REMYA ,  MUKHERJEE SUTAPA ,  SARKAR SIULI ,  SINGH BAWA ,  BHATKAL RAVINDRA MOHAN

IPC: B22F1/02 ,  B22F3/10 ,  B22F5/00 ,  B22F7/02 ,  B22F7/04 ,  B23K35/02 ,  B23K35/30 ,  C22C1/04 ,  H01L23/00 ,  H05K1/09

CPC classification number: B22F1/0044 ,  B22F1/02 ,  B22F3/1017 ,  B22F3/22 ,  B22F5/006 ,  B22F7/04 ,  B22F2007/047 ,  B22F2301/255 ,  B22F2999/00 ,  B23K1/0016 ,  B23K3/0607 ,  B23K35/0244 ,  B23K35/3006 ,  B23K2201/40 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/94 ,  H01L24/95 ,  H01L24/97 ,  H01L2221/68313 ,  H01L2221/68368 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05639 ,  H01L2224/11003 ,  H01L2224/11009 ,  H01L2224/111 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/11438 ,  H01L2224/1144 ,  H01L2224/11505 ,  H01L2224/11848 ,  H01L2224/13139 ,  H01L2224/13294 ,  H01L2224/13295 ,  H01L2224/13311 ,  H01L2224/13324 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13363 ,  H01L2224/1338 ,  H01L2224/13384 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13393 ,  H01L2224/13411 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13455 ,  H01L2224/13464 ,  H01L2224/13469 ,  H01L2224/1349 ,  H01L2224/16227 ,  H01L2224/27002 ,  H01L2224/27003 ,  H01L2224/27009 ,  H01L2224/271 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27332 ,  H01L2224/27334 ,  H01L2224/27438 ,  H01L2224/2744 ,  H01L2224/27505 ,  H01L2224/2782 ,  H01L2224/27821 ,  H01L2224/27848 ,  H01L2224/29139 ,  H01L2224/29294 ,  H01L2224/29295 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29363 ,  H01L2224/29364 ,  H01L2224/2938 ,  H01L2224/29384 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29411 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/2949 ,  H01L2224/2969 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/75251 ,  H01L2224/75316 ,  H01L2224/7598 ,  H01L2224/81002 ,  H01L2224/81191 ,  H01L2224/8184 ,  H01L2224/81948 ,  H01L2224/83002 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/0463 ,  H01L2924/0503 ,  H01L2924/05032 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/2064 ,  H05K3/32 ,  H05K2203/1131 ,  B22F1/0018 ,  B22F1/025 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/27 ,  H01L2924/01046 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01006 ,  H01L2924/01005 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.