Abstract:
The present disclosure presents a chemical vapor deposition reactor having improved chemical utilization and cost efficiency. The wafer susceptors of the present disclosure may be used in a stackable configuration for processing many wafers simultaneously. The reactors of the present disclosure may be reverse-flow depletion mode reactors, which tends to provide uniform film thickness and a high degree of chemical utilization.
Abstract:
THIS DISCLOSURE ENABLES HIGH-PRODUCTIVITY FABRICATION OF SEMICONDUCTOR-BASED SEPARATION LAYERS (MADE OF SINGLE LAYER OR MULTI-LAYER POROUS SEMICONDUCTORS SUCH AS POROUS SILICON, COMPRISING SINGLE POROSITY OR MULTI-POROSITY LAYERS), OPTICAL REFLECTORS (MADE OF MULTI-LAYER/MULTI-POROSITY POROUS SEMICONDUCTORS SUCH AS POROUS SILICON), FORMATION OF POROUS SEMICONDUCTOR (SUCH AS POROUS SILICON) FOR ANTI-REFLECTION COATINGS, PASSIVATION LAYERS, AND MULTI-JUNCTION, MULTI-BAND-GAP SOLAR CELLS (FOR INSTANCE, BY FORMING A VARIABLE BAND GAP POROUS SILICON EMITTER ON A CRYSTALLINE SILICON THIN FILM OR WAFER-BASED SOLAR CELL). OTHER APPLICATIONS INCLUDE FABRICATION OF MEMS SEPARATION AND SACRIFICIAL LAYERS FOR DIE DETACHMENT AND MEMS DEVICE FABRICATION, MEMBRANE FORMATION AND SHALLOW TRENCH ISOLATION (STI) POROUS SILICON (USING POROUS SILICON FORMATION WITH AN OPTIMAL POROSITY AND ITS SUBSEQUENT OXIDATION). FURTHER THE DISCLOSURE IS APPLICABLE TO THE GENERAL FIELDS OF PHOTOVOLTAICS, MEMS, INCLUDING SENSORS AND ACTUATORS, STAND-ALONE, OR INTEGRATED WITH INTEGRATED SEMICONDUCTOR MICROELECTRONICS, SEMICONDUCTOR MICROELECTRONICS CHIPS AND OPTOELECTRONICS.
Abstract:
This disclosure presents manufacturing methods and apparatus designs for making TFSSs from both sides of a re -usable semiconductor template, thus effectively increasing the substrate manufacturing throughput and reducing the substrate manufacturing cost. This approach also reduces the amortized starting template cost per manufactured substrate (TFSS) by about a factor of 2 for a given number of template reuse cycles.
Abstract:
This disclosure enables high-productivity controlled fabrication of uniform porous semiconductor layers (made of single layer or multi-layer porous semiconductors such as porous silicon, comprising single porosity or multi-porosity layers). Some applications include fabrication of MEMS separation and sacrificial layers for die detachment and MEMS device fabrication, membrane formation and shallow trench isolation (STI) porous silicon (using porous silicon formation with an optimal porosity and its subsequent oxidation). Further, this disclosure is applicable to the general fields of photovoltaics, MEMS, including sensors and actuators, stand-alone, or integrated with integrated semiconductor microelectronics, semiconductor microelectronics chips and optoelectronics.
Abstract:
Mechanisms are disclosed by which a semiconductor wafer, silicon in some embodiments, is repeatedly used to serve as a template and carrier for fabricating high efficiency capable thin semiconductor solar cells substrates. Mechanisms that enable such repeated use of these templates at consistent quality and with high yield are disclosed.
Abstract:
This disclosure enables high-productivity fabrication of semiconductor-based separation layers (made of single layer or multi-layer porous semiconductors such as porous silicon, comprising single porosity or multi-porosity layers), optical reflectors (made of multi-layer/multi-porosity porous semiconductors such as porous silicon), formation of porous semiconductor (such as porous silicon) for anti-reflection coatings, passivation layers, and multi-junction, multi-band-gap solar cells (for instance, by forming a variable band gap porous silicon emitter on a crystalline silicon thin film or wafer-based solar cell). Other applications include fabrication of MEMS separation and sacrificial layers for die detachment and MEMS device fabrication, membrane formation and shallow trench isolation (STI) porous silicon (using porous silicon formation with an optimal porosity and its subsequent oxidation). Further the disclosure is applicable to the general fields of Photovoltaics, MEMS, including sensors and actuators, stand-alone, or integrated with integrated semiconductor microelectronics, semiconductor microelectronics chips and optoelectronics.