公开(公告)号：WO03012867A2

公开(公告)日：2003-02-13

申请号：PCT/GB0203436

申请日：2002-07-26

Applicant: IBM ,  IBM UK

Inventor： ALCOE DAVID JAMES ,  COFFIN JEFFREY THOMAS ,  GAYNES MICHAEL ANTHONY ,  HAMEL HARVEY CHARLES ,  INTERRANTE MARIO ,  PETERSON BRENDA LEE ,  SHANNON MEGAN ,  SABLINSKI WILLIAM EDWARD ,  SPRING CHRISTOPHER TODD ,  STUTZMAN RANDALL JOSEPH ,  WEISMAN RENEE ,  ZITZ JEFFREY ALLEN

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/552 ,  H05K9/00 ,  H01L23/66

CPC classification number: H01L23/552 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/01087 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/3025 ,  H01L2924/00

Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

Abstract translation: 结合有EMI屏蔽的电子封装，特别是包含嵌入有接地带的半导体芯片载体结构的半导体器件，其适于减少用于高速开关电子封装的输出和事件EMI发射。

公开(公告)号：HU0401737A2

公开(公告)日：2004-12-28

申请号：HU0401737

申请日：2002-07-26

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  COFFIN JEFFREY THOMAS ,  GAYNES MICHAEL ANTHONY ,  HAMEL HARVEY CHARLES ,  INTERRANTE MARIO ,  PETERSON BRENDA LEE ,  SHANNON MEGAN ,  SABLINSKI WILLIAM EDWARD ,  SPRING CHRISTOPHER TODD ,  STUTZMAN RANDALL JOSEPH ,  WEISMAN RENEE ,  ZITZ JEFFREY ALLEN

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/552 ,  H05K9/00 ,  H01L23/66

Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

公开(公告)号：PL367099A1

公开(公告)日：2005-02-21

申请号：PL36709902

申请日：2002-07-26

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  COFFIN JEFFREY THOMAS ,  GAYNES MICHAEL ANTHONY ,  HAMEL HARVEY CHARLES ,  INTERRANTE MARIO ,  PETERSON BRENDA LEE ,  SHANNON MEGAN ,  SABLINSKI WILLIAM EDWARD ,  SPRING CHRISTOPHER TODD ,  STUTZMAN RANDALL JOSEPH ,  WEISMAN RENEE ,  ZITZ JEFFREY ALLEN

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/552 ,  H05K9/00

Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.

公开(公告)号：AU2002319480A1

公开(公告)日：2003-02-17

申请号：AU2002319480

申请日：2002-07-26

Applicant: IBM

Inventor： ALCOE DAVID JAMES ,  WEISMAN RENEE ,  INTERRANTE MARIO ,  COFFIN JEFFREY THOMAS ,  STUTZMAN RANDALL JOSEPH ,  GAYNES MICHAEL ANTHONY ,  SPRING CHRISTOPHER TODD ,  PETERSON BRENDA LEE ,  SABLINSKI WILLIAM EDWARD ,  SHANNON MEGAN ,  HAMEL HARVEY CHARLES ,  ZITZ JEFFREY ALLEN

IPC: H01L23/29 ,  H01L23/31 ,  H01L23/552 ,  H05K9/00

Abstract: Electronic packages incorporating EMI shielding, and particularly semiconductor devices which incorporate semiconductor chip-carrier structures having grounded bands embedded therein which are adapted to reduce outgoing and incident EMI emissions for high-speed switching electronic packages.