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公开(公告)号：DE1271235B
公开(公告)日：1968-06-27
申请号：DE1271235
申请日：1964-12-09
Applicant: IBM
Inventor： ROCHE KEVIN JOSEPH , PALMATEER PAUL HARRY
Abstract: 1,015,827. Printed circuits. INTERNATIONAL BUSINESS MACHINES CORPORATION. Nov. 30, 1964 [Dec. 23, 1963], No. 48526/64. Heading H1R. In a method of forming a conductive connection between conductive sheets 12, 14 clad on opposite faces of a dielectric sheet 10, an aperture is produced in sheet 12 by a photo-etching process, then a registering aperture is etched in sheet 10, after which a layer 22 of copper is electrolytically deposited on layer 12 and inside the apertures, wherein it contacts the inner surface 20 of layer 14. The area to be electroplated is first seeded with an electroless deposit of palladium chloride, and the copper may be coated with silver, nickel, lead-tin solder &c. Subsequently, desired circuit patterns are formed in layers 12-22 and 14. When dielectric layer 10 is of polyethylene-terephthalate, or phenolic or epoxy material, hot concentrated sulphuric acid is used to etch the aperture therein; the glass fibres in epoxy glass require hot concentrated sodium hydroxide o hydrofluoric acid as etchant. When multilayer circuit boards are used, undercutting of dielectric layers is minimized by etching each layer independently with intermediate rinsings. Instead of plating the apertures, solder balls may be inserted and applied by heating. To etch a hole in a dielectric sheet having one surface only conductor-clad, the unclad surface is masked, except at the site of the hole, with a metallic resist.
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公开(公告)号：DE3170758D1
公开(公告)日：1985-07-04
申请号：DE3170758
申请日：1981-10-29
Applicant: IBM
Inventor： AINSLIE NORMAN GEORGE , KRZANOWSKI JAMES EDWARD , PALMATEER PAUL HARRY
Abstract: Brazing of metallic elements to an electronic circuit board carrying a plurality of chips requires brazing materials which remain strong at high temperatures used to remove and replace the chips attached by solder balls to the board. According to the present invention flanges and pins (19) are brazed to the board (10) with a gold tin brazing solder (15) which is modified during brazing by addition of a Group IB metal (13) to promote formation of the higher melting point β phase of the solder and a Group VIII metal (14) to drawtin out of the melt by gettering. The melting temperature of the brazing solder is raised substantially during brazing to a value above the melting temperature of the solder balls attached to the chips.
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公开(公告)号：DE3279431D1
公开(公告)日：1989-03-09
申请号：DE3279431
申请日：1982-12-20
Applicant: IBM
Inventor： MASTER RAJ NAVINCHANDRA , PITTLER MARVIN STANLEY , TOTTA PAUL ANTHONY , AINSLIE NORMAN GEORGE , PALMATEER PAUL HARRY
Abstract: In the process for joining metallic coated connector pins (20) to a multilayer ceramic substrate (10), contact areas on the substrate are formed by sequential coatings of molybdenum (12) and nickel (14), which are heated to diffuse the nickel. A pure gold paste is applied by screen printing, for example, followed by the step of firing to burn out the paste binder and to sinter the pure gold particles onto a dense low porosity structure. The sintering operation converts the Ni film (14) into a continuous Au-Ni solid solution. During pin braze, Ni-Sn intermetallics are dispersed in a gold rich matrix of the Au-Ni solid solution.
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Patent Agency Ranking
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公开(公告)号：DE3781367T2
公开(公告)日：1993-04-01
申请号：DE3781367
申请日：1987-09-01
Applicant: IBM
Inventor： AGARWALA BIRENDRA NATH , PALMATEER PAUL HARRY , SHIH DA YUAN
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公开(公告)号：DE3781367D1
公开(公告)日：1992-10-01
申请号：DE3781367
申请日：1987-09-01
Applicant: IBM
Inventor： AGARWALA BIRENDRA NATH , PALMATEER PAUL HARRY , SHIH DA YUAN
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公开(公告)号：DE3277174D1
公开(公告)日：1987-10-15
申请号：DE3277174
申请日：1982-10-26
Applicant: IBM
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