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公开(公告)号:JP2001005013A
公开(公告)日:2001-01-12
申请号:JP2000134736
申请日:2000-05-08
Applicant: IBM
IPC: C09J5/00 , C09K3/10 , G02F1/1339 , G02F1/1341 , H01S3/00
Abstract: PROBLEM TO BE SOLVED: To provide a means to mutually and tightly seal two substrates placed opposite to each other enclosing a fixed amount of a second material (e.g. a liquid crystal) in between without physically or chemically damaging the enclosed material. SOLUTION: The method contains processes for making a liquid crystal material 3 adhere to a central region of a substrate 1, making an epoxy material fillet 4a adhere along and to the periphery of the substrate 1 as a continuous loop so as to surround the liquid crystal material, placing a second glass substrate 2 on the first substrate 1 so as to be continuously brought into contact with the epoxy fillet 4a and subsequently hardening the fillet with curing or cross-linking. Preferably the epoxy fillet is hardened with scanning the epoxy fillet by an infrared or ultraviolet laser converged so as to avoid heating of the liquid crystal material.
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公开(公告)号:CA1259947A
公开(公告)日:1989-09-26
申请号:CA454199
申请日:1984-05-11
Applicant: IBM
IPC: H01L21/306 , C23C18/16 , C23F1/00 , C23F1/02 , C25D5/02 , C25D5/08 , C25F3/14 , H05K3/06 , H05K3/24 , C25F3/02
Abstract: This metal deposition/material removal technique modifies free-standing or submerged jet plating with an electromagnetic energy beam such as an intense laser beam, directed collinearly along the jet. Experiments were made to deposit gold contact areas on nickel plated beryllium-copper substrates used for microelectronic connectors. The deposits are found to be crack-free and dense, possessing excellent adhesion to the substrate. Deposition rates for 0.05 cm diameter gold spots are on the order of 10 micrometers per second. Also disclosed is a laser jet chemical treatment system wherein relative motion between a cathodically connected workpiece and a fluid jet is provided. The laser beam which is collinear with the jet, cooperates with it to enhance plating or etching rate on the surface of the workpiece.
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公开(公告)号:CA1171381A
公开(公告)日:1984-07-24
申请号:CA347879
申请日:1980-03-18
Applicant: IBM
Inventor: MELCHER ROBERT L , ROMANKIW LUBOMYR T , VON GUTFELD ROBERT J
IPC: H05K3/06 , B23K26/12 , C23F1/02 , C23F4/00 , C25F3/14 , H01L21/306 , H01L21/3213 , H05K3/22 , B23P1/00
Abstract: A method for high resolution maskless chemical and electrochemical machining is described. Preferential etching results from exposing those regions where machining is sought to an energy beam. Such exposures can increase the etching rate in the base of electrochemical machining by a factor of 103 to 104. Such enhancement is sufficient to make masking unnecessary.
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公开(公告)号:CA1097791A
公开(公告)日:1981-03-17
申请号:CA283250
申请日:1977-07-21
Applicant: IBM
Inventor: MELCHER ROBERT L , VON GUTFELD ROBERT J
Abstract: CLAMPED ACOUSTIC ELASTIC WAVE GENERATOR A pulse of energy including atomic, thermal or electromagnetic radiation produced by a source such as an electron or atomic beam, laser, electrical or optical means is applied to a generator. The generator includes a body of material adapted for acoustic vibration. An energy absorbing layer is in intimate acoustic contact with the body of material so that acoustic vibrations generated in the absorbing layer are transmitted to the body of material. The surface of the absorbing layer opposite to the body of material is acoustically clamped in position by a solid clamping medium.
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公开(公告)号:CA1085966A
公开(公告)日:1980-09-16
申请号:CA287342
申请日:1977-09-23
Applicant: IBM
Inventor: VON GUTFELD ROBERT J
IPC: G01J5/02 , G01J1/02 , G01J5/34 , G01K7/02 , H01L31/04 , H01L31/14 , H01L37/00 , H01L37/02 , H01L31/00 , G01J1/00
Abstract: MULTILAYERED SLANT-ANGLE THIN FILM ENERGY DETECTOR A detector of thermal energy is composed of an insulating substrate such as glass or sapphire coated with a thin film deposit of a slant-angle deposited metal preferably a transition element such as Ti, V, Cr, Co, Ni, Ta, W, U, Os, Ir, Pt and Mb exhibiting a transverse thermoelectric effect in response to a thermal energy gradient normal to the plane of the deposit. A layer of an electrical insulating material which is thermally conductive is deposited upon the thin film deposit, using materials such as SiO2, SiO, perylene, etc. Another thin film deposit of a slantangle film is deposited on top of the insulating material. A stack of alternate slant-angle thermoelectric elements and electrical insulating layers is formed to a depth at which the thermal gradient in the lowest slant-angle deposit is marginally advantageous. An input light, laser or other heat producing beam is applied to the upper layer of the stack. Alternatively, heat can also be apolied to the lower surface through a transparent substrate producing interfacial heating. Heat leaks into other film layers producing a substantial thermal gradient and hence, a thermoelectric transverse voltage in each of the metal films. The layers are interconnected electrically.
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公开(公告)号:CA1159790A
公开(公告)日:1984-01-03
申请号:CA348142
申请日:1980-03-21
Applicant: IBM
Inventor: MELCHER ROBERT L , VON GUTFELD ROBERT J
IPC: C25D5/00 , C25D5/02 , H01L21/288 , H01L21/768 , H05K3/24 , C25D5/48
Abstract: METHOD FOR LOCALLY ENHANCING ELECTROPLATING RATES A method for high resolution maskless electroplating is described. Preferential plating results from exposing those regions where enhanced plating is sought to a collimated energy beam. Such exposure can produce an enhancement in the plating rate of 103, which is sufficient to eliminate the necessity of masking the surface.
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公开(公告)号:CA1135871A
公开(公告)日:1982-11-16
申请号:CA336708
申请日:1979-10-01
Applicant: IBM
Inventor: CHAUDHARI PRAVEEN , KIESSLING JOHN B , PERLMAN DAVID J , TYNAN EUGENE E , VON GUTFELD ROBERT J
Abstract: METHOD OF BONDING WIRES TO PASSIVATED CHIP MICROCIRCUIT CONDUCTORS A wire is positioned in intimate contact with a microcircuit hip above a conductor line or pad on the chip. The line is protected by a thin film layer of passivating or insulating material deposited upon the chip. A short pulse, focussed, energy source such as a laser beam drills a hole through or on the edge of the wire, and also opens a hole drawn through the insulating material to expose the conductor line. Then energy is directed upon the portion of the wire surrounding the hole to melt metal from the wire down into the hole which coalesces with molten metal below to form an electrical and mechanical bond of the wire to the line. YO978-042
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公开(公告)号:CA1120656A
公开(公告)日:1982-03-30
申请号:CA347870
申请日:1980-03-18
Applicant: IBM
Inventor: BLUM SAMUEL E , KOVAC ZLATA , VON GUTFELD ROBERT J
Abstract: MASKLESS METHOD FOR ELECTROLESS PLATING PATTERNS A method for high resolution maskless electroless plating is described. Preferential plating results from exposing those regions where plating is sought to an energy beam to increase the plating rate by a factor of 103 to 104. This enhancement is sufficient to make masking unnecessary. YO979-021
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公开(公告)号:CA1039828A
公开(公告)日:1978-10-03
申请号:CA198072
申请日:1974-04-19
Applicant: IBM
Inventor: TYNAN EUGENE E , VON GUTFELD ROBERT J
Abstract: A light detector consisting of a thin film of metallic (or conducting) material having an induced anisotropy in conjunction with means for establishing a temperature gradient in the film in a direction normal to the plane of the film is disclosed. When thin films of molybdenum and tungsten are excited by a pulsed laser light at normal incidence to the film, transverse thermoelectric voltages are generated. Output voltages across a 50 ohm load of 10 millivolts have been observed for an incident laser pulse of approximately 1 KW. Wave lengths in the range of 0.46-1.06.mu.m and pulse widths of approximately 3 to 300 nanoseconds produce output voltages. A correlation between intrinsic film stress and output voltage indicates that stress (one of induced anisotropy) in the metal film introduced during deposition or externally induced anisotropy such as can be produced by a magnetic field in magnetic materials gives rise to a nonscalar absolute thermoelectric power even though the metal films are usually considered to be isotropic in their transport properties. The output from the detector, in terms of polarity, may be reversed by reversing the direction of light incidence. Also, the direction and magnitude of the output may be controlled by adjusting the position of the metallic film relative to a pair of contacts disposed in sliding relationship with the metallic film. While not necessary to the practice of the present invention, an electrically insulating substrate is preferably used to cause a better temperature gradient normal to the plane of the film. In general, the response time of the films is dependent on the laser pulse width.
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