公开(公告)号：WO2004022338A3

公开(公告)日：2004-07-01

申请号：PCT/IB0303834

申请日：2003-08-28

Applicant: IBM ,  BIETSCH ALEXANDER ,  DELAMARCHE EMMANUEL ,  MICHEL BRUNO ,  SCHMID HEINZ ,  WOLF HEIKO

Inventor： BIETSCH ALEXANDER ,  DELAMARCHE EMMANUEL ,  MICHEL BRUNO ,  SCHMID HEINZ ,  WOLF HEIKO

IPC: B01J19/00 ,  B01L99/00 ,  B41K1/30 ,  B41M3/00 ,  C40B30/08 ,  C40B40/18 ,  C40B60/14 ,  G01N35/10 ,  H05K3/12 ,  B41K3/02 ,  B41K3/04 ,  B41K3/12 ,  B41K3/18 ,  G01N1/34 ,  G01N1/40

CPC classification number: B01J19/0093 ,  B01J2219/00382 ,  B01J2219/00527 ,  B01J2219/0072 ,  B01J2219/0074 ,  B01J2219/00745 ,  B01J2219/00747 ,  B01J2219/00783 ,  B01J2219/00833 ,  B01L3/0293 ,  B01L2300/0819 ,  B41K1/30 ,  B41M3/006 ,  C40B30/08 ,  C40B40/18 ,  C40B60/14 ,  G01N35/1002 ,  G01N2035/1034 ,  H05K3/12 ,  Y10S977/887

Abstract: A method for transferring a pattern from an elastic stamp to a substrate in the presence of a third medium is described. A proximity contact is achieved between the stamp and the substrate. A layer of the third medium between the stamp and the substrate is controlled to a predetermined thickness. Stamps for carrying out this method are also described.

Abstract translation: 描述了在存在第三介质的情况下将图案从弹性印模转移到基板的方法。 在印模和基板之间实现接近接触。 将印模和基板之间的第三介质层控制到预定厚度。 还描述了用于执行该方法的邮票。

公开(公告)号：WO2012001600A3

公开(公告)日：2012-03-01

申请号：PCT/IB2011052792

申请日：2011-06-24

Applicant: IBM ,  BANGSARUNTIP SARUNYA ,  BJOERK MIKAEL T ,  COHEN GUY M ,  RIEL HEIKE E ,  SCHMID HEINZ

Inventor： BANGSARUNTIP SARUNYA ,  BJOERK MIKAEL T ,  COHEN GUY M ,  RIEL HEIKE E ,  SCHMID HEINZ

IPC: H01L29/12 ,  B82Y10/00 ,  B82Y40/00 ,  H01L29/06 ,  H01L29/775 ,  H01L29/778 ,  H01L29/78 ,  H01L33/02

CPC classification number: H01L29/0665 ,  B82Y10/00 ,  B82Y40/00 ,  H01L21/02381 ,  H01L21/0243 ,  H01L21/02521 ,  H01L21/02543 ,  H01L21/02603 ,  H01L21/02658 ,  H01L29/0673 ,  H01L29/068 ,  H01L29/125 ,  H01L29/42392 ,  H01L29/775 ,  H01L29/778 ,  H01L29/78681 ,  H01L29/78696

Abstract: A method of forming a semiconductor is provided and includes patterning a pad and a nanowire onto a wafer, the nanowire being substantially perpendicular with a pad sidewall and substantially parallel with a wafer surface and epitaxially growing on an outer surface of the nanowire a secondary layer of semiconductor material, which is lattice mismatched with respect to a material of the nanowire and substantially free of defects.

Abstract translation: 提供了形成半导体的方法，并且包括将衬垫和纳米线图案化到晶片上，所述纳米线基本上与衬垫侧壁垂直并且基本上平行于晶片表面并且外延生长在纳米线的外表面上， 半导体材料，其相对于纳米线的材料而晶格失配并且基本上没有缺陷。

公开(公告)号：WO2006061257A2

公开(公告)日：2006-06-15

申请号：PCT/EP2005013973

申请日：2005-12-06

Applicant: ESSILOR INT ,  IBM ,  BEGON CEDRIC ,  CANO JEAN-PAUL ,  SCHMID HEINZ

Inventor： BEGON CEDRIC ,  CANO JEAN-PAUL ,  SCHMID HEINZ

IPC: G03H1/00 ,  B24B13/005 ,  B29D11/00 ,  G03H1/08

CPC classification number: G03H1/0276 ,  B82Y30/00 ,  G03H1/0011 ,  G03H1/0236 ,  G03H1/0244 ,  G03H1/0841 ,  G03H1/0891 ,  G03H2001/043 ,  G03H2001/187 ,  G03H2001/2231 ,  G03H2001/2234 ,  G03H2001/306 ,  G03H2260/63 ,  G03H2270/11 ,  G03H2270/52 ,  G03H2270/55

Abstract: A method for printing a binary hologram on a manufactured product comprises the provision of a stamp with a pattern corresponding to the hologram (30). The product is initially coated with a metal layer. The stamp is inked with a masking solution (40) and pressed against the manufactured product (50). Then, the hologram print is obtained by selective etching of parts of the metal layer which are not masked (60). The method is adapted for printing holograms on optical lenses.

Abstract translation: 在制造产品上印刷二值全息图的方法包括提供具有与全息图（30）对应的图案的印模。 产品最初涂有金属层。 印模用掩蔽溶液（40）着墨并压靠制成品（50）。 然后，通过选择性蚀刻未被掩蔽的金属层的部分（60）获得全息图印刷。 该方法适用于在光学透镜上打印全息图。

公开(公告)号：BRPI0518412A2

公开(公告)日：2008-11-18

申请号：BRPI0518412

申请日：2005-12-06

Applicant: IBM ,  ESSILOR INT

Inventor： BEGON CEDRIC ,  CANO JEAN-PAUL ,  SCHMID HEINZ

IPC: G03H1/00 ,  B24B13/005 ,  B29D11/00 ,  G03H1/08

Abstract: A method for printing a binary hologram on a manufactured product comprises the provision of a stamp with a pattern corresponding to the hologram (30). The product is initially coated with a metal layer. The stamp is inked with a masking solution (40) and pressed against the manufactured product (50). Then, the hologram print is obtained by selective etching of parts of the metal layer which are not masked (60). The method is adapted for printing holograms on optical lenses.

公开(公告)号：DE60310443D1

公开(公告)日：2007-01-25

申请号：DE60310443

申请日：2003-08-28

Applicant: IBM

Inventor： BIETSCH ALEXANDER ,  DELAMARCHE EMMANUEL ,  MICHEL BRUNO ,  SCHMID HEINZ ,  WOLF HEIKO

IPC: B01J19/00 ,  B01L99/00 ,  B41K1/30 ,  B41M3/00 ,  C40B30/08 ,  C40B40/18 ,  C40B60/14 ,  G01N35/10 ,  H05K3/12

Abstract: A stamp for transferring a pattern to a substrate in the presence of a third medium, includes a permeable hydrophilic matrix for guiding excess third medium away from the surface of the stamp.

公开(公告)号：GB2357731B

公开(公告)日：2003-09-24

申请号：GB0031205

申请日：2000-12-21

Applicant: IBM

Inventor： BRUNO MICHEL ,  SCHMID HEINZ ,  DELAMARCHE EMMANUEL ,  BIETSCH ALEXANDER

IPC: B41K1/02 ,  B41K3/00 ,  B41K3/04 ,  B41M1/02 ,  B41N10/04 ,  G03F7/00

Abstract: A stamp device for printing a pattern on a surface of a substrate having a two-sided rigid carrier layer providing on its first side a patterned layer made of a first material and being combined on its second side with a soft layer made of a softer material than that of the first material.

公开(公告)号：DE69724159D1

公开(公告)日：2003-09-18

申请号：DE69724159

申请日：1997-09-19

Applicant: IBM

Inventor： BIEBUYCK HANS ,  MICHEL BRUNO ,  SCHMID HEINZ

IPC: G03F1/00 ,  G03F7/20 ,  H01L21/027 ,  G03F1/14

Abstract: Optical lithography scheme making use of light coupling structures, and elastomeric light coupling structures in particular. These light coupling structures comprise protruding portions and connecting portions. The protruding elements are designed to be brought into conformal contact with a resist to be exposed such that the light guided into the protruding elements is coupled from there directly into the resist. The lateral shape and size of the protruding elements defines 1:1 the lateral size and shape of small features to be exposed in the resist.

公开(公告)号：DE112011100856T5

公开(公告)日：2013-01-24

申请号：DE112011100856

申请日：2011-05-23

Applicant: IBM

Inventor： BJOERK MIKAEL T ,  RIEL HEIKE E ,  SCHMID HEINZ

IPC: C30B11/10 ,  C30B11/12 ,  C30B13/18 ,  C30B15/08 ,  H01L31/18

Abstract: Ein Verfahren zur Herstellung eines monokristallinen Blatts (11), insbesondere eines Siliciumblatts (11), umfasst das Folgende: Bereitstellen von mindestens zwei Öffnungselementen (1, 2), welche zwischen sich eine Lücke (3) bilden; Bereitstellen einer geschmolzenen Legierung (4), welche Silicium umfasst, in der Lücke (3) zwischen den mindestens zwei Öffnungselementen (1, 2); Bereitstellen eines gasförmigen Vorstufenmediums (5), welches Silicium umfasst, in Nachbarschaft der geschmolzenen Legierung (4); Bereitstellen eines Silicium-Keimkristalls (6) in Nachbarschaft der geschmolzenen Legierung (4) und In-Kontakt-Bringen des Silicium-Keimkristalls (6) mit der geschmolzenen Legierung (4). Eine Einheit (10, 20) zur Herstellung eines monokristallinen Blatts (11), insbesondere eines Siliciumblatts (11), umfasst mindestens zwei Öffnungselemente (1, 2) in einem vorgegebenen Abstand (D) voneinander, wodurch eine Lücke (3) gebildet wird, und welche dafür geeignet sind, erwärmt zu werden, um einest, durch die Oberflächenspannung in der Lücke (3) zwischen den Öffnungselementen (1, 2) zu halten; ein Mittel (15) zum Zuführen eines gasförmigen Vorstufenmediums (5), welches Silicium umfasst, in die Nachbarschaft der geschmolzenen Legierung (4) und ein Positioniermittel (16) zum Halten und Bewegen eines Keimkristalls (6) in Nachbarschaft der geschmolzenen Legierung (2).

公开(公告)号：DE602004014002D1

公开(公告)日：2008-07-03

申请号：DE602004014002

申请日：2004-12-10

Applicant: ESSILOR INT ,  IBM

Inventor： SCHMID HEINZ ,  MICHEL BRUNO ,  KLOTER URS ,  KELLER GERHARD ,  CANO JEAN-PAUL

IPC: B41F17/00 ,  B29C33/30 ,  B29C33/42 ,  B29C39/02 ,  B29C39/10 ,  B41F17/30

Abstract: A stamp for patterning onto a receiving surface (103) of an object (101) according to a defined pattern (P) comprises a stamping surface (21) of a resilient diaphragm (20). The stamping surface (21) is planar at rest. The pattern (P) is reproduced on the stamping surface (21) and the diaphragm (20) is affixed to a rigid body (13) along a peripheral edge, so that a middle part of the diaphragm (20) can move along a direction perpendicular to the stamping surface (21). The diaphragm (20) is more flexible near the peripheral edge than in the middle part. Then, the pattern (P) printed on a pseudo-spherical receiving surface (103) using the stamp exhibits few distortion.

公开(公告)号：AU2003256008A1

公开(公告)日：2004-03-29

申请号：AU2003256008

申请日：2003-08-28

Applicant: IBM

Inventor： BIETSCH ALEXANDER ,  DELAMARCHE EMMANUEL ,  MICHEL BRUNO ,  SCHMID HEINZ ,  WOLF HEIKO

IPC: B01J19/00 ,  B01L99/00 ,  B41K1/30 ,  B41M3/00 ,  C40B30/08 ,  C40B40/18 ,  C40B60/14 ,  G01N35/10 ,  H05K3/12

Abstract: A stamp for transferring a pattern to a substrate in the presence of a third medium, includes a permeable hydrophilic matrix for guiding excess third medium away from the surface of the stamp.