Multi-voltage plane, multi-signal plane circuit card.

    公开(公告)号:HK1028866A1

    公开(公告)日:2001-03-02

    申请号:HK00106779

    申请日:2000-10-25

    Applicant: IBM

    Abstract: A technique for forming an organic chip carrier or circuit board, having two voltage planes and at least two signal planes is provided which includes bonding a first layer of photolithographic dielectric material to a first metal layer and exposing the first layer of dielectric material to a pattern of radiation to provide at least one opening through the first layer of the dielectric material. A second metal layer is bonded to the first layer of photoimageable material on the opposite side from the first metal layer. Holes are etched in the first and second metal layers which correspond to and are larger than each of the patterns on said openings in the first layer of dielectric material. The exposed pattern on the first layer of dielectric material is then developed, with the openings in the first and second metal layers being larger than the corresponding developed opening in the first dielectric material. Second and third layers of photoimageable dielectric material are applied on the first and second metal layers, respectively and are photopatterned and developed to provide openings in each of the second and third layers of dielectric material some of which correspond to each of the holes in the first layer of dielectric material and the holes in the first and second metal layers, some of which terminate at the underlying metal layer. The exposed surfaces of both the second and third dielectric material, are circuitized and the holes plated or filled with metal.

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