公开(公告)号：JP2004200684A

公开(公告)日：2004-07-15

申请号：JP2003413888

申请日：2003-12-11

Applicant: Internatl Business Mach Corp ,  インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Maschines Corporation

Inventor： CHEN SHYNG-TSONG ,  DALTON TIMOTHY J ,  DAVIS KENNETH M ,  HU CHAO-KUN ,  JAMIN FEN F ,  KALDOR STEFFEN K ,  KRISHNAN MAHADEVAIYER ,  KUMAR KAUSHIK ,  MICHAEL F ROFARO ,  SANDRA G MARUHOTORA

IPC: H01L21/768 ,  H01L23/532

CPC classification number: H01L21/76849 ,  H01L21/76834 ,  H01L21/76847 ,  H01L21/76883 ,  H01L23/53238 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide the structure of an integrated circuit having a logic/functional device layer and an interconnection layer above it. SOLUTION: This interconnection layer has a substrate, a conductive feature 122 in the substrate, and a cap 151 which is formed only above the conductive feature. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JPH1110524A

公开(公告)日：1999-01-19

申请号：JP15966098

申请日：1998-06-08

Applicant: IBM

Inventor： THOMAS R FISHER ,  CAROL E GASTAFSON ,  MICHAEL F ROFARO

IPC: B24B37/30 ,  B24B53/007 ,  B24B53/017 ,  B24B57/02 ,  H01L21/304 ,  B24B37/00

Abstract: PROBLEM TO BE SOLVED: To provide a wafer carrier assembly for readjusting a pad for chemo- mechanically grinding a wafer and employed in a device and a method for manufacturing a semiconductor. SOLUTION: A wafer carrier assembly includes a subassembly for adjusting a pad of an original position nondestructively and continuously cleaning the surface of the pad with active liquid as special features. The active liquid may be, in quality, abrasive like slurry or nonabrasive like deionized water. The active liquid helps removing of slurry or residual substance from the surface of the pad. The wafer carrier assembly according to the present invention includes a plurality of legs 102 and a skirt 106 for distributing and supplying adjusting liquid for adjusting the grinding surface of the pad which is rotatably mounted on the leg and chemo-mechanically grind a wafer.

公开(公告)号：JP2001353656A

公开(公告)日：2001-12-25

申请号：JP2001127185

申请日：2001-04-25

Applicant: IBM

Inventor： CHEN SHYNG-TSONG ,  MICHAEL F ROFARO ,  SMITH WOODY RAY

IPC: B24B37/22 ,  B24B37/24 ,  B24B49/08 ,  B24D13/20 ,  H01L21/304 ,  B24B37/00

Abstract: PROBLEM TO BE SOLVED: To provide a stacked type wafer polishing pad capable of changing its hardness. SOLUTION: A polishing pad assembly to be used in a chemical machinery polishing device having a polishing platen is provided. This polishing pad assembly includes a first pad disposed on the platen. The first pad is provided with a sealable enclosure having a flexible skin in which porous material is partially filled. A control mechanism is adapted to inject fluid into the enclosure, and extract fluid from the enclosure. Hardness of the first pad is changed in accordance with quantity of fluid in the enclosure. A second pad is disposed on the first pad.

公开(公告)号：JP2001127025A

公开(公告)日：2001-05-11

申请号：JP2000273239

申请日：2000-09-08

Applicant: IBM

Inventor： KARL E BOGGS ,  KENNETH M DAVIS ,  WILLIAM F LANDERS ,  MICHAEL F ROFARO ,  ADAM D TEIKKUNOA ,  RONALD D FIIJII

IPC: B24B37/30 ,  B24B37/32 ,  B24B49/12 ,  B24B49/16 ,  H01L21/302 ,  H01L21/304 ,  B24B37/00

Abstract: PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing(CMP) control system for controlling pressure distribution on the back face of a semiconductor wafer to be polished. SOLUTION: This system is provided with a CMP device having a carrier 14 for supporting a semiconductor wafer. The carrier 14 is provided with plural two-way function piezoelectric actuators 41 and 42. The actuators 41 and 42 detect pressure change across the semiconductor wafer, and the actuators 41 and 42 can be individually controlled. A controller connected with the actuators 41 and 42 control the actuators 41 and 42 to apply pressure distribution controlled across the semiconductor wafer by monitoring the detected pressure change.