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公开(公告)号：JP2002294469A
公开(公告)日：2002-10-09
申请号：JP2002084108
申请日：2002-03-25
Applicant: IBM
Inventor： BIETSCH ALEXANDER , DELAMARCHE EMMANUEL , GEISSLER MATTHIAS , MICHEL BRUNO , SCHMIDT HEINZ
IPC: C23F1/00 , C23F1/02 , C23F1/34 , C23F1/40 , H01L21/768
Abstract: PROBLEM TO BE SOLVED: To provide a fine structure by etching a substrate having a region covered with self-assembly monomolecule(SAM). SOLUTION: A wet etching system for selectively forming a pattern on the substrate having the region covered with SAM and controlling an etching profile, includes (a) a fluid etching solution, and (b) additives having higher affinity for the region covered with the SAM than for the other region. The method for selectively forming the pattern on the substrate having the region covered with the SAM and controlling the etching profile, includes (a) a step of providing a fluid etching solution, (b) a step of adding the additives having the higher affinity for the region covered with SAM than for the other region to the above etching solution, and (c) a step of etching the above substrate with the above fluid etching solution containing the above additives.
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Patent Agency Ranking2.发明专利
公开(公告)号：JP2005142175A
公开(公告)日：2005-06-02
申请号：JP2002358524
申请日：2002-12-10
Applicant: Internatl Business Mach Corp
, インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation Inventor： DELAMARCHE EMMANUEL , GEISSLER MATTHIAS , WOLF HEIKO
IPC: H01L21/027
Abstract: PROBLEM TO BE SOLVED: To provide a method of forming a pattern on an article (10) made of a copper layer (12) formed on an insulating substrate (11) by means of a novel positive microcontact printing (MCP) process.
SOLUTION: A natural oxide present on a Cu layer is removed in HCl solution. Then, an inking layer (15') is formed on a stamp (13') consisting of a polydimethyl siloxane object (14) with a pattern formed by inking it for one minute in 0.2 mM ethanol solution of pentaerythritol-tetrakis. This stamp is applied to the Cu layer, and a first self-assembly monomolecular layer (SAM) (16') is printed according to a desired pattern. The article is soaked in ECT solution. The ECT is adsorbed only in a non-printed region, and the second SAM (18) of a complementary shape to the desired pattern is formed. Finally, the printed region on the Cu layer is removed by means of a peroxodisulfate etching bath.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题：提供一种通过新颖的正微接触印刷（MCP）工艺在由绝缘衬底（11）上形成的铜层（12）制成的制品（10）上形成图案的方法 。 解决方案：在HCl溶液中除去存在于Cu层上的天然氧化物。 然后，在由聚二甲基硅氧烷物体（14）组成的印模（13'）上形成着墨层（15'），所述印模（13'）具有通过在季戊四醇四甲醇的0.2mM乙醇溶液中着墨1分钟形成的图案。 将该印模施加于Cu层，根据所需图案印刷第一自组装单分子层（SAM）（16'）。 该文章浸泡在ECT解决方案中。 ECT仅吸附在非印刷区域中，形成与期望图案互补形状的第二SAM（18）。 最后，通过过二硫酸盐蚀刻浴去除Cu层上的印刷区域。 版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JP2002356075A
公开(公告)日：2002-12-10
申请号：JP2002072713
申请日：2002-03-15
Applicant: IBM
Inventor： SCHMIDT HEINZ , JUNCKER DAVID , MICHEL BRUNO , WOLF HEIKO , GEISSLER MATTHIAS
Abstract: PROBLEM TO BE SOLVED: To provide a patterning mask enabling formation of a pattern with increased precision. SOLUTION: Regarding the patterning mask 6 having a substantially planar patterned printing layer 2, the printing layer 2 has a substantially non-elastic stencil layer 3 and a substantially elastic seal layer 4 fixed on the stencil layer 3. The seal layer 4 performs a function of a seal in regard to a liquid, viscous or gaseous material 7 that can be filled on a base 5 through the patterned printing layer 2 when the layer 4 is in contact with the base 5. Moreover, the mask may have a mesh layer. The mesh layer has openings isolated by a solid element and having a two-dimensional regular pattern and rigidity can be given to the mesh plane thereof.
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公开(公告)号：DE60024046T2
公开(公告)日：2006-07-27
申请号：DE60024046
申请日：2000-06-15
Applicant: IBM
Inventor： BIEBUYCK HANS , DELAMARCHE EMMANUEL , GEISSLER MATTHIAS , KIND HANNES , MICHEL BRUNO
Abstract: Methods for electroless deposition of conductive material on a substrate using in both cases a stamp having a patterned surface which is pressed onto the surface of a substrate for printing the substrate and providing a pattern of a catalyst on the substrate on which metal deposition occurs in the course of electroless deposition by immersing the printed substrate in a plating bath are provided. In one case, the stamp is pretreated to render the pattern of the stamp wettable with a catalytic ink which is transformed to the surface of the substrate. In the other case, a catalytic layer is provided on the surface of the substrate which is patterned by the stamp transferring a resist material onto the catalytic layer so that a subsequent etching process lays open the desired pattern of the catalytic layer for electroless deposition.
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公开(公告)号：DE60024046D1
公开(公告)日：2005-12-22
申请号：DE60024046
申请日：2000-06-15
Applicant: IBM
Inventor： BIEBUYCK HANS , DELAMARCHE EMMANUEL , GEISSLER MATTHIAS , KIND HANNES , MICHEL BRUNO
Abstract: Methods for electroless deposition of conductive material on a substrate using in both cases a stamp having a patterned surface which is pressed onto the surface of a substrate for printing the substrate and providing a pattern of a catalyst on the substrate on which metal deposition occurs in the course of electroless deposition by immersing the printed substrate in a plating bath are provided. In one case, the stamp is pretreated to render the pattern of the stamp wettable with a catalytic ink which is transformed to the surface of the substrate. In the other case, a catalytic layer is provided on the surface of the substrate which is patterned by the stamp transferring a resist material onto the catalytic layer so that a subsequent etching process lays open the desired pattern of the catalytic layer for electroless deposition.
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公开(公告)号：AU4944700A
公开(公告)日：2001-01-09
申请号：AU4944700
申请日：2000-06-15
Applicant: IBM
Inventor： BIEBUYCK HANS , DELAMARCHE EMMANUEL , GEISSLER MATTHIAS , KIND HANNES , MICHEL BRUNO
Abstract: Methods for electroless deposition of conductive material on a substrate using in both cases a stamp having a patterned surface which is pressed onto the surface of a substrate for printing the substrate and providing a pattern of a catalyst on the substrate on which metal deposition occurs in the course of electroless deposition by immersing the printed substrate in a plating bath are provided. In one case, the stamp is pretreated to render the pattern of the stamp wettable with a catalytic ink which is transformed to the surface of the substrate. In the other case, a catalytic layer is provided on the surface of the substrate which is patterned by the stamp transferring a resist material onto the catalytic layer so that a subsequent etching process lays open the desired pattern of the catalytic layer for electroless deposition.
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