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公开(公告)号：CA3143377A1
公开(公告)日：2020-12-30
申请号：CA3143377
申请日：2020-06-23
Applicant: IBM
Inventor： BRONN NICHOLAS TORLEIV , BOGORIN DANIELA FLORENTINA , GUMANN PATRYK , HART SEAN , OLIVADESE SALVATORE BERNARDO , ORCUTT JASON
IPC: G06N10/40
Abstract: A system for optical transduction of quantum information includes a qubit chip including a plurality of data qubits configured to operate at microwave frequencies, and a transduction chip spaced apart from the qubit chip, the transduction chip including a microwave-to-optical frequency transducer. The system includes an interposer coupled to the qubit chip and the transduction chip, the interposer including a dielectric material including a plurality of superconducting microwave waveguides formed therein. The plurality of superconducting microwave waveguides is configured to transmit quantum information from the plurality of data qubits to the microwave-to-optical frequency transducer on the transduction chip, and the microwave-to-optical frequency transducer is configured to transduce the quantum information from the microwave frequencies to optical frequencies.
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Patent Agency Ranking
公开(公告)号：AU2020296292A1
公开(公告)日：2021-10-14
申请号：AU2020296292
申请日：2020-06-19
Applicant: IBM
Inventor： JINKA OBLESH , OLIVADESE SALVATORE BERNARDO , HART SEAN , BRONN NICHOLAS TORLEIV , CHOW JERRY , BRINK MARKUS , GUMANN PATRYK , BOGORIN DANIELA FLORENTINA
IPC: F25D19/00 , H01L23/367
Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.
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公开(公告)号：AU2020304788A1
公开(公告)日：2021-10-14
申请号：AU2020304788
申请日：2020-06-23
Applicant: IBM
Inventor： BRONN NICHOLAS TORLEIV , BOGORIN DANIELA FLORENTINA , GUMANN PATRYK , HART SEAN , OLIVADESE SALVATORE BERNARDO , ORCUTT JASON
Abstract: A system for optical transduction of quantum information includes a qubit chip including a plurality of data qubits configured to operate at microwave frequencies, and a transduction chip spaced apart from the qubit chip, the transduction chip including a microwave-to-optical frequency transducer. The system includes an interposer coupled to the qubit chip and the transduction chip, the interposer including a dielectric material including a plurality of superconducting microwave waveguides formed therein. The plurality of superconducting microwave waveguides is configured to transmit quantum information from the plurality of data qubits to the microwave-to-optical frequency transducer on the transduction chip, and the microwave-to-optical frequency transducer is configured to transduce the quantum information from the microwave frequencies to optical frequencies.
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公开(公告)号：AU2020296292B2
公开(公告)日：2022-10-13
申请号：AU2020296292
申请日：2020-06-19
Applicant: IBM
Inventor： JINKA OBLESH , OLIVADESE SALVATORE BERNARDO , HART SEAN , BRONN NICHOLAS TORLEIV , CHOW JERRY , BRINK MARKUS , GUMANN PATRYK , BOGORIN DANIELA FLORENTINA
IPC: F25D19/00 , H01L23/367
Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.
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公开(公告)号：IL288977D0
公开(公告)日：2022-02-01
申请号：IL28897721
申请日：2021-12-13
Applicant: IBM , JINKA OBLESH , OLIVADESE SALVATORE BERNARDO , HART SEAN , BRONN NICHOLAS TORLEIV , CHOW JERRY , BRINK MARKUS , GUMANN PATRYK , BOGORIN DANIELA FLORENTINA
Inventor： JINKA OBLESH , OLIVADESE SALVATORE BERNARDO , HART SEAN , BRONN NICHOLAS TORLEIV , CHOW JERRY , BRINK MARKUS , GUMANN PATRYK , BOGORIN DANIELA FLORENTINA
IPC: F25D19/00 , H01L21/265 , H01L23/367 , H01L23/44
Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.
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公开(公告)号：CA3143434A1
公开(公告)日：2020-12-24
申请号：CA3143434
申请日：2020-06-19
Applicant: IBM
Inventor： JINKA OBLESH , OLIVADESE SALVATORE BERNARDO , HART SEAN , BRONN NICHOLAS TORLEIV , CHOW JERRY , BRINK MARKUS , GUMANN PATRYK , BOGORIN DANIELA FLORENTINA
IPC: F25D3/10 , F25D31/00 , F28D21/00 , H01L23/367
Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.
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