公开(公告)号：DE3777072D1

公开(公告)日：1992-04-09

申请号：DE3777072

申请日：1987-10-06

Applicant: IBM

Inventor： AINSLIE NORMAN G ,  BRUSIC VLASTA A ,  CHAPMAN DANIEL W ,  ROMANKIW LUBOMYR T ,  WILMER RICHARD K

IPC: G11B5/60 ,  G11B5/31 ,  G11B5/48 ,  G11B5/17

Abstract: A thin film magnetic read/write head/arm assembly and method of manufacturing the same is disclosed herein. Contact soldering (37) of the opposite to disk side of the read/write head (35) to a cable (33) in laminate relationship to the suspension arm (31), or a polyimide strip with conductors deposited thereon provides both electrical interconnection and mechanical support. Semiconductor devices (40) can also be intermediately soldered between the head and cable for maximum noise suppression.

公开(公告)号：DE69302205D1

公开(公告)日：1996-05-23

申请号：DE69302205

申请日：1993-02-15

Applicant: IBM

Inventor： BRUSIC VLASTA A ,  FRANKEL GERALD SIMON ,  PETERSEN TINA ALEXEANDRIA ,  RUSH BENJAMIN MARK ,  SCHROTT ALEJANDRO G

IPC: C23F11/00 ,  C23F11/10 ,  C23F11/14 ,  G11B5/187 ,  G11B5/31 ,  G11B5/72 ,  G11B5/84

Abstract: A corrosion protecting film layer is formed on a non-passivating non-noble metal, such as cobalt, by placing the metal in a dilutesolution of Cu ions and benzotriazole (1 H-BTA). Exposure of the metal to a solution containing Cu and 1 H-BTA results in a spontaneous interaction of Cu and the metal to produce a film layer of Cu(I)BTA on the metal surface to create a permanent corrosion protection for the metal. A borate buffer, such as boric acid and a borate, can be added to the solution to adjust the pH of the solution to be in the range between 8 and 9.

公开(公告)号：DE69302205T2

公开(公告)日：1996-10-10

申请号：DE69302205

申请日：1993-02-15

Applicant: IBM

Inventor： BRUSIC VLASTA A ,  FRANKEL GERALD SIMON ,  PETERSEN TINA ALEXEANDRIA ,  RUSH BENJAMIN MARK ,  SCHROTT ALEJANDRO G

IPC: C23F11/00 ,  C23F11/10 ,  C23F11/14 ,  G11B5/187 ,  G11B5/31 ,  G11B5/72 ,  G11B5/84

Abstract: A corrosion protecting film layer is formed on a non-passivating non-noble metal, such as cobalt, by placing the metal in a dilutesolution of Cu ions and benzotriazole (1 H-BTA). Exposure of the metal to a solution containing Cu and 1 H-BTA results in a spontaneous interaction of Cu and the metal to produce a film layer of Cu(I)BTA on the metal surface to create a permanent corrosion protection for the metal. A borate buffer, such as boric acid and a borate, can be added to the solution to adjust the pH of the solution to be in the range between 8 and 9.

公开(公告)号：HK1018999A1

公开(公告)日：2000-01-14

申请号：HK98111592

申请日：1998-10-29

Applicant: IBM

Inventor： BRUSIC VLASTA A ,  DAREKAR VIJAY S ,  GAYNES MICHAEL A ,  SARAF RAVI F

IPC: B05D3/02 ,  B05D7/16 ,  B23K35/00 ,  B23K35/02 ,  B23K35/34 ,  B23K35/36 ,  C23C22/02 ,  C23C22/68 ,  C23C30/00 ,  C23F11/14 ,  H05K3/10 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34 ,  H05K ,  C23F ,  B23K

Abstract: Copper-containing surfaces of substrates such as laminated electronic circuit boards are protected by organometallic coatings comprising organic compounds selected from the group consisting of benzimidazoles, alkylimidazoles, benzotriazozles and alkyltriazoles, substituted or unsubstituted, and metal particles of solder-wettable metals or metal solders. The metal particles can be thermally formed in situ from metallic compounds such as noble metal acetates, acetylacetonates and carbonates.

公开(公告)号：CA1241452A

公开(公告)日：1988-08-30

申请号：CA509371

申请日：1986-05-16

Applicant: IBM

Inventor： BRUSIC VLASTA A ,  ELMGREN PETER J ,  OWEN CHARLES J ,  SISSENSTEIN DAVID W JR ,  YEH HELEN L

IPC: B23K1/00 ,  B23K1/008 ,  B23K35/36 ,  B23K35/38 ,  B23K101/42 ,  H05K3/34

Abstract: REDUCTION ATMOSPHERE WORKPIECE JOINING A workpiece is joined to a substrate by employing solder and applying diol and/or polyol and/or ether derivative thereof to the substrate. The workpiece is placed in contact with the diol and/or polyol and the resulting assembly is heated in a reducing atmosphere.