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    Stud bumps for post-measurement qubit frequency modification
    3.
    发明专利
    Stud bumps for post-measurement qubit frequency modification 未知

    公开(公告)号：AU2020224954A1

    公开(公告)日：2021-09-30

    申请号：AU2020224954

    申请日：2020-02-11

    Applicant: IBM

    Inventor： BRONN NICHOLAS TORLEIV ,  HERTZBERG JARED BARNEY ,  LEWANDOWSKI ERIC PETER ,  NAH JAE-WOONG

    IPC: G06N10/00 ,  G01R1/067 ,  H01L21/66 ,  H01L23/00

    Abstract: According to an embodiment of the present invention, a method of producing a quantum computer chip includes performing a frequency measurement on a qubit chip bonded to a test interposer chip for qubits on the qubit chip at an operating temperature of the qubit chip. The method further includes pulling the qubit chip apart from the test interposer chip after performing the frequency measurement, and modifying a frequency of a subset of qubits after pulling the qubit chip apart from the test interposer chip. The method further includes bonding the qubit chip to a device interposer chip after modifying the frequency of the subset of qubits.

    SUPERCONDUCTING INTERPOSER FOR OPTICAL TRANSDUCTION OF QUANTUM INFORMATION
    4.
    发明专利
    SUPERCONDUCTING INTERPOSER FOR OPTICAL TRANSDUCTION OF QUANTUM INFORMATION 未知

    公开(公告)号：CA3143377A1

    公开(公告)日：2020-12-30

    申请号：CA3143377

    申请日：2020-06-23

    Applicant: IBM

    Inventor： BRONN NICHOLAS TORLEIV ,  BOGORIN DANIELA FLORENTINA ,  GUMANN PATRYK ,  HART SEAN ,  OLIVADESE SALVATORE BERNARDO ,  ORCUTT JASON

    IPC: G06N10/40

    Abstract: A system for optical transduction of quantum information includes a qubit chip including a plurality of data qubits configured to operate at microwave frequencies, and a transduction chip spaced apart from the qubit chip, the transduction chip including a microwave-to-optical frequency transducer. The system includes an interposer coupled to the qubit chip and the transduction chip, the interposer including a dielectric material including a plurality of superconducting microwave waveguides formed therein. The plurality of superconducting microwave waveguides is configured to transmit quantum information from the plurality of data qubits to the microwave-to-optical frequency transducer on the transduction chip, and the microwave-to-optical frequency transducer is configured to transduce the quantum information from the microwave frequencies to optical frequencies.

    Superconducting interposer for optical transduction of quantum information
    6.
    发明专利
    Superconducting interposer for optical transduction of quantum information 未知

    公开(公告)号：AU2020304788A1

    公开(公告)日：2021-10-14

    申请号：AU2020304788

    申请日：2020-06-23

    Applicant: IBM

    Inventor： BRONN NICHOLAS TORLEIV ,  BOGORIN DANIELA FLORENTINA ,  GUMANN PATRYK ,  HART SEAN ,  OLIVADESE SALVATORE BERNARDO ,  ORCUTT JASON

    IPC: G06N10/00 ,  G06F1/20

    Abstract: A system for optical transduction of quantum information includes a qubit chip including a plurality of data qubits configured to operate at microwave frequencies, and a transduction chip spaced apart from the qubit chip, the transduction chip including a microwave-to-optical frequency transducer. The system includes an interposer coupled to the qubit chip and the transduction chip, the interposer including a dielectric material including a plurality of superconducting microwave waveguides formed therein. The plurality of superconducting microwave waveguides is configured to transmit quantum information from the plurality of data qubits to the microwave-to-optical frequency transducer on the transduction chip, and the microwave-to-optical frequency transducer is configured to transduce the quantum information from the microwave frequencies to optical frequencies.

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