Abstract:
A semiconductor laser diode (30), comprising a waveguide being terminated by a back facet (34) and a front facet (33). These facets (33, 34) comprise a front facet coating (31B) and a back facet coating (21A) having a reflectivity providing for controlled decoupling of light at said front facet (33) from the standing lightwave in said waveguide. The front facet coating (31B) comprises a stack of layers providing for a phase shift of the standing lightwave within said waveguide such that the intensity of the lightwave at said front facet (33), where light it is decoupled from said standing lightwave, has a relative minimum.
Abstract:
PROBLEM TO BE SOLVED: To provide a reliable semiconductor laser diode, in which a catastrophic optical mirror damage(COMD) is reduced and deterioration behavior is significantly improved, and its manufacturing method. SOLUTION: In a semiconductor laser diode 30 containing a waveguide which ends at a rear end surface 34 and a front end surface 33, these end surfaces contain a rear end surface coating 21A and a front end surface coating 31B having reflectance which causes controlled decoupling from the standing light wave of the light in the front end surface 33 in the waveguide. The front end surface coating 31B contains a stack of layers which causes phase shift of the standing light wave in the waveguide so that intensity of the light wave in the front end surface 33 where the light is decoupled from the standing light wave has a minimum value.
Abstract:
A method, and devices produced therewith, for the epitaxial growth of sub-micron semiconductor structures with at least one crystal plane dependently grown, buried active layer (24) consisting of a III-V compound. The active layer (24) and adjacent embedding layers (23, 25) form a heterostructure produced in a one-step growth process not requiring removal of the sample from the growth chamber inbetween layer depositions. The layers of the structure are grown on a semiconductor substrate (21) having a structured surface exposing regions of different crystal orientation providing growth- and no-growth-planes for the selective growth process. The method allows the production of multiple, closely spaced active layers and of layers consisting of adjoining sections having different physical properties.
Abstract:
A semiconductor laser diode, and a method for producing the semiconductor laser diode, includes a waveguide being terminated by a back facet and a front facet and a front facet coating and a back facet coating having a reflectivity providing for controlled decoupling of light at the front facet from the standing lightwave in the waveguide. The front facet coating includes a stack of layers providing for a phase shift of the standing lightwave within the waveguide such that the intensity of the lightwave at the front facet, where the light is decoupled from the standing lightwave, has a relative minimum.
Abstract:
SZ 9-91-002 Semiconductor device (30) such as a laser diode grown on a structured substrate surface having horizontal regions with adjacent inclined sidewall surfaces: the horizontal regions (32o) of standard orientation like (100) or slightly off, the inclined surfaces (32m) misoriented. The layers (33 to 36) forming the device are grown over the structured surface, at least the active layer (34) being of a semiconductor material that assumes ordered or disordered states depending on the orientation or misorientation of the substrate surface. The center section (34a) of the active layer is deposited over a horizontal substrate region (32o), this section thus being in the ordered state and having a lower bandgap energy than terminating sections (34b) grown on inclined substrate regions (32m), therefore having a wider bandgap. The active layer can be terminated in either lateral direction with wider bandgap material whereby devices of a buried structure, with strong carrier confinement, and/or with non-absorbing mirrors, allowing high optical power operation, can be realized.
Abstract:
The invention concerns AlGalnP/GalnP visible laser diodes and LEDs withimproved maximum output power. This is achieved by embedding the active region of the diode (30), e.g. a GalnP active layer (35), between very thin pand n-doped AlGalnP barrier layers (34.1, 34.2) and thick p- and n-doped AlGaAs cladding layers (33, 36). The inventive barrier layers (34.1, 34.2) are employedto avoid tunneling and spill over of carriers from the active region (35) into the cladding (33, 36). These barrier layers (34.1, 34.2) can be very thin thus allowing bandgap engineering and providing for barriers with low defect density. In addition the low resistance of the AlGaAs cladding reduces the thermal and electrical resistances of the device.
Abstract:
A semiconductor laser diode, and a method for producing the semiconductor laser diode, includes a waveguide being terminated by a back facet and a front facet and a front facet coating and a back facet coating having a reflectivity providing for controlled decoupling of light at the front facet from the standing lightwave in the waveguide. The front facet coating includes a stack of layers providing for a phase shift of the standing lightwave within the waveguide such that the intensity of the lightwave at the front facet, where the light is decoupled from the standing lightwave, has a relative minimum.
Abstract:
A semiconductor laser diode, and a method for producing the semiconductor laser diode, includes a waveguide being terminated by a back facet and a front facet and a front facet coating and a back facet coating having a reflectivity providing for controlled decoupling of light at the front facet from the standing lightwave in the waveguide. The front facet coating includes a stack of layers providing for a phase shift of the standing lightwave within the waveguide such that the intensity of the lightwave at the front facet, where the light is decoupled from the standing lightwave, has a relative minimum.
Abstract:
A method, and devices produced therewith, for the epitaxial growth of sub-micron semiconductor structures with at least one crystal plane dependently grown, buried active layer (24) consisting of a III-V compound. The active layer (24) and adjacent embedding layers (23, 25) form a heterostructure produced in a one-step growth process not requiring removal of the sample from the growth chamber inbetween layer depositions. The layers of the structure are grown on a semiconductor substrate (21) having a structured surface exposing regions of different crystal orientation providing growth- and no-growth-planes for the selective growth process. The method allows the production of multiple, closely spaced active layers and of layers consisting of adjoining sections having different physical properties.