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公开(公告)号：CN105637405B
公开(公告)日：2018-06-12
申请号：CN201480057389.1
申请日：2014-11-07
Applicant: 住友精密工业株式会社
IPC: G02B26/08 , B81C1/00 , H01L21/3065
CPC classification number: B81C1/00492 , B81B3/0086 , B81B2201/042 , B81B2203/0136 , B81C1/00404 , B81C1/00603 , B81C2201/0102 , B81C2201/0132 , B81C2201/0198 , G02B26/0841
Abstract: 在从第一硅层(210)侧对SOI基板(200)进行蚀刻的第一蚀刻工序中，将第一结构体中的由第一硅层(210)所构成的部分形成为具有比最终形状还大的形状的预结构。在将最终掩模(390)形成在SOI基板(200)的第二硅层(230)侧的掩模形成工序中，将与第一结构体的最终形状对应的第一掩模(391)形成为布置在预结构内。在从第二硅层(230)侧对SOI基板(200)进行蚀刻的第二蚀刻工序中，通过利用第一掩模(391)对第二硅层(230)和预结构进行蚀刻，从而形成第一结构体的最终形状。
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公开(公告)号：CN105161437B
公开(公告)日：2017-12-08
申请号：CN201510598724.5
申请日：2015-09-18
Applicant: 北京工业大学
CPC classification number: H01L21/67028 , B81C1/00928 , B81C3/001 , B81C3/002 , B81C2201/0102 , B81C2201/0128 , B81C2201/0133 , B81C2201/019 , B81C2203/051 , H01L21/68
Abstract: 等离子体辅助的玻璃或石英芯片的微结构对准及预键合方法，属于芯片微加工及键合技术。其步骤如下：完全去除玻璃或石英芯片光胶层及铬层，使用洗洁精及大量超纯水充分清洗表面。利用等离子体清洗器进行表面清洗及活化，使表面具有高亲水性；无水条件下，使用显微镜观察，移动清洗后的基片及盖片，完成精确对准。在边缘缝隙滴入极少量超纯水进行粘合，充分施压挤出多余水分后，依靠等离子体清洗器的真空功能排出芯片中的全部水分，完成玻璃或石英芯片的微结构对准及预键合。进一步采用热键合的方法完成芯片的永久键合。该方法使得对准及预键合，整体操作时间可在30min内完成。快速高效、实施简便、操作安全、适用广泛。
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公开(公告)号：CN105637405A
公开(公告)日：2016-06-01
申请号：CN201480057389.1
申请日：2014-11-07
Applicant: 住友精密工业株式会社
IPC: G02B26/08 , B81C1/00 , H01L21/3065
CPC classification number: B81C1/00492 , B81B3/0086 , B81B2201/042 , B81B2203/0136 , B81C1/00404 , B81C1/00603 , B81C2201/0102 , B81C2201/0132 , B81C2201/0198 , G02B26/0841
Abstract: 在从第一硅层(210)侧对SOI基板(200)进行蚀刻的第一蚀刻工序中，将第一结构体中的由第一硅层(210)所构成的部分形成为具有比最终形状还大的形状的预结构。在将最终掩模(390)形成在SOI基板(200)的第二硅层(230)侧的掩模形成工序中，将与第一结构体的最终形状对应的第一掩模(391)形成为布置在预结构内。在从第二硅层(230)侧对SOI基板(200)进行蚀刻的第二蚀刻工序中，通过利用第一掩模(391)对第二硅层(230)和预结构进行蚀刻，从而形成第一结构体的最终形状。
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公开(公告)号：CN106754247A
公开(公告)日：2017-05-31
申请号：CN201611139705.7
申请日：2016-12-12
Applicant: 中国科学院微电子研究所
CPC classification number: C12M1/00 , B81C1/00444 , B81C1/005 , B81C2201/0101 , B81C2201/0102 , B81C2201/0111
Abstract: 本发明属于微纳加工技术领域，公开了一种托盘及其加工工艺，加工工艺包括以下步骤：绘制版图，版图上孔洞的尺寸与观测样本的尺寸相匹配；使用版图对石英基片进行曝光；对石英基片进行显影、定影处理；沉积金属铬；去除光刻胶以使与版图的孔洞对应部位的金属铬被剥离；以金属铬为掩模，在石英基片上刻蚀形成孔洞；去除石英基片上残余的金属铬。托盘采用石英基片构成，石英基片上设置有孔洞，孔洞的尺寸与观测样本的尺寸相匹配。本发明解决了现有技术中生物样品观测时使用多个或不同规格的样品载体，导致样品容易产生混淆且检测成本较高的问题。本发明达到了有效提高试验效率和针对性、降低检测成本的技术效果。
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公开(公告)号：CN105161437A
公开(公告)日：2015-12-16
申请号：CN201510598724.5
申请日：2015-09-18
Applicant: 北京工业大学
CPC classification number: H01L21/67028 , B81C1/00928 , B81C3/001 , B81C3/002 , B81C2201/0102 , B81C2201/0128 , B81C2201/0133 , B81C2201/019 , B81C2203/051 , H01L21/68 , H01L21/682 , H01L24/03 , H01L24/04 , H01L2221/67
Abstract: 等离子体辅助的玻璃或石英芯片的微结构对准及预键合方法，属于芯片微加工及键合技术。其步骤如下：完全去除玻璃或石英芯片光胶层及铬层，使用洗洁精及大量超纯水充分清洗表面。利用等离子体清洗器进行表面清洗及活化，使表面具有高亲水性；无水条件下，使用显微镜观察，移动清洗后的基片及盖片，完成精确对准。在边缘缝隙滴入极少量超纯水进行粘合，充分施压挤出多余水分后，依靠等离子体清洗器的真空功能排出芯片中的全部水分，完成玻璃或石英芯片的微结构对准及预键合。进一步采用热键合的方法完成芯片的永久键合。该方法使得对准及预键合，整体操作时间可在30min内完成。快速高效、实施简便、操作安全、适用广泛。
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Patent Agency Ranking
公开(公告)号：US11858809B2
公开(公告)日：2024-01-02
申请号：US17339886
申请日：2021-06-04
Applicant: TAIYUAN UNIVERSITY OF TECHNOLOGY
Inventor： Jingwei Zhao , Tao Wang , Linan Ma , Qingxue Huang
CPC classification number: B81C1/00071 , B08B7/028 , B23K11/11 , B23P2700/12 , B81C2201/0102 , B81C2201/013 , B81C2900/00 , Y10T29/301 , Y10T29/303 , Y10T29/49771
Abstract: The invention belongs to the technical field of metal micro-forming, and in particular relates to a method for inflating micro-channels. The present invention is aimed at the problems of low process flexibility, single product type, and non-closed structure of the micro-channel when preparing metal micro-channels by micro-plastic forming of ultra-thin metal strips. The present invention uses a method combining numerical simulation and bond rolling experiment to analyze the effect of the hydrogen pressure and bond strength of the metal composite ultra-thin strip after bond rolling on the pore diameter of the micro-channel, and the corresponding relationship between the micro-channel pore diameter and the titanium hydride content, heating temperature, and bond strength of the metal composite ultra-thin strip is obtained.
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公开(公告)号：US20160202473A1
公开(公告)日：2016-07-14
申请号：US15077105
申请日：2016-03-22
Applicant: SUMITOMO PRECISION PRODUCTS CO., LTD.
Inventor： Ryohei UCHINO , Gen MATSUOKA
CPC classification number: B81C1/00492 , B81B3/0086 , B81B2201/042 , B81B2203/0136 , B81C1/00404 , B81C1/00603 , B81C2201/0102 , B81C2201/0132 , B81C2201/0198 , G02B26/0841
Abstract: A mirror device includes a frame body, a mirror configured to tilt about a Y-axis with respect to the frame body, a fixed inner comb electrode including a plurality of electrode fingers arranged in the arrangement direction along the Y-axis and provided at the frame body, and a movable inner comb electrode including a plurality of electrode fingers arranged in the arrangement direction and provided at the mirror, the electrodes fingers of the fixed inner comb electrode and the movable inner comb electrode being alternately arranged. The mirror includes a mirror body and an extension extending from the mirror body. Some of the electrode fingers of the movable inner comb electrode are provided at the mirror body, and another electrode fingers of the movable inner comb electrode are provided at the extension.
Abstract translation: 反射镜装置包括框架体，配置成相对于框架体围绕Y轴倾斜的反射镜，固定的内梳状电极，包括沿着Y轴布置在排列方向上的多个电极指， 框体和可动内梳状电极，其包括沿着排列方向布置并设置在反射镜处的多个电极指，固定内梳电极和可移动内梳电极的电极指交替布置。 镜子包括镜体和从镜体延伸的延伸部分。 可动内梳电极的一些电极指设置在镜体上，可移动内梳电极的另一电极指在延伸部处设置。
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公开(公告)号：US20230271825A1
公开(公告)日：2023-08-31
申请号：US17923648
申请日：2020-06-28
Inventor： Quanshui ZHENG , Xiaojian XIANG
CPC classification number: B81C1/00357 , B81B7/02 , B81B2201/038 , B81B2203/04 , B81C2201/0102 , B81C2201/0132 , B81C2201/014 , B81C2203/032 , B81C2203/0136 , B81C2201/0181
Abstract: Provided is an atomic-smooth device with a microstructure. The device includes, from the bottom to top, a substrate, a bonding material, a second dielectric layer on the substrate, the microstructure, and a first dielectric layer, where a surface of the first dielectric layer is an atomic-smooth surface. Further provided is a method for preparing an atomic-smooth device with a microstructure to effectively avoid pits or burrs generated when the existing microstructure is machined.
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公开(公告)号：US11655144B2
公开(公告)日：2023-05-23
申请号：US17604444
申请日：2021-04-28
Applicant: Jiangsu University
Inventor： Jian Li , Fanlin Zeng , Lamei Wang , Rao Fu , Gang Liu , Jie Luo
IPC: B81C1/00
CPC classification number: B81C1/00031 , B81C1/00047 , B81C1/00055 , B81C1/00063 , B81C1/00071 , B81C1/00079 , B81C1/00103 , B81C1/00119 , B81C1/00388 , B81C1/00444 , B81C1/00531 , B81C2201/0102 , B81C2201/0132
Abstract: The present invention provides a method for preparing a micro-cavity array surface with an inclined smooth bottom surface based on an air molding method. The method includes: preparing a micro-cavity array surface; preparing an auxiliary microstructure polymer template, and performing plasma treatment on the auxiliary microstructure polymer template; uniformly spreading a layer of a liquid polymer film to be formed on the auxiliary microstructure polymer template subjected to the plasma treatment; placing a gap bead in an empty position on the micro-cavity array surface; placing the auxiliary microstructure polymer template spread with the liquid polymer film on the gap bead on the micro-cavity array surface, maintaining this state, and feeding the auxiliary microstructure polymer template into a vacuum drying oven; and heating and solidifying the liquid polymer film, and separating the micro-cavity array surface to obtain the micro-cavity array surface with the inclined smooth bottom surface.
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公开(公告)号：US09842749B2
公开(公告)日：2017-12-12
申请号：US15324670
申请日：2015-11-17
Applicant: Beijing University of Technology
Inventor： Guangsheng Guo , Siyu Wang , Qiaosheng Pu , Xiayan Wang
CPC classification number: H01L21/67028 , B81C1/00928 , B81C3/001 , B81C3/002 , B81C2201/0102 , B81C2201/0128 , B81C2201/0133 , B81C2201/019 , B81C2203/051 , H01L21/68
Abstract: The plasma-assisted method of precise alignment and pre-bonding for microstructure of glass and quartz microchip belongs to micromachining and bonding technologies of the microchip. The steps of which are as follows: photoresist and chromium layers on glass or quartz microchip are completely removed followed by sufficient cleaning of the surface with nonionic surfactant and quantities of ultra-pure water. Then the surface treatment is proceeded for an equipping surface with high hydrophily with the usage of plasma cleaning device. Under the drying condition, the precise alignment is accomplished through moving substrate and cover plate after being washed with the help of microscope observation. Further on, to achieve precise alignment and pre-bonding of the microstructure of glass and quartz microchip, a minute quantity of ultrapure water is instilled into a limbic crevice for adhesion, and entire water is completely wiped out by vacuum drying following sufficient squeezing. Based on the steps above, it is available to achieve permanent bonding by further adopting thermal bonding method. In summary, it takes within 30 min to finish the whole operation of precise alignment and pre-bonding by this method. Besides, this method is of great promise because of its speediness, efficiency, easy maneuverability, operational safety and wide applications.
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