Abstract:
An integrated magnetoresistive device, where a substrate (17) of semiconductor material is covered, on a first surface (19), by an insulating layer (18). A magnetoresistor (26) of ferromagnetic material extends in the insulating layer and defines a sensitivity plane of the sensor. A concentrator (34) of ferromagnetic material including at least one arm (34a), extending in a transversal direction to the sensitivity plane and vertically offset to the magnetoresistor (26). In this way, magnetic flux lines directed perpendicularly to the sensitivity plane are concentrated and deflected so as to generate magnetic-field components directed in a parallel direction to the sensitivity plane.
Abstract:
A packaged electronic system having a support (55) formed by an insulating organic substrate housing a buried conductive region (56) that is floating. A first die (51) is fixed to the support and carries, on a first main surface, a first die contact region (67) capacitively coupled to a first portion of the buried conductive region. A second die (52) is fixed to the support and carries, on a first main surface, a second die contact region (67) capacitively coupled to a second portion of the buried conductive region. A packaging mass (77) encloses the first die (51), the second die (52), the first die contact region, the second die contact region, and, at least partially, the support (55).
Abstract:
A MEMS triaxial magnetic sensor device (51) is provided with a sensing structure (2) having: a substrate (6); an outer frame (4), which internally defines a window (5) and is elastically coupled to first anchorages (7) fixed with respect to the substrate by means of first elastic elements (8); a mobile structure (10) arranged in the window, suspended above the substrate, which is elastically coupled to the outer frame by second elastic elements (12) and carries a conductive path (P) for flow of an electric current (I); and an elastic arrangement (22, 24) operatively coupled to the mobile structure. The mobile structure performs, due to the first and second elastic elements and of the arrangement of elastic elements, a first sensing movement in response to Lorentz forces originating from a first magnetic-field component (B x ), a second sensing movement in response to Lorentz forces originating from a second magnetic-field component (B y ), and a third sensing movement in response to Lorentz forces originating from a third magnetic-field component (B z ); the first, second, and third sensing movements are distinct and decoupled from one another.
Abstract:
An electrode structure (1) comprising: a pad (3) of conductive material; and a conductive strip (5) having a first end (5a) physically and electrically coupled to the pad (3), the electrode structure (1) being characterized in that the pad (3) comprises an annular element (7) internally defining a through opening (13), and in that the first end (5a) of the conductive strip (5) is physically and electrically coupled to the annular element (7) by a transition region (19) so that, when the conductive strip (5) undergoes expansion by the thermal effect, a stress spreads from the conductive strip (5) to the annular element (7) by the transition region (19). Main figure: Figure 2B
Abstract:
A MEMS actuator (100) including a monolithic body (101) of semiconductor material, including a supporting portion (102) of semiconductor material, orientable with respect to a first and to a second rotation axis (A, B), transverse to each other; a first frame (104) of semiconductor material with a hexagonal shape, coupled to the supporting portion through first deformable elements (115) configured to control a rotation of the supporting portion about the first rotation axis (A); and a second frame (108) of semiconductor material with a regular quadrangular shape, coupled to the first frame by second deformable elements (116), coupled between the first and the second frames and configured to control a rotation of the supporting portion about the second rotation axis (B). The first and the second deformable elements carry respective piezoelectric actuation elements (150).
Abstract:
MEMS device (21; 61; 91; 101) including: a semiconductor support body (22) having a first cavity (24); a membrane (26; 56; 106) including a peripheral portion, fixed to the support body (22), and a suspended portion; a first deformable structure (45; 68; 98) at a distance from a central part of the suspended portion of the membrane (26; 56; 106); a second deformable structure (44; 66; 96) laterally offset relative to the first deformable structure (45; 68; 98) towards the peripheral portion of the membrane (26; 56; 106); and a projecting region (40) fixed under the membrane (26; 56; 106); and wherein the second deformable structure (44; 66; 96) is deformable so as to translate the central part of the suspended portion of the membrane (26; 56; 106) along a first direction; and wherein the first deformable structure (45; 68; 98) is deformable so as to translate the central part of the suspended portion of the membrane (26; 56; 106) along a second direction.
Abstract:
An integrated AMR magnetoresistive sensor (20) having a magnetoresistor (21), a set/reset coil (22), and a shielding region (23) arranged on top of each other, with the set/reset coil (22) arranged between the magnetoresistor and the shielding region. The magnetoresistor (21) is formed by a magnetoresistive strip (24) of an elongated shape having a length in a first direction (X) parallel to the preferential magnetization direction (EA) and a width in a second direction (Y) perpendicular to the first direction. The set/reset coil (22) has at least one stretch (34a, 34b) extending transversely to the magnetoresistive strip. The shielding region (23) is a ferromagnetic material and has a width in the second direction (Y) greater than the width of the magnetoresistive strip (24) so as to attenuate the external magnetic field (H) traversing the magnetoresistive strip (24) and increasing the sensitivity scale of the magnetoresistive sensor.