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1.发明申请
公开(公告)号：WO2007148358A1
公开(公告)日：2007-12-27
申请号：PCT/IT2006/000485
申请日：2006-06-23
Applicant: STMICROELECTRONICS S.R.L. , MAGNI, Pierangelo , BRIOSCHI, Roberto
Inventor： MAGNI, Pierangelo , BRIOSCHI, Roberto
IPC: B01L3/00
CPC classification number: B01L3/502707 , B01L2200/027 , B01L2200/10 , B01L2300/043 , B01L2300/0609 , B01L2300/0867 , B01L2300/123 , B01L2300/1805 , B01L2400/0481 , B01L2400/0622 , B01L2400/0638 , B01L2400/0644 , Y10T436/25 , Y10T436/2575
Abstract: In a microfluidic assembly (20), a microfluidic device (I1) is provided with a body (4) in which at least a first inlet (7) for loading a fluid to analyse and a buried area (8) in fluidic communication with the first inlet (7) are defined. An analysis chamber (10') is in fluidic communication with the buried area (8) and an interface cover (23) is coupled in a fluid-tight manner above the microfluidic device (I1) . The interface cover (23) is provided with a sealing portion (35) in correspondence to the analysis chamber (10')/ adapted to assume a first configuration, at rest, in which it leaves the analysis chamber (10') open, and a second configuration, as a consequence of a stress, in which it closes in a fluid-tight manner the same analysis chamber.
Abstract translation: 在微流体组件（20）中，微流体装置（I1）设置有主体（4），其中至少第一入口（7）用于装载待分析的流体和与该流体相通的埋入区域（8） 定义第一入口（7）。 分析室（10'）与掩埋区域（8）流体连通，并且界面盖（23）以流体密封的方式联接在微流体装置（I1）上方。 接口盖（23）设置有与分析室（10'）对应的适于呈现静止状态的第一配置（其离开分析室10'）的密封部分（35），以及 作为应力的结果的第二构造，其以不流体密封的方式封闭相同的分析室。
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2.发明公开MINIATURIZED LOAD SENSOR DEVICE HAVING LOW SENSITIVITY TO THERMO-MECHANICAL PACKAGING STRESS, IN PARTICULAR FORCE AND PRESSURE SENSOR 审中-公开小型化的负载传感器装置对热机械包装应力，特别是力和压力传感器具有低灵敏度
公开(公告)号：EP3252449A1
公开(公告)日：2017-12-06
申请号：EP16206884.5
申请日：2016-12-23
Applicant: STMicroelectronics S.r.l.
Inventor： CALTABIANO, Daniele , ABBASI GAVARTI, Mohammad , MURARI, Bruno , BRIOSCHI, Roberto , GIUSTI, Domenico
Abstract: A load-sensing device (10), arranged in a package (12) forming a chamber (24). The package (12) has a deformable substrate (21) configured, in use, to be deformed by an external force. A sensor unit (11) is in direct contact with the deformable substrate (21) and is configured to detect deformations of the deformable substrate. An elastic element (15) is arranged within of the chamber (24) and acts between the package (12) and the sensor unit (11) to generate, on the sensor unit, a force keeping the sensor unit in contact with the deformable substrate. For example, the deformable substrate is a base (21) of the package (12), and the elastic element is a metal lamina (15) arranged between the lid (22) of the package (12) and the sensor unit (11). The sensor unit (11) may be a semiconductor die integrating piezoresistors.
Abstract translation: 负载感测装置（10），其布置在形成腔室（24）的包装（12）中。 包装（12）具有可变形的基底（21），该基底在使用中被配置为通过外力而变形。 传感器单元（11）与可变形基板（21）直接接触并且被配置为检测可变形基板的变形。 弹性元件（15）布置在腔室（24）内并且作用在封装（12）和传感器单元（11）之间，以在传感器单元上产生保持传感器单元与可变形基底 。 例如，可变形衬底是封装（12）的基座（21），并且弹性元件是布置在封装（12）的盖（22）和传感器单元（11）之间的金属薄片（15） 。 传感器单元（11）可以是集成压敏电阻器的半导体管芯。
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3.发明公开
公开(公告)号：EP3065416A1
公开(公告)日：2016-09-07
申请号：EP15200515.3
申请日：2015-12-16
Applicant: STMicroelectronics S.r.l. , Stmicroelectronics (Malta) Ltd
Inventor： BRIOSCHI, Roberto , ADORNO, Silvia , FONK, Kenneth
CPC classification number: H04R1/086 , B81B7/0058 , B81B7/0061 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81B2207/07 , B81C1/00309 , B81C2203/0785 , H01L2224/48137 , H01L2224/48227 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/006
Abstract: A semiconductor integrated device (51, 81; 91), comprising: a package (50) defining an internal space (8) and having an acoustic-access opening (28; 98b) in acoustic communication with an environment external to the package (50); a MEMS acoustic transducer (21), housed in the internal space (8) and provided with an acoustic chamber (6) facing the acoustic-access opening (28; 98b); and a filtering module (52; 82; 96), which is designed to inhibit passage of contaminating particles having dimensions larger than a filtering dimension (d 1 ; d MAX ) and is set between the MEMS acoustic transducer (21) and the acoustic-access opening (28; 98b). The filtering module defines at least one direct acoustic path between the acoustic-access opening (28; 98b) and the acoustic chamber (6).
Abstract translation: 一种半导体集成电路器件（51，81; 91），包括：内部空间（8）的包装（50）定义和具有声进入开口（28; 98B），其与在环境所述封装外部的声通信（50 ）; 在内部空间（8）容纳并在声室设置有MEMS声学换能器（21）（6）的面向所述声 - 进入开口（28; 98B）; 和过滤模块（52; 82; 96），其被设计为抑制污染尺寸大于过滤尺寸大的颗粒通过（D 1; D MAX），并且被设置在MEMS声学换能器（21）和所述的声学之间 进入开口（28; 98B）。 该滤波模块定义声进入开口之间的至少一个直接声波路径（28; 98B）和所述声室（6）。
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公开(公告)号：EP3113509A1
公开(公告)日：2017-01-04
申请号：EP16175518.6
申请日：2016-06-21
Applicant: STMicroelectronics S.r.l. , Stmicroelectronics (Malta) Ltd
Inventor： BRIOSCHI, Roberto , GRITTI, Alex , FORMOSA, Kevin
CPC classification number: H04R1/04 , B81B7/0061 , B81B7/008 , B81B2201/0257 , B81B2203/0127 , B81B2207/012 , B81B2207/07 , H04R1/06 , H04R19/005 , H04R19/04 , H04R31/00 , H04R31/006 , H04R2201/003 , H04R2499/11
Abstract: A microelectromechanical microphone includes: a substrate (2); a sensor chip (5), integrating a microelectromechanical electroacoustic transducer (35); and a control chip (6) operatively coupled to the sensor chip (5). The sensor chip (5) and the control chip (6) are bonded to the substrate (2), and the sensor chip (5) in part overlies the control chip (6). The sensor chip (5) the has a first portion fixed to a face (6a) of the control chip (6) and comprises a transduction member (37) acoustically communicating with a sound port (11).
Abstract translation: 微电机麦克风包括：基板（2）; 传感器芯片（5），集成微机电电声换能器（35）; 以及可操作地耦合到所述传感器芯片（5）的控制芯片（6）。 传感器芯片（5）和控制芯片（6）结合到基板（2）上，并且传感器芯片（5）部分地覆盖在控制芯片（6）上。 传感器芯片（5）具有固定到控制芯片（6）的面（6a）的第一部分，并且包括与声音端口（11）声学连通的转导构件（37）。
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5.发明授权
公开(公告)号：EP3113510B1
公开(公告)日：2020-04-22
申请号：EP16175630.9
申请日：2016-06-22
Applicant: STMICROELECTRONICS S.r.l. , STMICROELECTRONICS (MALTA) LTD
Inventor： BRIOSCHI, Roberto
IPC: H04R19/00
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Patent Agency Ranking
公开(公告)号：EP3252449B1
公开(公告)日：2020-02-05
申请号：EP16206884.5
申请日：2016-12-23
Applicant: STMicroelectronics S.r.l.
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7.发明公开MULTI-DEVICE TRANSDUCER MODULE, APPARATUS INCLUDING THE TRANSDUCER MODULE AND METHOD OF MANUFACTURING THE TRANSDUCER MODULE 审中-公开多器件换能器模块，包括换能器模块的装置以及制造换能器模块的方法
公开(公告)号：EP3240306A1
公开(公告)日：2017-11-01
申请号：EP17162651.8
申请日：2017-03-23
Applicant: STMicroelectronics S.r.l.
Inventor： BRIOSCHI, Roberto , GHIDONI, Marco Omar
CPC classification number: H04R19/04 , B06B1/0292 , B81B7/04 , B81B2201/0235 , B81B2201/0242 , B81B2201/0257 , B81B2201/0264 , B81B2201/0292 , B81B2201/047 , B81B2207/012 , B81B2207/07 , B81C1/0023 , B81C2203/0792 , H01L2224/48091 , H01L2224/48137 , H01L2924/15151 , H04R1/44 , H04R3/005 , H04R7/06 , H04R19/005 , H04R31/003 , H04R31/006 , H04R2201/003 , H04R2499/11 , H01L2924/00014
Abstract: A multi-device module (61), comprising: a first substrate (23), which houses a first MEMS transducer (21, 1), designed to transduce a first environmental quantity into a first electrical signal, and an integrated circuit (22, 22'), coupled to the first MEMS transducer for receiving the first electrical signal; a second substrate (49), which houses a second MEMS transducer (41, 42), designed to transduce a second environmental quantity into a second electrical signal; and a flexible printed circuit (36), mechanically connected to the first and second substrates and electrically coupled to the integrated circuit and to the second MEMS transducer so that the second electrical signal flows, in use, from the second MEMS transducer to the integrated circuit.
Abstract translation: 1。一种多装置模块（61），包括：第一基板（23），其容纳被设计成将第一环境量转换成第一电信号的第一MEMS换能器（21,1）;以及集成电路 耦合到所述第一MEMS换能器，用于接收所述第一电信号; 第二衬底（49），其容纳第二MEMS换能器（41,42），所述第二MEMS换能器设计成将第二环境量转换成第二电信号; 和柔性印刷电路（36），所述柔性印刷电路机械连接到所述第一和第二基板并且电耦合到所述集成电路和所述第二MEMS换能器，使得所述第二电信号在使用中从所述第二MEMS换能器流到所述集成电路 。
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8.发明公开MIRROR GROUP, IN PARTICULAR FOR A PICOPROJECTOR, COMPRISING MICROMIRRORS MADE USING THE MEMS TECHNOLOGY 审中-公开MIRROR GROUP，特别是PICOPROJECTOR，包括使用MEMS技术制造的微反射镜
公开(公告)号：EP3206071A1
公开(公告)日：2017-08-16
申请号：EP16194664.5
申请日：2016-10-19
Applicant: STMicroelectronics S.r.l.
Inventor： BRIOSCHI, Roberto
IPC: G02B26/08
CPC classification number: G02B26/101 , B81B7/008 , B81B2201/042 , B81C2203/07 , G02B26/0833 , G02B26/0841
Abstract: The mirror group (30) is formed by a monolithic frame (31) bent along a bending line (C) and including a first and a second supporting portions (32, 33) carrying, respectively, a first and a second chips forming two micromirrors made using MEMS technology. The first and second supporting portions (32, 33) are arranged on opposite sides of the bending line of the frame (C), angularly inclined with respect to each other. The mirror group is obtained by separating a shaped metal tape carrying a plurality of frames, having flexible electric connection elements. After attaching the chips, the frames are precut, bent along the bending line, and separated.
Abstract translation: 镜组（30）由沿着弯曲线（C）弯曲并包括第一和第二支撑部分（32,33）的整体框架（31）形成，所述第一和第二支撑部分分别承载形成两个微镜的第一和第二芯片 使用MEMS技术制造。 第一支撑部分和第二支撑部分（32,33）布置在框架（C）的弯曲线的相对侧上，相对于彼此成角度地倾斜。 镜组通过分离带有多个框架的成形金属带而获得，所述金属带具有柔性电连接元件。 在连接芯片后，框架被预切，沿弯曲线弯曲并分离。
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公开(公告)号：EP3239096A3
公开(公告)日：2018-01-03
申请号：EP17162672.4
申请日：2017-03-23
Applicant: STMicroelectronics S.r.l.
Inventor： GHIDONI, Marco Omar , BRIOSCHI, Roberto
CPC classification number: B81B7/02 , B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81B2207/05 , B81B2207/07 , B81B2207/092 , B81B2207/096 , B81C1/0023 , H04R1/04 , H04R1/406 , H04R19/005 , H04R2201/003
Abstract: A transducer module (10), comprising: a supporting substrate (23), having a first side (23a) and a second side (23b); a cap (27), which extends over the first side of the supporting substrate and defines therewith a first chamber (108) and a second chamber (109) internally isolated from one another; a first transducer (1) in the first chamber (8); a second transducer (42) in the second chamber (18); and a control chip (22), which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.
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10.发明公开MULTI-CHAMBER TRANSDUCER MODULE, APPARATUS INCLUDING THE MULTI-CHAMBER TRANSDUCER MODULE AND METHOD OF MANUFACTURING THE MULTI-CHAMBER TRANSDUCER MODULE 审中-公开多室传感器模块，包括多室传感器模块的装置以及制造多室传感器模块的方法
公开(公告)号：EP3239096A2
公开(公告)日：2017-11-01
申请号：EP17162672.4
申请日：2017-03-23
Applicant: STMicroelectronics S.r.l.
Inventor： GHIDONI, Marco Omar , BRIOSCHI, Roberto
CPC classification number: B81B7/02 , B81B7/0061 , B81B2201/0257 , B81B2207/012 , B81B2207/05 , B81B2207/07 , B81B2207/092 , B81B2207/096 , B81C1/0023 , H04R1/04 , H04R1/406 , H04R19/005 , H04R2201/003
Abstract: A transducer module (10), comprising: a supporting substrate (23), having a first side (23a) and a second side (23b); a cap (27), which extends over the first side of the supporting substrate and defines therewith a first chamber (108) and a second chamber (109) internally isolated from one another; a first transducer (1) in the first chamber (8); a second transducer (42) in the second chamber (18); and a control chip (22), which extends at least partially in the first chamber and/or in the second chamber and is functionally coupled to the first and second transducers for receiving, in use, the signals transduced by the first and second transducers.
Abstract translation: 1。一种换能器模块（10），包括：具有第一侧面（23a）和第二侧面（23b）的支撑衬底（23）; （27），其在支撑基板的第一侧上延伸并且与其一起限定彼此在内部彼此隔离的第一室（108）和第二室（109）;以及盖， 第一腔室（8）中的第一换能器（1）; 第二腔室（18）中的第二换能器（42）; 和控制芯片（22），其至少部分地在第一腔室和/或第二腔室中延伸，并功能性地耦合到第一和第二换能器，以在使用中接收由第一和第二换能器转换的信号。
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