-
公开(公告)号:AU2020296292A1
公开(公告)日:2021-10-14
申请号:AU2020296292
申请日:2020-06-19
Applicant: IBM
Inventor: JINKA OBLESH , OLIVADESE SALVATORE BERNARDO , HART SEAN , BRONN NICHOLAS TORLEIV , CHOW JERRY , BRINK MARKUS , GUMANN PATRYK , BOGORIN DANIELA FLORENTINA
IPC: F25D19/00 , H01L23/367
Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.
-
公开(公告)号:DE112017007883B4
公开(公告)日:2021-07-29
申请号:DE112017007883
申请日:2017-12-13
Applicant: IBM
Inventor: OLIVADESE SALVATORE BERNARDO
Abstract: Supraleitende Kopplungseinheit, die Folgendes aufweist:eine Gruppe untereinander in einem Gitter verbundener supraleitender Einheiten, wobei das Gitter derart in einer einzigen zweidimensionalen Fertigungsebene gefertigt ist, dass eine supraleitende Verbindung unter Verbleib in der Ebene eine erste supraleitende Einheit in der Gruppe nur durch Kreuzen einer Komponente einer zweiten supraleitenden Einheit erreichen kann, die sich ebenfalls in der Ebene befindet,einen in der supraleitenden Verbindung der ersten supraleitenden Einheit gebildeten supraleitenden Koppler, wobei die supraleitende Kopplungseinheit eine Spannweite und eine Abstandshöhe besitzt, wobei ein Teilstück der supraleitenden Kopplungseinheit von der Komponente der zweiten supraleitenden Einheit in einer parallelen Ebene durch den Abstand getrennt ist, undeine erste Massefläche auf einer ersten Seite der Komponente, wobei die supraleitende Kopplungseinheit ein Potenzial der ersten Massefläche mit einem Potenzial einer zweiten Massefläche auf einer zweiten Seite der Komponente in Ausgleich bringt.
-
公开(公告)号:CA3143377A1
公开(公告)日:2020-12-30
申请号:CA3143377
申请日:2020-06-23
Applicant: IBM
Inventor: BRONN NICHOLAS TORLEIV , BOGORIN DANIELA FLORENTINA , GUMANN PATRYK , HART SEAN , OLIVADESE SALVATORE BERNARDO , ORCUTT JASON
IPC: G06N10/40
Abstract: A system for optical transduction of quantum information includes a qubit chip including a plurality of data qubits configured to operate at microwave frequencies, and a transduction chip spaced apart from the qubit chip, the transduction chip including a microwave-to-optical frequency transducer. The system includes an interposer coupled to the qubit chip and the transduction chip, the interposer including a dielectric material including a plurality of superconducting microwave waveguides formed therein. The plurality of superconducting microwave waveguides is configured to transmit quantum information from the plurality of data qubits to the microwave-to-optical frequency transducer on the transduction chip, and the microwave-to-optical frequency transducer is configured to transduce the quantum information from the microwave frequencies to optical frequencies.
-
公开(公告)号:AU2020304788A1
公开(公告)日:2021-10-14
申请号:AU2020304788
申请日:2020-06-23
Applicant: IBM
Inventor: BRONN NICHOLAS TORLEIV , BOGORIN DANIELA FLORENTINA , GUMANN PATRYK , HART SEAN , OLIVADESE SALVATORE BERNARDO , ORCUTT JASON
Abstract: A system for optical transduction of quantum information includes a qubit chip including a plurality of data qubits configured to operate at microwave frequencies, and a transduction chip spaced apart from the qubit chip, the transduction chip including a microwave-to-optical frequency transducer. The system includes an interposer coupled to the qubit chip and the transduction chip, the interposer including a dielectric material including a plurality of superconducting microwave waveguides formed therein. The plurality of superconducting microwave waveguides is configured to transmit quantum information from the plurality of data qubits to the microwave-to-optical frequency transducer on the transduction chip, and the microwave-to-optical frequency transducer is configured to transduce the quantum information from the microwave frequencies to optical frequencies.
-
5.
公开(公告)号:DE112017007883T5
公开(公告)日:2020-05-07
申请号:DE112017007883
申请日:2017-12-13
Applicant: IBM
Inventor: OLIVADESE SALVATORE BERNARDO
IPC: H01L39/24
Abstract: Eine Gruppe supraleitender Einheiten ist in einem Gitter untereinander verbunden, das in einer einzigen zweidimensionalen Fertigungsebene derart gefertigt ist, dass eine supraleitende Verbindung unter Verbleib in der Ebene eine erste supraleitende Einheit in der Gruppe nur durch Kreuzen einer Komponente einer zweiten supraleitenden Einheit erreichen kann, die sich ebenfalls in der Ebene befindet. In der supraleitenden Verbindung der ersten supraleitenden Einheit ist eine supraleitende Kopplungseinheit mit einer Spannweite und einer Abstandshöhe gebildet. Ein Teilstück der supraleitenden Kopplungseinheit ist von der Komponente der zweiten supraleitenden Einheit durch einen Abstand in einer parallelen Ebene getrennt. Ein Potenzial einer ersten Massefläche auf einer ersten Seite der Komponente wird mit einer zweiten Massefläche auf einer zweiten Seite der Komponente mittels der supraleitenden Kopplungseinheit in Ausgleich gebracht.
-
公开(公告)号:AU2020296292B2
公开(公告)日:2022-10-13
申请号:AU2020296292
申请日:2020-06-19
Applicant: IBM
Inventor: JINKA OBLESH , OLIVADESE SALVATORE BERNARDO , HART SEAN , BRONN NICHOLAS TORLEIV , CHOW JERRY , BRINK MARKUS , GUMANN PATRYK , BOGORIN DANIELA FLORENTINA
IPC: F25D19/00 , H01L23/367
Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.
-
公开(公告)号:IL288977D0
公开(公告)日:2022-02-01
申请号:IL28897721
申请日:2021-12-13
Applicant: IBM , JINKA OBLESH , OLIVADESE SALVATORE BERNARDO , HART SEAN , BRONN NICHOLAS TORLEIV , CHOW JERRY , BRINK MARKUS , GUMANN PATRYK , BOGORIN DANIELA FLORENTINA
Inventor: JINKA OBLESH , OLIVADESE SALVATORE BERNARDO , HART SEAN , BRONN NICHOLAS TORLEIV , CHOW JERRY , BRINK MARKUS , GUMANN PATRYK , BOGORIN DANIELA FLORENTINA
IPC: F25D19/00 , H01L21/265 , H01L23/367 , H01L23/44
Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.
-
公开(公告)号:AU2020229982A1
公开(公告)日:2021-09-30
申请号:AU2020229982
申请日:2020-02-24
Applicant: IBM
Inventor: HART SEAN , BRONN NICHOLAS TORLEIV , GUMANN PATRYK , OLIVADESE SALVATORE BERNARDO
IPC: H05K1/02
Abstract: Devices, systems and methods to facilitate transmitting microwave signals to one or more cryogenic stages of a cryogenic refrigerator are provided. According to an embodiment, a device can comprise a monolithic signal carrier device (100a) comprising a thermal barrier (108) disposed within a ground layer (102a, 106a) and a signal layer (104a). The device can further comprise a thermal decoupling device (110) coupled at the thermal barrier to the ground layer and the signal layer.
-
公开(公告)号:CA3143434A1
公开(公告)日:2020-12-24
申请号:CA3143434
申请日:2020-06-19
Applicant: IBM
Inventor: JINKA OBLESH , OLIVADESE SALVATORE BERNARDO , HART SEAN , BRONN NICHOLAS TORLEIV , CHOW JERRY , BRINK MARKUS , GUMANN PATRYK , BOGORIN DANIELA FLORENTINA
IPC: F25D3/10 , F25D31/00 , F28D21/00 , H01L23/367
Abstract: A thermalization structure is formed using a cover configured with a set of pillars, the cover being a part of a cryogenic enclosure of a low temperature device (LTD). A chip including the LTD is configured with a set of cavities, a cavity in the set of cavities having a cavity profile. A pillar from the set of pillars and corresponding to the cavity has a pillar profile such that the pillar profile causes the pillar to couple with the cavity of the cavity profile within a gap tolerance to thermally couple the chip to the cover for heat dissipation in a cryogenic operation of the chip.
-
-
-
-
-
-
-
-